Membership
Tour
Register
Log in
Frank T. Jones III
Follow
Person
Austin, TX, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Dual-flag stacked die package
Patent number
9,379,048
Issue date
Jun 28, 2016
Semiconductor Components Industries, LLC
Frank Tim Jones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
8,384,206
Issue date
Feb 26, 2013
Semiconductor Components Industries, LLC
Stephen St. Germain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a semiconductor package and structure therefor
Patent number
7,935,575
Issue date
May 3, 2011
Semiconductor Components Industries, LLC
Stephen St. Germain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package including a polymer encapsulated die
Patent number
6,093,972
Issue date
Jul 25, 2000
Motorola, Inc.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package including a polymer encapsulated die, and m...
Patent number
5,895,229
Issue date
Apr 20, 1999
Motorola, Inc.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for providing alpha particle protection for an integrated ci...
Patent number
4,468,411
Issue date
Aug 28, 1984
Motorola, Inc.
James W. Sloan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DUAL-FLAG STACKED DIE PACKAGE
Publication number
20140239472
Publication date
Aug 28, 2014
Frank Tim Jones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20110169152
Publication date
Jul 14, 2011
STEPHEN ST. GERMAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A SEMICONDUCTOR PACKAGE AND STRUCTURE THEREFOR
Publication number
20090250794
Publication date
Oct 8, 2009
STEPHEN ST. GERMAIN
H01 - BASIC ELECTRIC ELEMENTS