Membership
Tour
Register
Log in
Frank Truong
Follow
Person
Gilbert, AZ, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Capacitors with nanoislands on conductive plates
Patent number
11,855,125
Issue date
Dec 26, 2023
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having conductive structures with differ...
Patent number
11,737,208
Issue date
Aug 22, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic material having coated ferromagnetic filler particles
Patent number
11,728,077
Issue date
Aug 15, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
Patent number
11,728,265
Issue date
Aug 15, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded multi-die interconnect bridge having a substrate with cond...
Patent number
11,688,692
Issue date
Jun 27, 2023
Intel Corporation
Praneeth Kumar Akkinepally
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric film with pressure sensitive microcapsules of adhesion p...
Patent number
11,571,876
Issue date
Feb 7, 2023
Intel Corporation
Praneeth Akkinepally
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Package architecture utilizing photoimageable dielectric (PID) for...
Patent number
11,574,874
Issue date
Feb 7, 2023
Intel Corporation
Robert A. May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual side de-bonding in component carriers using photoablation
Patent number
11,462,432
Issue date
Oct 4, 2022
Intel Corporation
Frank Truong
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Electronic device including a substrate having interconnects
Patent number
11,348,865
Issue date
May 31, 2022
Intel Corporation
Praneeth Akkinepally
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-integrated vertical capacitors and methods of assembling same
Patent number
11,296,186
Issue date
Apr 5, 2022
Intel Corporation
Brandon C Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density package substrate formed with dielectric bi-layer
Patent number
11,276,634
Issue date
Mar 15, 2022
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded multi-die interconnect bridge having a molded region with...
Patent number
11,233,009
Issue date
Jan 25, 2022
Intel Corporation
Praneeth Kumar Akkinepally
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic material having coated ferromagnetic filler particles
Patent number
11,158,444
Issue date
Oct 26, 2021
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-integrated vertical capacitors and methods of assembling same
Patent number
10,546,916
Issue date
Jan 28, 2020
Intel Corporation
Brandon C Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Build-up high-aspect ratio opening
Patent number
10,111,338
Issue date
Oct 23, 2018
Intel Corporation
Frank Truong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Raster-planarized substrate interlayers and methods of planarizing...
Patent number
10,068,776
Issue date
Sep 4, 2018
Intel Corporation
Frank Truong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
Publication number
20230345621
Publication date
Oct 26, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER WITH A GLASS CORE THAT INCLUDES OPENINGS AND THROUGH GLA...
Publication number
20230187331
Publication date
Jun 15, 2023
Intel Corporation
Bainye Francoise ANGOUA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...
Publication number
20220093515
Publication date
Mar 24, 2022
Intel Corporation
Praneeth Kumar Akkinepally
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC MATERIAL HAVING COATED FERROMAGNETIC FILLER PARTICLES
Publication number
20220005638
Publication date
Jan 6, 2022
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...
Publication number
20210305163
Publication date
Sep 30, 2021
Intel Corporation
Praneeth Kumar Akkinepally
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR...
Publication number
20210134727
Publication date
May 6, 2021
Robert A. May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING A SUBSTRATE
Publication number
20210098356
Publication date
Apr 1, 2021
Praneeth Akkinepally
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITORS WITH NANOISLANDS ON CONDUCTIVE PLATES
Publication number
20210066447
Publication date
Mar 4, 2021
Intel Corporation
Srinivas PIETAMBARAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
Publication number
20200253037
Publication date
Aug 6, 2020
Intel Corporation
Brandon C. Marin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE-INTEGRATED VERTICAL CAPACITORS AND METHODS OF ASSEMBLING SAME
Publication number
20200144359
Publication date
May 7, 2020
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE DEPOSITION OF EMBEDDED THIN-FILM RESISTORS FOR SEMICONDUC...
Publication number
20200083164
Publication date
Mar 12, 2020
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY PACKAGE SUBSTRATE FORMED WITH DIELECTRIC BI-LAYER
Publication number
20200075473
Publication date
Mar 5, 2020
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-INTEGRATED VERTICAL CAPACITORS AND METHODS OF ASSEMBLING SAME
Publication number
20200006468
Publication date
Jan 2, 2020
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC FILM WITH PRESSURE SENSITIVE MICROCAPSULES OF ADHESION P...
Publication number
20190389179
Publication date
Dec 26, 2019
Intel Corporation
Praneeth AKKINEPALLY
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
DUAL SIDE DE-BONDING IN COMPONENT CARRIERS USING PHOTOABLATION
Publication number
20190287841
Publication date
Sep 19, 2019
Intel Corporation
Frank Truong
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
MAGNETIC MATERIAL HAVING COATED FERROMAGNETIC FILLER PARTICLES
Publication number
20190252102
Publication date
Aug 15, 2019
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUILD-UP HIGH-ASPECT RATIO OPENING
Publication number
20180270953
Publication date
Sep 20, 2018
Intel Corporation
Frank Truong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR