Frank Yu

Person

Chung Ho, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with three dimensional thermal pad
- Patent number 11,081,428
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Stanley Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixing apparatus for mixing bonding adhesive at die bonder before d...
- Patent number 9,272,302
- Issue date Mar 1, 2016
- Texas Instruments Incorporated
- Frank Yu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Mixing bonding adhesive at die bonder before dispense
- Patent number 8,668,794
- Issue date Mar 11, 2014
- Texas Instruments Incorporated
- Frank Yu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Exposed die package for direct surface mounting
- Patent number 8,470,644
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die package for direct surface mounting
- Patent number 8,304,871
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination resistant packaged die having support and shaped die h...
- Patent number 8,058,706
- Issue date Nov 15, 2011
- Texas Instruments Incorporated
- Chien-Te Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mold lock on heat spreader
- Patent number 8,039,955
- Issue date Oct 18, 2011
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD
- Publication number 20210043548
- Publication date Feb 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Stanley Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixing Apparatus for Mixing Bonding Adhesive at Die Bonder Before D...
- Publication number 20130298827
- Publication date Nov 14, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Exposed Die Package for Direct Surface Mounting
- Publication number 20130034937
- Publication date Feb 7, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING
- Publication number 20120256306
- Publication date Oct 11, 2012
- TEXAS INSTRUMENTS INCORPORATED
- FRANK YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXING BONDING ADHESIVE AT DIE BONDER BEFORE DISPENSE
- Publication number 20120199285
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DIE BONDER INCLUDING AUTOMATIC BOND LINE THICKNESS MEASUREMENT
- Publication number 20120202300
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AI EPOXY ADJUSTMENT
- Publication number 20120040477
- Publication date Feb 16, 2012
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION RESISTANT PACKAGED DIE HAVING SUPPORT AND SHAPED DIE H...
- Publication number 20110057296
- Publication date Mar 10, 2011
- TEXAS INSTRUMENTS INCORPORATED
- CHIEN-TE FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD LOCK ON HEAT SPREADER
- Publication number 20100283142
- Publication date Nov 11, 2010
- Chien-Te FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH LAMINATED INTERPOSING LAYER
- Publication number 20090236715
- Publication date Sep 24, 2009
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus to dispense adhesive for semiconductor packaging
- Publication number 20080073028
- Publication date Mar 27, 2008
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Electronic device with three dimensional thermal pad

Mixing apparatus for mixing bonding adhesive at die bonder before d...

Mixing bonding adhesive at die bonder before dispense

Exposed die package for direct surface mounting

Exposed die package for direct surface mounting

Delamination resistant packaged die having support and shaped die h...

Mold lock on heat spreader

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD

Mixing Apparatus for Mixing Bonding Adhesive at Die Bonder Before D...

Exposed Die Package for Direct Surface Mounting

EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING

MIXING BONDING ADHESIVE AT DIE BONDER BEFORE DISPENSE

DIE BONDER INCLUDING AUTOMATIC BOND LINE THICKNESS MEASUREMENT

AI EPOXY ADJUSTMENT

DELAMINATION RESISTANT PACKAGED DIE HAVING SUPPORT AND SHAPED DIE H...

MOLD LOCK ON HEAT SPREADER

SEMICONDUCTOR PACKAGE STRUCTURE WITH LAMINATED INTERPOSING LAYER

Methods and apparatus to dispense adhesive for semiconductor packaging