Fritz Redeker

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for atomic layer deposition
- Patent number 9,359,673
- Issue date Jun 7, 2016
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled ambient system for interface engineering
- Patent number 9,117,860
- Issue date Aug 25, 2015
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration scheme to lower overall dielectric constant in...
- Patent number 9,076,844
- Issue date Jul 7, 2015
- Lam Research Corporation
- Nicolas Bright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning solution formulations for substrates
- Patent number 9,058,975
- Issue date Jun 16, 2015
- Lam Research Corporation
- Artur Kolics
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Devices for metallization
- Patent number 9,006,893
- Issue date Apr 14, 2015
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization mixtures and electronic devices
- Patent number 8,970,027
- Issue date Mar 3, 2015
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for barrier interface preparation of copper interconnect
- Patent number 8,916,232
- Issue date Dec 23, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluid handling system for wafer electroless plating and associated...
- Patent number 8,844,461
- Issue date Sep 30, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a copper surface for selectiv...
- Patent number 8,771,804
- Issue date Jul 8, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a silicon-type surface for se...
- Patent number 8,747,960
- Issue date Jun 10, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for removing material from semiconductor wafer and apparatus...
- Patent number 8,691,027
- Issue date Apr 8, 2014
- Lam Research Corporation
- Mikhail Korolik
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods and apparatuses for three dimensional integrated circuits
- Patent number 8,673,769
- Issue date Mar 18, 2014
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous electroless plating of two substrates
- Patent number 8,622,020
- Issue date Jan 7, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for atomic layer deposition
- Patent number 8,623,456
- Issue date Jan 7, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for cleaning contaminants from substrate
- Patent number 8,590,550
- Issue date Nov 26, 2013
- Lam Research Corporation
- Mikhail Korolik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for cleaning semiconductor wafers using compre...
- Patent number 8,535,451
- Issue date Sep 17, 2013
- Lam Research Corporation
- John M. de Larios
- B08 - CLEANING
Information Patent Grant
Methods, devices, and materials for metallization
- Patent number 8,518,815
- Issue date Aug 27, 2013
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with post-contact back end of line through-hole via integration
- Patent number 8,519,461
- Issue date Aug 27, 2013
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization processes, mixtures, and electronic devices
- Patent number 8,518,826
- Issue date Aug 27, 2013
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 8,485,120
- Issue date Jul 16, 2013
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for particle removal
- Patent number 8,480,810
- Issue date Jul 9, 2013
- Lam Research Corporation
- Erik M. Freer
- B08 - CLEANING
Information Patent Grant
Substrate preparation using stabilized fluid solutions and methods...
- Patent number 8,475,599
- Issue date Jul 2, 2013
- Lam Research Corporation
- Erik M. Freer
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Substrate cleaning technique employing multi-phase solution
- Patent number 8,388,762
- Issue date Mar 5, 2013
- Lam Research Corporation
- Erik M. Freer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing material from semiconductor wafer and apparatus...
- Patent number 8,323,420
- Issue date Dec 4, 2012
- Lam Research Corporation
- Mikhail Korolik
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods and systems for three-dimensional integrated circuit throug...
- Patent number 8,323,460
- Issue date Dec 4, 2012
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,314,027
- Issue date Nov 20, 2012
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for atomic layer deposition
- Patent number 8,287,647
- Issue date Oct 16, 2012
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Two-phase substrate cleaning material
- Patent number 8,242,067
- Issue date Aug 14, 2012
- Lam Research Corporation
- Mikhail Korolik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a barrier surface for copper...
- Patent number 8,241,701
- Issue date Aug 14, 2012
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...
- Publication number 20150214093
- Publication date Jul 30, 2015
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT
- Publication number 20150132946
- Publication date May 14, 2015
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT
- Publication number 20150128861
- Publication date May 14, 2015
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...
- Publication number 20140322446
- Publication date Oct 30, 2014
- Yezdi Dordi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20140145334
- Publication date May 29, 2014
- John BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20140054776
- Publication date Feb 27, 2014
- LAM RESEARCH CORPORATION
- Artur KOLICS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION MIXTURES AND ELECTRONIC DEVICES
- Publication number 20140034370
- Publication date Feb 6, 2014
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20130280917
- Publication date Oct 24, 2013
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE CLEANING TECHNIQUE EMPLOYING MULTI-PHASE SOLUTION
- Publication number 20130206182
- Publication date Aug 15, 2013
- Erik M. Freer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...
- Publication number 20130171820
- Publication date Jul 4, 2013
- LAM RESEARCH CORPORATION
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS...
- Publication number 20130061887
- Publication date Mar 14, 2013
- Mikhail Korolik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ATOMIC LAYER DEPOSITION
- Publication number 20130040460
- Publication date Feb 14, 2013
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Processes and Systems for Engineering a Barrier Surface for Copper...
- Publication number 20120269987
- Publication date Oct 25, 2012
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR ATOMIC LAYER DEPOSITION
- Publication number 20120248219
- Publication date Oct 4, 2012
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE WITH POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
- Publication number 20120205807
- Publication date Aug 16, 2012
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20120045897
- Publication date Feb 23, 2012
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUSES AND SYSTEMS FOR FABRICATING THREE DIMENSIONAL INTEGRATE...
- Publication number 20120024230
- Publication date Feb 2, 2012
- Shijian LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METALLIZATION PROCESSES, MIXTURES, AND ELECTRONIC DEVICES
- Publication number 20120013008
- Publication date Jan 19, 2012
- Artur Kolics
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20120007239
- Publication date Jan 12, 2012
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...
- Publication number 20110306203
- Publication date Dec 15, 2011
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TOOL SETS AND PROCESS TO KEEP SUBSTRATE SURFACE WET DURI...
- Publication number 20110143553
- Publication date Jun 16, 2011
- LAM RESEARCH CORPORATION
- Yaxin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Fabricating a Barrier Layer Over Interconnect Structures...
- Publication number 20110065273
- Publication date Mar 17, 2011
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for Contained Chemical Surface Treatment
- Publication number 20110061687
- Publication date Mar 17, 2011
- LAM RESEARCH CORPORATION
- Katrina Mikhaylichenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless Plating Method and Apparatus
- Publication number 20110011335
- Publication date Jan 20, 2011
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PREPARATION USING MEGASONIC COUPLING FLUID MENISCUS
- Publication number 20100319726
- Publication date Dec 23, 2010
- John M. Boyd
- B08 - CLEANING
Information Patent Application
Two-Phase Substrate Cleaning Material
- Publication number 20100317556
- Publication date Dec 16, 2010
- LAM RESEARCH CORPORATION
- Mikhail Korolik
- B08 - CLEANING
Information Patent Application
Apparatus for Cleaning Contaminants from Substrate
- Publication number 20100313918
- Publication date Dec 16, 2010
- LAM RESEARCH CORPORATION
- Mikhail Korolik
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROXIMITY DRYING USING IN-SITU LOCAL HEATING OF SUBSTRATE
- Publication number 20100313443
- Publication date Dec 16, 2010
- Katrina Mikhaylichenko
- B08 - CLEANING
Information Patent Application
METHODS AND SYSTEMS FOR LOW INTERFACIAL OXIDE CONTACT BETWEEN BARRI...
- Publication number 20100267229
- Publication date Oct 21, 2010
- Fritz Redeker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus for Applying a Plating Solution for Electroless Deposition
- Publication number 20100239767
- Publication date Sep 23, 2010
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Fritz Redeker

Person

Patents Grantslast 30 patents

Apparatus and method for atomic layer deposition

Method and apparatus for wafer electroless plating

Controlled ambient system for interface engineering

Process integration scheme to lower overall dielectric constant in...

Cleaning solution formulations for substrates

Devices for metallization

Metallization mixtures and electronic devices

Method for barrier interface preparation of copper interconnect

Fluid handling system for wafer electroless plating and associated...

Processes and systems for engineering a copper surface for selectiv...

Processes and systems for engineering a silicon-type surface for se...

Method for removing material from semiconductor wafer and apparatus...

Methods and apparatuses for three dimensional integrated circuits

Simultaneous electroless plating of two substrates

Methods for atomic layer deposition

Apparatus for cleaning contaminants from substrate

Method and apparatus for cleaning semiconductor wafers using compre...

Methods, devices, and materials for metallization

Device with post-contact back end of line through-hole via integration

Metallization processes, mixtures, and electronic devices

Method and apparatus for wafer electroless plating

Method and apparatus for particle removal

Substrate preparation using stabilized fluid solutions and methods...

Substrate cleaning technique employing multi-phase solution

Method for removing material from semiconductor wafer and apparatus...

Methods and systems for three-dimensional integrated circuit throug...

Wafer electroless plating system and associated methods

Apparatus and method for atomic layer deposition

Two-phase substrate cleaning material

Processes and systems for engineering a barrier surface for copper...

Patents Applicationslast 30 patents

PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...

METHODS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT

APPARATUS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT

PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...

METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS

METHODS, DEVICES, AND MATERIALS FOR METALLIZATION

METALLIZATION MIXTURES AND ELECTRONIC DEVICES

Method and Apparatus for Wafer Electroless Plating

SUBSTRATE CLEANING TECHNIQUE EMPLOYING MULTI-PHASE SOLUTION

METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...

METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS...

METHODS FOR ATOMIC LAYER DEPOSITION

Processes and Systems for Engineering a Barrier Surface for Copper...

APPARATUS AND METHOD FOR ATOMIC LAYER DEPOSITION

DEVICE WITH POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION

Wafer Electroless Plating System and Associated Methods

APPARATUSES AND SYSTEMS FOR FABRICATING THREE DIMENSIONAL INTEGRATE...

METALLIZATION PROCESSES, MIXTURES, AND ELECTRONIC DEVICES

METHODS, DEVICES, AND MATERIALS FOR METALLIZATION

INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...

INTEGRATED TOOL SETS AND PROCESS TO KEEP SUBSTRATE SURFACE WET DURI...

Methods of Fabricating a Barrier Layer Over Interconnect Structures...

Apparatus for Contained Chemical Surface Treatment

Electroless Plating Method and Apparatus

SUBSTRATE PREPARATION USING MEGASONIC COUPLING FLUID MENISCUS

Two-Phase Substrate Cleaning Material

Apparatus for Cleaning Contaminants from Substrate

SUBSTRATE PROXIMITY DRYING USING IN-SITU LOCAL HEATING OF SUBSTRATE

METHODS AND SYSTEMS FOR LOW INTERFACIAL OXIDE CONTACT BETWEEN BARRI...

Apparatus for Applying a Plating Solution for Electroless Deposition