Fu-Wen Liu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device having at least one via incl...
- Patent number 12,266,593
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having solder mask frame
- Patent number 12,224,359
- Issue date Feb 11, 2025
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having ring-shaped solder mask frame
- Patent number 11,984,516
- Issue date May 14, 2024
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having solder mask frame
- Patent number 11,967,652
- Issue date Apr 23, 2024
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having at least one via including concave port...
- Patent number 11,942,398
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,901,266
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,769,716
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale sensor package structure
- Patent number 11,552,120
- Issue date Jan 10, 2023
- KINGPAK TECHNOLOGY INC.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 11,257,964
- Issue date Feb 22, 2022
- KINGPAK TECHNOLOGY INC.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing warpage occurred to substrate strip after moldi...
- Patent number 10,916,511
- Issue date Feb 9, 2021
- KINGPAK TECHNOLOGY INC.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and manufacturing method thereof
- Patent number 10,777,578
- Issue date Sep 15, 2020
- NUSTORAGE TECHNOLOGY CO., LTD.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric memory and capacitor structure thereof
- Patent number 10,586,582
- Issue date Mar 10, 2020
- NUSTORAGE TECHNOLOGY CO., LTD.
- Fu-Chou Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device and manufacturing method thereof
- Patent number 10,424,598
- Issue date Sep 24, 2019
- NUSTORAGE TECHNOLOGY CO., LTD.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor, memory element and manufacturing method of...
- Patent number 10,403,721
- Issue date Sep 3, 2019
- NUSTORAGE TECHNOLOGY CO., LTD.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical ferroelectric thin film storage transistor and data write...
- Patent number 10,367,004
- Issue date Jul 30, 2019
- NUSTORAGE TECHNOLOGY CO., LTD.
- Fu-Chou Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Ferroelectric memory, data reading/writing method and manufacturing...
- Patent number 10,304,512
- Issue date May 28, 2019
- NUSTORAGE TECHNOLOGY CO., LTD.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Refractive index tuning of wafer level package LEDs
- Patent number 9,024,341
- Issue date May 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode optical emitter with transparent electrical co...
- Patent number 8,889,440
- Issue date Nov 18, 2014
- TSMC Solid State Lighting Ltd.
- Yung-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode optical emitter with transparent electrical co...
- Patent number 8,610,161
- Issue date Dec 17, 2013
- TSMC Solid State Lighting Ltd.
- Yung-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating light emitting diode devices
- Patent number 8,349,628
- Issue date Jan 8, 2013
- TSMC Solid State Lighting Ltd.
- Yung-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device with conductive window layer
- Patent number 6,169,298
- Issue date Jan 2, 2001
- Kingmax Technology Inc.
- Ying-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode with anti-reflector
- Patent number 6,097,041
- Issue date Aug 1, 2000
- Kingmax Technology Inc.
- Ying-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric semiconductor device having a GaAsP substrate
- Patent number 6,008,507
- Issue date Dec 28, 1999
- Kingmax Technology Inc.
- Ying-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL STOP STRUCTURES FOR MEMS DEVICES
- Publication number 20250236514
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ko-Li Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210467
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240153849
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240128231
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20240120295
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hsien Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR DRY ETCHING
- Publication number 20240071803
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Fu-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240047397
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Structure with Reduced Peeling and Methods Forming the Same
- Publication number 20240034619
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240014105
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20230395468
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20230207709
- Publication date Jun 29, 2023
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20230207708
- Publication date Jun 29, 2023
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20230197863
- Publication date Jun 22, 2023
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230060982
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230063096
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20220310492
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20210305437
- Publication date Sep 30, 2021
- Kingpak Technology Inc.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE SENSOR PACKAGE STRUCTURE
- Publication number 20210305304
- Publication date Sep 30, 2021
- Kingpak Technology Inc.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20210288190
- Publication date Sep 16, 2021
- Kingpak Technology Inc.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC MEMORY AND CAPACITOR STRUCTURE THEREOF
- Publication number 20190237121
- Publication date Aug 1, 2019
- NuStorage Technology Co., Ltd.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL FERROELECTRIC THIN FILM STORAGE TRANSISTOR AND DATA WRITE...
- Publication number 20190181147
- Publication date Jun 13, 2019
- NuStorage Technology Co., Ltd.
- FU-CHOU LIU
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190148406
- Publication date May 16, 2019
- NuStorage Technology Co., Ltd.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190123061
- Publication date Apr 25, 2019
- NuStorage Technology Co., Ltd.
- FU-CHOU LIU
- G11 - INFORMATION STORAGE
Information Patent Application
FERROELECTRIC MEMORY, DATA READING/WRITING METHOD AND MANUFACTURING...
- Publication number 20180366174
- Publication date Dec 20, 2018
- NuStorage Technology Co., Ltd.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC FIELD EFFECT TRANSISTOR, FERROELECTRIC MEMORY AND DAT...
- Publication number 20180366476
- Publication date Dec 20, 2018
- NuStorage Technology Co., Ltd.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR, MEMORY ELEMENT AND MANUFACTURING METHOD OF...
- Publication number 20180366547
- Publication date Dec 20, 2018
- NuStorage Technology Co., Ltd.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC TUNNEL JUNCTION UNIT, A MANUFACTURING METHOD OF A FER...
- Publication number 20180366477
- Publication date Dec 20, 2018
- NuStorage Technology Co., Ltd.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ETCHING FOR RC DELAY IMPROVEMENT
- Publication number 20160071801
- Publication date Mar 10, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Diode Optical Emitter with Transparent Electrical Co...
- Publication number 20140093990
- Publication date Apr 3, 2014
- TSMC Solid State Lighting Ltd.
- Yung-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PHOSPHOR PATTERNING
- Publication number 20120305956
- Publication date Dec 6, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of forming semiconductor device having at least one via incl...

Sensor package structure having solder mask frame

Sensor package structure having ring-shaped solder mask frame

Sensor package structure having solder mask frame

Semiconductor device having at least one via including concave port...

Semiconductor device structure and method for forming the same

Semiconductor device and methods of forming the same

Chip-scale sensor package structure

Sensor package structure

Method for reducing warpage occurred to substrate strip after moldi...

Three-dimensional memory device and manufacturing method thereof

Ferroelectric memory and capacitor structure thereof

Three-dimensional memory device and manufacturing method thereof

Field effect transistor, memory element and manufacturing method of...

Vertical ferroelectric thin film storage transistor and data write...

Ferroelectric memory, data reading/writing method and manufacturing...

Refractive index tuning of wafer level package LEDs

Light emitting diode optical emitter with transparent electrical co...

Light emitting diode optical emitter with transparent electrical co...

Methods of fabricating light emitting diode devices

Semiconductor light emitting device with conductive window layer

Light-emitting diode with anti-reflector

Photoelectric semiconductor device having a GaAsP substrate

Patents Applicationslast 30 patents

CHEMICAL STOP STRUCTURES FOR MEMS DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF

METHODS AND SYSTEMS FOR DRY ETCHING

BUMP STRUCTURE AND METHOD OF MAKING THE SAME

MEMS Structure with Reduced Peeling and Methods Forming the Same

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD OF FORMING SEMICONDUCTOR DEVICE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

SENSOR PACKAGE STRUCTURE

CHIP-SCALE SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

FERROELECTRIC MEMORY AND CAPACITOR STRUCTURE THEREOF

VERTICAL FERROELECTRIC THIN FILM STORAGE TRANSISTOR AND DATA WRITE...

THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

FERROELECTRIC MEMORY, DATA READING/WRITING METHOD AND MANUFACTURING...

FERROELECTRIC FIELD EFFECT TRANSISTOR, FERROELECTRIC MEMORY AND DAT...

FIELD EFFECT TRANSISTOR, MEMORY ELEMENT AND MANUFACTURING METHOD OF...

FERROELECTRIC TUNNEL JUNCTION UNIT, A MANUFACTURING METHOD OF A FER...

SEMICONDUCTOR DEVICE ETCHING FOR RC DELAY IMPROVEMENT

Light Emitting Diode Optical Emitter with Transparent Electrical Co...

LED PHOSPHOR PATTERNING