FUCHENG CHEN

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for backside illumination sensor
- Patent number 10,340,303
- Issue date Jul 2, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Dekui Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure, bonding ring structure, and MEMS device pack...
- Patent number 10,134,698
- Issue date Nov 20, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Fucheng Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deep trench isolation for RF devices on SOI
- Patent number 10,074,650
- Issue date Sep 11, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, related device, and related manufacturing method
- Patent number 9,377,582
- Issue date Jun 28, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng Chen
- G02 - OPTICS
Information Patent Grant
Method for forming deep trench isolation for RF devices on SOI
- Patent number 9,349,748
- Issue date May 24, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and related manufacturing method
- Patent number 9,343,435
- Issue date May 17, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of manufacturing the same
- Patent number 9,293,430
- Issue date Mar 22, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR BACKSIDE ILLUMINATION SENSOR
- Publication number 20180323226
- Publication date Nov 8, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- DEKUI QI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING DEEP TRENCH ISOLATION FOR RF DEVICES ON SOI
- Publication number 20170287908
- Publication date Oct 5, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACK...
- Publication number 20170084557
- Publication date Mar 23, 2017
- Semiconductor Manufacturing International (Beijing) Corporation
- FUCHENG CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING DEEP TRENCH ISOLATION FOR RF DEVICES ON SOI
- Publication number 20160247801
- Publication date Aug 25, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150380367
- Publication date Dec 31, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING DEEP TRENCH ISOLATION FOR RF DEVICES ON SOI
- Publication number 20150187794
- Publication date Jul 2, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, RELATED DEVICE, AND RELATED MANUFACTURING METHOD
- Publication number 20150185418
- Publication date Jul 2, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng CHEN
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD
- Publication number 20150187736
- Publication date Jul 2, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS

FUCHENG CHEN

Person

Patents Grantslast 30 patents

Method and apparatus for backside illumination sensor

Bonding pad structure, bonding ring structure, and MEMS device pack...

Deep trench isolation for RF devices on SOI

Substrate, related device, and related manufacturing method

Method for forming deep trench isolation for RF devices on SOI

Semiconductor device and related manufacturing method

Semiconductor chip and method of manufacturing the same

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR BACKSIDE ILLUMINATION SENSOR

METHOD FOR FORMING DEEP TRENCH ISOLATION FOR RF DEVICES ON SOI

BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACK...

METHOD FOR FORMING DEEP TRENCH ISOLATION FOR RF DEVICES ON SOI

SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING DEEP TRENCH ISOLATION FOR RF DEVICES ON SOI

SUBSTRATE, RELATED DEVICE, AND RELATED MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD