Fukumi Shimizu

Person

Tachikawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,966,329
- Issue date May 8, 2018
- Renesas Electronics Corporation
- Fukumi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,153,527
- Issue date Oct 6, 2015
- Renesas Electronics Corporation
- Yusuke Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,772,090
- Issue date Jul 8, 2014
- Renesas Electronics Corporation
- Yusuke Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,476,113
- Issue date Jul 2, 2013
- Renesas Electronics Corporation
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 8,117,742
- Issue date Feb 21, 2012
- Renesas Electronics Corporation
- Bunshi Kuratomi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,681,308
- Issue date Mar 23, 2010
- Renesas Eastern Japan Semiconductor, Inc.
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,632,720
- Issue date Dec 15, 2009
- Renesas Technology Corp.
- Bunshi Kuratomi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,445,969
- Issue date Nov 4, 2008
- Renesas Technology Corp.
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,377,031
- Issue date May 27, 2008
- Renesas Technology Corp.
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,288,440
- Issue date Oct 30, 2007
- Renesas Technology Corp.
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,144,755
- Issue date Dec 5, 2006
- Renesas Technology Corp.
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,037,760
- Issue date May 2, 2006
- Renesas Technology Corp.
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 6,797,542
- Issue date Sep 28, 2004
- Renesas Technology Corp.
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180090423
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Fukumi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160005699
- Publication date Jan 7, 2016
- Yusuke OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140264797
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Yusuke OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130316500
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- Yusuke OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120009737
- Publication date Jan 12, 2012
- RENESAS ELECTRONICS CORPORATION
- Bunshi KURATOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100233857
- Publication date Sep 16, 2010
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090160084
- Publication date Jun 25, 2009
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20090004779
- Publication date Jan 1, 2009
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory card and manufacturing method of the same
- Publication number 20080173995
- Publication date Jul 24, 2008
- RENESAS TECHNOLOGY CORP.
- Bunshi Kuratomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20080057626
- Publication date Mar 6, 2008
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20080020510
- Publication date Jan 24, 2008
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20070057379
- Publication date Mar 15, 2007
- RENESAS TECHNOLOGY CORP.
- Bunshi Kuratomi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20060105504
- Publication date May 18, 2006
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20050106786
- Publication date May 19, 2005
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20050070047
- Publication date Mar 31, 2005
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20050019979
- Publication date Jan 27, 2005
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20040166605
- Publication date Aug 26, 2004
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20030153130
- Publication date Aug 14, 2003
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS

Fukumi Shimizu

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Fabrication method of semiconductor integrated circuit device

Method of manufacturing a semiconductor device

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Memory card and manufacturing method of the same

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Method of manufacturing a semiconductor device

Fabrication method of semiconductor integrated circuit device

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device