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Fumiaki Ishikawa

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Patents Grantslast 30 patents

  • Information Patent Grant

    Metal base substrate, electronic component mounting substrate
    • Patent number 12,127,342
    • Issue date Oct 22, 2024
    • Mitsubishi Materials Corporation
    • Fumiaki Ishikawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Insulating film
    • Patent number 11,124,673
    • Issue date Sep 21, 2021
    • Mitsubishi Materials Corporation
    • Fumiaki Ishikawa
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Heat dissipation circuit board
    • Patent number 10,893,601
    • Issue date Jan 12, 2021
    • Mitsubishi Materials Corporation
    • Fumiaki Ishikawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    POLYIMIDE RESIN COMPOSITION AND METAL BASE SUBSTRATE
    • Publication number 20240117119
    • Publication date Apr 11, 2024
    • MITSUBISHI MATERIALS CORPORATION
    • Shintaro Hara
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    RESIN MOLDED BODY, BATTERY PACK
    • Publication number 20240047819
    • Publication date Feb 8, 2024
    • MITSUBISHI MATERIALS CORPORATION
    • Mariko Wakamatsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL BASE SUBSTRATE, ELECTRONIC COMPONENT MOUNTING SUBSTRATE
    • Publication number 20230111128
    • Publication date Apr 13, 2023
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METAL BASE SUBSTRATE
    • Publication number 20230110469
    • Publication date Apr 13, 2023
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MEMBER FOR PLASMA PROCESSING APPARATUS, METHOD FOR MANUFACTURING SA...
    • Publication number 20230114319
    • Publication date Apr 13, 2023
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER BASE SUBSTRATE
    • Publication number 20230105989
    • Publication date Apr 6, 2023
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    JOINED STRUCTURE
    • Publication number 20220093553
    • Publication date Mar 24, 2022
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL BASE SUBSTRATE
    • Publication number 20210298170
    • Publication date Sep 23, 2021
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL BASE SUBSTRATE
    • Publication number 20210272865
    • Publication date Sep 2, 2021
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INSULATING FILM, INSULATED CONDUCTOR, METAL BASE SUBSTRATE
    • Publication number 20210166844
    • Publication date Jun 3, 2021
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL BASE SUBSTRATE
    • Publication number 20200346435
    • Publication date Nov 5, 2020
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEAT DISSIPATION CIRCUIT BOARD
    • Publication number 20200236774
    • Publication date Jul 23, 2020
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INSULATING FILM
    • Publication number 20190144706
    • Publication date May 16, 2019
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...