Patent Application
20220093553
The present invention relates to a joined structure.
Priority is claimed on Japanese Patent Application No. 2019-055366, filed Mar. 22, 2019, the content of which is incorporated herein by reference.
Metal base substrates are known as one of substrates for mounting electronic components such as LED chips and power modules. Such metal base substrates are laminates in which a metal substrate, an insulating layer, and a circuit layer are laminated in this order. A circuit layer is molded on a predetermined circuit pattern, and an electrode terminal of an electronic component is joined onto the circuit pattern via a conductive joining material such as solder (Patent Document 1). In the metal base substrates having such a configuration, the heat generated in the electronic component is transferred to a metal substrate via the insulating layer and radiated from the metal substrate to the outside.
It is preferable that a joined structure in which a member to be joined provided with an electrode terminal such as an electronic component and a circuit pattern are joined together can efficiently release heat generated in the member to be joined to the outside, that is, has high heat dissipation performance. In order to enhance the heat dissipation performance of the joined structure, it has been studied to improve the thermal conductivity of the conductive joining material (Patent Documents 2 to 5).
Patent Document 1: Japanese Unexamined Patent Application, First Publication No. 2014-103314
Patent Document 2: Japanese Unexamined Patent Application, First Publication No. 2018-172792
Patent Document 3: Japanese Unexamined Patent Application, First Publication No. 2018-168226
Patent Document 4: Japanese Unexamined Patent Application, First Publication No. 2018-152176
Patent Document 5: Japanese Unexamined Patent Application, First Publication No. 2016-204733
Meanwhile, the amount of heat generated in the joined structure has tended to increase with the recent increases in capacity and output of electronic devices. However, there is a limit to coping with further increases in capacity and output of the electronic devices only by improving the thermal conductivity of the joining material.
The present invention has been made in view of the aforementioned circumstances, and an object of the present invention is to provide a joined structure capable of improving the heat dissipation performance of a joined structure in which a member to be joined having an electrode terminal such as an electronic component and a circuit pattern are joined together, that is, efficiently releasing the heat generated in the member to be joined to the outside.
In order to solve the above problems, the joined structure (hereinafter, referred to as “the joined structure of the present invention”) of one aspect of the present invention is a joined structure in which a substrate having a circuit pattern and a member to be joined including an electrode terminal are joined together via a conductive joining material. When a contact area between the circuit pattern and the conductive joining material is defined as X, a contact area between the electrode terminal and the conductive joining material is defined as Y, and a thermal conductivity of the conductive joining material is defined as λ, the joined structure satisfies the following Formula (1):
SQRT(X)/SQRT(Y)≥2.9209×λ−0.141 (1)
In the joined structure of the present invention, the contact area X between the circuit pattern and the conductive joining material, the contact area Y between the electrode terminal and the conductive joining material, and the thermal conductivity λ of the conductive joining material satisfy the relationship of the above Formula (1). Thus, the thermal resistance of the joined structure is reduced. For this reason, the heat generated in the member to be joined can be efficiently released to the outside.
Here, in the joined structure of the present invention, the member to be joined may be an LED chip or a power module.
In this case, although the amount of heat generated by the LED chip and the power module has increased with the recent increase in functionality and miniaturization of electronic devices, the joined structure of the present invention has high heat dissipation performance Therefore, even when the member to be joined is the LED chip or the power module, the member to be joined exhibits excellent heat dissipation performance, and the deterioration of the LED chips and power modules due to heat can be suppressed.
Additionally, in the joined structure of the present invention, the conductive joining material is preferably a sintered body of at least one type of metal particles selected from the group consisting of silver particles, copper particles, and copper particles coated with tin.
In this case, since the conductive joining material has high thermal conductivity, the heat generated by the member to be joined can be more reliably released to the outside efficiently. Additionally, since the sintered body of the metal particles does not melt and have fluidity even in a high-temperature state, the member to be joined can be stably fixed.
According to the present invention, it is possible to provide a joined structure capable of efficiently releasing the heat generated in a member to be joined to the outside.
Hereinafter, a joined structure according to an embodiment of the present invention will be described with reference to the attached drawings.
In
The joined structure 1 is adapted such that a contact area X (unit: mm2) between the circuit pattern 40 and the conductive joining material 60, a contact area Y (unit: mm2) between the electrode terminal 71 and the conductive joining material 60, and a thermal conductivity λ (unit: W/mK) of the conductive joining material 60 satisfy the following Formula (1).
SQRT(X)/SQRT(Y)≥2.9209×λ−0.141 (1)
In Formula (1), SQRT represents the square root. That is, SQRT (X)/SQRT (Y) is the ratio of the square root of the contact area X between the circuit pattern 40 and the conductive joining material 60 to the square root of the contact area Y between the electrode terminal 71 and the conductive joining material 60. The SQRT (X)/SQRT (Y) is preferably 100 or less.
In the joined structure 1, by setting the contact area X and the contact area Y so as to satisfy the above Formula (1) with respect to the conductive joining material 60 having the thermal conductivity λ, the thermal resistance is reduced, the conductivity of heat from the electrode terminal 71 to the circuit pattern 40 is improved, and the heat transferred to the circuit pattern 40 is easily diffused in the metal base substrate 10.
The contact area Y between the electrode terminal 71 and the conductive joining material 60 varies depending on the power-supply voltage of the member to be joined 70 and the like but is preferably within a range of 50% or more and 90% or less of the bottom area of the member to be joined 70. When the contact area Y is within the above range, electric power can be stably supplied to the member to be joined 70, and the conductivity of the heat generated in the member to be joined 70 from the electrode terminal 71 to the circuit pattern 40 is improved.
The metal substrate 20 is a member that serves as a base for the metal base substrate 10. As the metal substrate 20, a copper plate, an aluminum plate, and a laminated plate thereof can be used.
The insulating layer 30 is a layer for insulating the metal substrate 20 and the circuit pattern 40 from each other. The insulating layer 30 is formed of an insulating resin composition containing an insulating resin 31 and ceramic particles 32 (thermally conductive filler). By forming the insulating layer 30 of the insulating resin composition containing the insulating resin 31 having a high insulating property and the ceramic particles 32 having a high thermal conductivity, the thermal resistance of the entire metal base substrate 10 from the circuit pattern 40 to the metal substrate 20 can be further reduced while maintaining the insulating property.
The insulating resin 31 is preferably a polyimide resin, a polyamide-imide resin, or a mixture thereof. Since the polyimide resin and the polyamide-imide resin have an imide bond, these resins have excellent heat resistance and mechanical characteristics.
As the ceramic particles 32, silica (silicon dioxide) particles, alumina (aluminum oxide) particles, boron nitride (BN) particles, titanium oxide particles, alumina-doped silica particles, alumina hydrate particles, aluminum nitride particles, and the like can be used. As the ceramic particles 32, one type may be used alone, or two or more types may be used in combination. Among these ceramic particles, alumina particles are preferable in that the alumina particles have a high thermal conductivity. The form of the ceramic particles 32 is not particularly limited but is preferably agglomerated particles of fine ceramic particles, or single-crystal ceramic particles.
The agglomerated particles of the fine ceramic particles may be agglomerates in which primary particles are relatively weakly linked, or may be aggregates in which the primary particles are relatively strongly linked. Additionally, the agglomerated particles may form a particle assembly in which the aggregated particles are further assembled. When the primary particles of the ceramic particles 32 form agglomerated particles and are dispersed in the insulating layer 30, a network is formed by mutual contact between the ceramic particles 32, heat is easily conducted between the primary particles of the ceramic particles 32, and the thermal conductivity of the insulating layer 30 is improved.
As commercially available products of the agglomerated particles of the fine ceramic particles, silica particles such as AE50, AE130, AE200, AE300, AE380, AE90E (all manufactured by Nippon Aerosil Co., Ltd.), T400 (manufactured by Wacker Chemie AG), and SFP-20M (manufactured by Denka Co., Ltd.), alumina particles such as Alu65 (manufactured by Nippon Aerosil Co., Ltd.) and AA-04 (manufactured by Sumitomo Chemical Co., Ltd.), boron nitride particles such as AP-170S (manufactured by Maruka Corp.), titanium oxide particles such as AEROXIDE (R) TiO2 P90 (manufactured by Nippon Aerosil Co., Ltd.), alumina-doped silica particles such as MOX170 (manufactured by Nippon Aerosil Co., Ltd.), alumina hydrate particles manufactured by Sasol Ltd., and the like can be used.
The single-crystal ceramic particles are preferably α-alumina single crystal particles having a crystal structure of α-alumina (αAl2O3). As commercially available products of the α-alumina single crystal particles, AA-03, AA-04, AA-05, AA-07, AA-1.5, and the like of the Advanced Alumina (AA) series sold by Sumitomo Chemical Co., Ltd. can be used.
The content of the ceramic particles 32 in the insulating layer 30 is preferably in a range of 5% by volume or more and 60% by volume or less. When the content of the ceramic particles 32 is too small, there is a concern that the thermal conductivity of the insulating layer 30 is not sufficiently improved. On the other hand, when the content of the ceramic particles 32 too large, there is a concern that the content of the insulating resin 31 is relatively reduced and the shape of the insulating layer 30 is not stably maintained. Additionally, there is a concern that the ceramic particles 32 tend to form excessively large agglomerated particles and a surface roughness Ra of the insulating layer 30 is increased. In order to reliably improve the thermal conductivity of the insulating layer 30, the content of the ceramic particles 32 is preferably 10% by volume or more. Additionally, in order to reliably improve the shape stability of the insulating layer 30 and reduce the surface roughness Ra, the content of the ceramic particles 32 is particularly preferably 50% by volume or less.
The film thickness of the insulating layer 30 is not particularly limited, but is preferably in a range of 1 μm or more and 200 μm or less, and particularly preferably in a range of 3 μm or more and 100 μm or less.
As the material of the circuit pattern 40, aluminum, copper, silver, gold, tin, iron, nickel, chromium, molybdenum, tungsten, palladium, titanium, zinc, and alloys of these metals can be used. Among these metals, aluminum and copper are preferable, and aluminum is particularly preferable. The method of molding the circuit pattern 40 is not particularly limited, and for example, an etching method can be used.
The film thickness of the circuit pattern 40 is preferably in a range of 10 μm or more and 1000 μm or less, and particularly preferably in a range of 20 μm or more and 100 μm or less. When the film thickness of the circuit pattern 40 is too small, there is a concern that the thermal resistance increases. On the other hand, when the film thickness of the circuit pattern 40 is too large, there is a concern that it is difficult to form the circuit pattern by the etching method. Additionally, when the film thickness of the circuit pattern 40 is too large, there is a concern that the thermal stress applied to the circuit pattern 40 increases due to a difference between the coefficients of thermal expansion of respective materials constituting the joined structure 1, and the insulating layer 30 and the circuit pattern 40 are easily separated from each other during a cold-hot cycle.
Examples of the member to be joined 70 are not particularly limited, and semiconductor elements, resistors, capacitors, crystal oscillators, and the like are exemplary examples. As examples of the semiconductor elements, metal-oxide-semiconductor field-effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), large-scale integrations (LSIs), light-emitting diodes (LEDs), LED chips, and LED-chip size packages (LED-CSPs) are exemplary examples.
As the materials of the conductive joining material 60, metals or alloys can be used. The conductive joining material 60 is preferably a sintered body of metal particles. As the metal particles, silver particles, copper particles, and copper particles (tin-coated copper particles) coated with tin can be used. One type of these metal particles may be used alone, or two or more types of these metal particles may be used in combination. The thickness of the conductive joining material 60 is preferably in a range of 1 μm or more and 100 μm or less.
The sintered body of the metal particles can be formed by heating a paste containing the metal particles in a state in which the paste is interposed between the circuit pattern 40 of the metal base substrate 10 and the electrode terminal 71 of the member to be joined 70 to sinter the metal particles.
Next, a method of manufacturing the joined structure of the present embodiment will be described.
The joined structure can be manufactured by, for example, a method including an application step of applying a metal particle paste to a circuit pattern of a metal base substrate to form a metal particle paste layer, a loading step of loading a member to be joined on the metal particle paste layer, and a joining step of heating the metal base substrate on which the member to be joined is loaded to produce a metal particle sintered body.
In the application step, the application amount of the metal particle paste is set such that a thermal conductivity λ of the metal particle sintered body produced by heating the metal particle paste is obtained in advance and a contact area X between the metal particle sintered body produced by heating the metal particle paste and the circuit pattern and a contact area Y between the metal particle sintered body and an electrode terminal satisfy the above Formula (1). As a method of applying the metal particle paste to the circuit pattern of the metal base substrate, a method such as a screen printing method can be used.
In the loading step, the member to be joined is loaded such that the electrode terminals of the members to be joined are in contact with the metal particle paste layer.
In the joining step, it is preferable to heat the metal base substrate while pressurizing the member to be joined. The heating temperature of the metal base substrate is a temperature at which the metal particles of the metal particle paste are sintered and is preferably in a range of 200° C. or higher and 350° C. or lower. The heating atmosphere is preferably a non-oxidizing atmosphere.
According to the joined structure 1 of the present embodiment having the configuration as described above, the contact area X between the circuit pattern 40 and the conductive joining material 60, the contact area Y between the electrode terminal 71 of the member to be joined 70 and the conductive joining material 60, and the thermal conductivity λ of the conductive joining material 60 satisfy the relationship of the above Formula (1). Thus, the thermal resistance of the joined structure 1 is reduced. For this reason, the heat generated in the member to be joined can be efficiently released to the outside.
Additionally, in the joined structure 1 of the present embodiment, the member to be joined 70 exhibits excellent heat dissipation performance even in an LED chip or a power module, and deterioration of the LED chip and the power module due to heat can be suppressed.
Additionally, in the joined structure 1 of the present embodiment, in a case where the conductive joining material 60 is a sintered body of at least one type of metal particles selected from the group consisting of silver particles, copper particles, and copper particles coated with tin, the conductive joining material 60 has high thermal conductivity. Thus, the heat generated by the member to be joined 70 can be more reliably released to the outside efficiently.
The embodiment of the present invention has been described above, but the present invention is not limited thereto and can be appropriately changed without departing from the technical ideas of the present invention.
For example, in the joined structure 1 of the present embodiment, as the conductive joining material 60, sintered bodies of metal particles such as silver particles, copper particles, and copper particles coated with tin have been exemplified. However, the conductive joining material 60 is not limited to these. For example, solder may be used as the conductive joining material 60.
Hereinafter, the action and effects of the present invention will be described by way of Examples.
In a joined structure 1S shown in
Metal substrate 20S: Plane size: 5 mm×5 mm, Heat transfer coefficient: 300 W/m2K
Insulating layer 30S: Thickness: 100 Thermal conductivity: 10 W/mK
Copper foil 40S: Thickness: 35 μm, Thermal conductivity: 400 W/mK
Conductive joining material 60S: Thickness and thermal conductivity are described in Table 1 below.
Electrode terminal 71S: Thickness: 35 μm, Thermal conductivity: 400 W/mK
AlN member 72S: Thickness: 635 μm, Thermal conductivity: 170 W/mK
Member to be joined 70S: Thickness: 100 μm, Thermal conductivity: 1,000,000,000 W/mK, Heat generation density: 20 W/m3
A contact area X (mm2) between the copper foil 40S and the conductive joining material 60S, a contact area Y (mm2) between the electrode terminal 71S and the conductive joining material 60S, and SQRT (X)/SQRT (Y) are described in Table 1 below.
The heat distribution of the joined structure 1S when the member to be joined 70S generates heat was obtained by simulation. Then, a maximum temperature (° C.), a minimum temperature (° C.), and a temperature difference between the maximum temperature and the minimum temperature (Maximum temperature−Minimum temperature) in each member of the joined structure 1S were obtained. The results are shown in Table 1.
Additionally, the thermal resistance in the joined structure 1S was calculated from the temperature difference between the maximum temperature and the minimum temperature of the joined structure 1S and the amount of heat generated (W) of the member to be joined 70S from the following formula. Then, the relative value of the thermal resistance in a case where the thermal resistance of SQRT (X)/SQRT (Y)=1.2 is 100 for the joined structure 1S having the same thermal conductivity λ as the conductive joining material 60S but different SQRT (X)/SQRT (Y) was obtained. This result is shown in Table 1 as the relative thermal resistance (%).
Thermal resistance(K/W)=(Maximum temperature−Minimum temperature)/Amount of heat generated
An insulating layer (thickness: 30 μm, alumina particle content: 60% by volume) containing an alumina particle-containing polyimide resin and a copper layer (thickness: 35 μm) are formed on a copper substrate (30 mm×20 mm×0.3 μm) were laminated in this order to produce a copper base substrate. The copper layer of this copper base substrate was etched by an etching method to form a circuit pattern.
A silver particle paste (average particle size of silver particles: 150 nm) was applied to a circuit pattern of the copper base substrate to form a silver particle paste application layer (width: 10 mm, thickness: 50 μm). Next, an electrode terminal of an LED chip (terminal size: 1.65 mm×0.45 mm) was loaded on the silver particle paste. Then, while pressurizing (10 Pa) the loaded LED chip, heating was performed at 300° C. in a nitrogen atmosphere to sinter the silver particles of the silver particle paste to produce a joined structure in which the copper base substrate and the LED chip are joined together via the silver particle sintered body.
A contact area (X) between the circuit pattern and the silver particle sintered body of the obtained joined structure, a contact area (Y) between the electrode terminal of the LED chip and the silver particle sintered body, and a thermal conductivity 7 of the silver particle sintered body were each measured. Then, as a result of calculating SQRT (X)/SQRT (Y) and 2.9209×λ−0.141, SQRT (X)/SQRT (Y) was 23.2, and 2.9209×λ−0.141 was 1.3. Additionally, as a result of visually observing the obtained joined structure, no positional deviation or floating of the LED chip was confirmed.
A joined structure in which a copper base substrate and an LED chip were joined together via a copper particle sintered body was produced similar to Example 2 of the present invention except that copper particle paste (average particle size of copper particles: 150 nm) was used instead of the silver particle paste.
A contact area (X) between the circuit pattern and the silver particle sintered body of the obtained joined structure, a contact area (Y) between the electrode terminal of the LED chip and the silver particle sintered body, and a thermal conductivity λ of the copper particle sintered body were each measured. Then, as a result of calculating SQRT (X)/SQRT (Y) and 2.9209×λ−0.141, SQRT (X)/SQRT (Y) was 23.2, and 2.9209×λ−0.141 was 1.3. Additionally, as a result of visually observing the obtained joined structure, no positional deviation or floating of the LED chip was confirmed.
A joined structure in which a copper base substrate and an LED chip were joined together via a tin-coated copper particle sintered body was produced similar to Example 2 of the present invention except that tin-coated copper particle paste (average particle size of tin-coated copper particles: 9 μm) was used instead of the silver particle paste.
A contact area (X) between the circuit pattern and the silver particle sintered body of the obtained joined structure, a contact area (Y) between the electrode terminal of the LED chip and the silver particle sintered body, and a thermal conductivity A. of the tin-coated copper particle sintered body were each measured. Then, as a result of calculating SQRT (X)/SQRT (Y) and 2.9209×λ−0.141, SQRT (X)/SQRT (Y) was 23.2, and 2.9209×λ−0.141 was 1.8. Additionally, as a result of visually observing the obtained joined structure, no positional deviation or floating of the LED chip was confirmed.
The joined structure of the present invention can efficiently release the heat generated in a member to be joined to the outside. For this reason, even when the member to be joined is an electronic component such as an LED chip or a power module that generates a large amount of heat, deterioration due to heat can be suppressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019-055366 | Mar 2019 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2020/011883 | 3/18/2020 | WO | 00 |
