Fumihiko Hasegawa

Person

Urawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of and apparatus for mirror-like polishing wafer chamfer wit...
- Patent number 6,332,828
- Issue date Dec 25, 2001
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for wafer chamfer polishing
- Patent number 6,234,879
- Issue date May 22, 2001
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of and apparatus for mirror-like polishing wafer chamfer wit...
- Patent number 6,113,463
- Issue date Sep 5, 2000
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing peripheral portion of wafer
- Patent number 5,928,066
- Issue date Jul 27, 1999
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing slices
- Patent number 5,918,587
- Issue date Jul 6, 1999
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Workpiece holding mechanism
- Patent number 5,913,719
- Issue date Jun 22, 1999
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing method and equipment therefor
- Patent number 5,882,539
- Issue date Mar 16, 1999
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for mirror-polishing thin plate
- Patent number 5,879,220
- Issue date Mar 9, 1999
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing wafers
- Patent number 5,860,853
- Issue date Jan 19, 1999
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing peripheral portion of wafer
- Patent number 5,766,065
- Issue date Jun 16, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing the notch of a wafer
- Patent number 5,733,181
- Issue date Mar 31, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for mirror-polishing chamfered portion of wafer and mirror-p...
- Patent number 5,727,990
- Issue date Mar 17, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor wafers and process of and app...
- Patent number 5,700,179
- Issue date Dec 23, 1997
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for wafer chamfer polishing
- Patent number 5,547,415
- Issue date Aug 20, 1996
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for bevelling wafer-edge
- Patent number 5,538,463
- Issue date Jul 23, 1996
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for chamfering the peripheral edge of a wafer...
- Patent number 5,514,025
- Issue date May 7, 1996
- Shin-Etsu Handotai Co. Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing the periphery portion of a wafer
- Patent number 5,476,413
- Issue date Dec 19, 1995
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing notch portion of wafer
- Patent number 5,458,529
- Issue date Oct 17, 1995
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus for notch portion of wafer
- Patent number 5,429,544
- Issue date Jul 4, 1995
- Shin-Etsu Handotal Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer chamfer polishing apparatus with rotary circular dividing table
- Patent number 5,404,678
- Issue date Apr 11, 1995
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing chamfers of a wafer
- Patent number 5,317,836
- Issue date Jun 7, 1994
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and an apparatus for polishing wafer chamfers
- Patent number 5,316,620
- Issue date May 31, 1994
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic wafer transfer apparatus and a method for transferring wa...
- Patent number 5,298,111
- Issue date Mar 29, 1994
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scrubber apparatus for cleaning a thin disk work
- Patent number 5,282,289
- Issue date Feb 1, 1994
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B08 - CLEANING
Information Patent Grant
Automatic wafer etching method and apparatus
- Patent number 5,246,528
- Issue date Sep 21, 1993
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic wafer lapping apparatus
- Patent number 5,174,067
- Issue date Dec 29, 1992
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for producing czochralski-grown single crystals
- Patent number 5,126,113
- Issue date Jun 30, 1992
- Shin-Etsu Handotai Co., Ltd.
- Hirotoshi Yamagishi
- C30 - CRYSTAL GROWTH

Fumihiko Hasegawa

Person

Patents Grantslast 30 patents

Method of and apparatus for mirror-like polishing wafer chamfer wit...

Method and apparatus for wafer chamfer polishing

Method of and apparatus for mirror-like polishing wafer chamfer wit...

Apparatus for polishing peripheral portion of wafer

Method of producing slices

Workpiece holding mechanism

Wafer processing method and equipment therefor

Apparatus for mirror-polishing thin plate

Apparatus for polishing wafers

Apparatus for polishing peripheral portion of wafer

Apparatus for polishing the notch of a wafer

Method for mirror-polishing chamfered portion of wafer and mirror-p...

Method of manufacturing semiconductor wafers and process of and app...

Method and apparatus for wafer chamfer polishing

Apparatus for bevelling wafer-edge

Apparatus and method for chamfering the peripheral edge of a wafer...

Apparatus for polishing the periphery portion of a wafer

Apparatus for polishing notch portion of wafer

Polishing apparatus for notch portion of wafer

Wafer chamfer polishing apparatus with rotary circular dividing table

Apparatus for polishing chamfers of a wafer

Method and an apparatus for polishing wafer chamfers

Automatic wafer transfer apparatus and a method for transferring wa...

Scrubber apparatus for cleaning a thin disk work

Automatic wafer etching method and apparatus

Automatic wafer lapping apparatus

Apparatus for producing czochralski-grown single crystals