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Fumihiko Taniguchi
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Kawasaki, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Fingerprint sensor apparatus and manufacturing method thereof
Patent number
7,192,798
Issue date
Mar 20, 2007
Fujitsu Limited
Akira Okada
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multi chip package structure having a plurality of semiconductor ch...
Patent number
6,972,487
Issue date
Dec 6, 2005
Fujitsu Limited
Yoshiharu Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having an interconnecting post formed on an in...
Patent number
6,812,066
Issue date
Nov 2, 2004
Fujitsu Limited
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a built-in contact-type sensor and manu...
Patent number
6,670,221
Issue date
Dec 30, 2003
Fujitsu Limited
Hideharu Sakoda
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device having an interconnecting post formed on an in...
Patent number
6,489,676
Issue date
Dec 3, 2002
Fujitsu Limited
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having bonding wires serving as external conne...
Patent number
6,472,746
Issue date
Oct 29, 2002
Fujitsu Limited
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and structure and method for mounting the same
Patent number
6,404,062
Issue date
Jun 11, 2002
Fujitsu Limited
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having protruding electrodes higher than a sea...
Patent number
6,388,333
Issue date
May 14, 2002
Fujitsu Limited
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing solder bumps and solder joints using formic...
Patent number
6,344,407
Issue date
Feb 5, 2002
Fujitsu Limited
Hirohisa Matsuki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating semiconductor having through hole
Patent number
6,291,895
Issue date
Sep 18, 2001
Fujitsu Limited
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin molded semiconductor device and method of manufacturing semic...
Patent number
6,166,433
Issue date
Dec 26, 2000
Fujitsu Limited
Akira Takashima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having an insulating substrate
Patent number
6,160,313
Issue date
Dec 12, 2000
Fujitsu Limited
Akira Takashima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor having through hole
Patent number
5,953,592
Issue date
Sep 14, 1999
Fujitsu Limited
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
Publication number
20060226529
Publication date
Oct 12, 2006
FUJITSU LIMITED
Yoshiharu Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
Publication number
20050161794
Publication date
Jul 28, 2005
FUJITSU LIMITED
Yoshiharu Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having a built-in contact-type sensor and manu...
Publication number
20030178714
Publication date
Sep 25, 2003
FUJITSU LIMITED
Hideharu Sakoda
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Fingerprint sensor apparatus and manufacturing method thereof
Publication number
20030156743
Publication date
Aug 21, 2003
FUJITSU LIMITED
Akira Okada
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Semiconductor device having an interconnecting post formed on an in...
Publication number
20030042564
Publication date
Mar 6, 2003
FUJITSU LIMITED
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
Publication number
20020140107
Publication date
Oct 3, 2002
FUJITSU LIMITED
Yoshiharu Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having an interconnecting post formed on an in...
Publication number
20020066952
Publication date
Jun 6, 2002
FUJITSU LIMITED
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having bonding wires serving as external conne...
Publication number
20020017719
Publication date
Feb 14, 2002
FUJITSU LIMITED
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of fabricating semiconductor having through hole
Publication number
20010028101
Publication date
Oct 11, 2001
FUJITSU LIMITED
Fumihiko Taniguchi
H01 - BASIC ELECTRIC ELEMENTS