Fumiko Yamashita

Person

Kurokawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 10,923,329
- Issue date Feb 16, 2021
- Tokyo Electron Limited
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and substrate processing apparatus
- Patent number 9,882,124
- Issue date Jan 30, 2018
- Tokyo Electron Limited
- Eiichi Nishimura
- C21 - METALLURGY OF IRON
Information Patent Grant
Etching apparatus
- Patent number 9,691,643
- Issue date Jun 27, 2017
- Tokyo Electron Limited
- Eiichi Nishimura
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 9,660,182
- Issue date May 23, 2017
- Tokyo Electron Limited
- Takashi Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and substrate processing apparatus
- Patent number 9,419,211
- Issue date Aug 16, 2016
- Tokyo Electron Limited
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern forming method
- Patent number 9,412,618
- Issue date Aug 9, 2016
- Tokyo Electron Limited
- Shinya Morikita
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,245,764
- Issue date Jan 26, 2016
- Tokyo Electron Limited
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming a periodic pattern using a self-as...
- Patent number 9,234,083
- Issue date Jan 12, 2016
- Tokyo Electron Limited
- Eiichi Nishimura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of etching copper layer and mask
- Patent number 9,208,997
- Issue date Dec 8, 2015
- Tokyo Electron Limited
- Eiichi Nishimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing method and manufacturing method of semiconductor...
- Patent number 9,177,781
- Issue date Nov 3, 2015
- Tokyo Electron Limited
- Shigeru Tahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and storage medium
- Patent number 9,165,784
- Issue date Oct 20, 2015
- Tokyo Electron Limited
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching metal layer
- Patent number 9,150,969
- Issue date Oct 6, 2015
- Tokyo Electron Limited
- Eiichi Nishimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method and etching apparatus
- Patent number 8,877,081
- Issue date Nov 4, 2014
- Tokyo Electron Limited
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and storage medium
- Patent number 8,778,206
- Issue date Jul 15, 2014
- Tokyo Electron Limited
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 8,383,521
- Issue date Feb 26, 2013
- Tokyo Electron Limited
- Eiichi Nishimura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20200111646
- Publication date Apr 9, 2020
- TOKYO ELECTRON LIMITED
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20160203998
- Publication date Jul 14, 2016
- TOKYO ELECTRON LIMITED
- Toshikatsu TOBANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN FORMING METHOD
- Publication number 20160042970
- Publication date Feb 11, 2016
- TOKYO ELECTRON LIMITED
- Shinya Morikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20150214474
- Publication date Jul 30, 2015
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20150132970
- Publication date May 14, 2015
- TOKYO ELECTRON LIMITED
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20150079790
- Publication date Mar 19, 2015
- TOKYO ELECTRON LIMITED
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20150050750
- Publication date Feb 19, 2015
- TOKYO ELECTRON LIMITED
- Takashi Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FORMING A PERIODIC PATTERN USING A SELF-AS...
- Publication number 20150048049
- Publication date Feb 19, 2015
- TOKYO ELECTRON LIMITED
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING APPARATUS
- Publication number 20150013908
- Publication date Jan 15, 2015
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ETCHING METAL LAYER
- Publication number 20140251945
- Publication date Sep 11, 2014
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20140120635
- Publication date May 1, 2014
- TOKYO ELECTRON LIMITED
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ETCHING COPPER LAYER AND MASK
- Publication number 20140110373
- Publication date Apr 24, 2014
- Eiichi Nishimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20130196511
- Publication date Aug 1, 2013
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- B82 - NANO-TECHNOLOGY
Information Patent Application
SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM
- Publication number 20120244718
- Publication date Sep 27, 2012
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM
- Publication number 20120214315
- Publication date Aug 23, 2012
- TOKYO ELECTRON LIMITED
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR...
- Publication number 20120009786
- Publication date Jan 12, 2012
- Kabushiki Kaisha Toshiba
- Shigeru TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR RECOVERING PATTERN ON SILICON SUBSTRATE
- Publication number 20110174337
- Publication date Jul 21, 2011
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS
- Publication number 20110168205
- Publication date Jul 14, 2011
- TOKYO ELECTRON LIMITED
- Shigeru TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20100233883
- Publication date Sep 16, 2010
- TOKYO ELECTON LIMITED
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Fumiko Yamashita

Person

Patents Grantslast 30 patents

Substrate processing apparatus and substrate processing method

Etching method and substrate processing apparatus

Etching apparatus

Plasma processing method and plasma processing apparatus

Etching method and substrate processing apparatus

Pattern forming method

Semiconductor device manufacturing method

Method and apparatus for forming a periodic pattern using a self-as...

Method of etching copper layer and mask

Plasma processing method and manufacturing method of semiconductor...

Substrate processing method and storage medium

Method of etching metal layer

Etching method and etching apparatus

Substrate processing method and storage medium

Substrate processing method

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

ETCHING METHOD

PATTERN FORMING METHOD

ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

METHOD AND APPARATUS FOR FORMING A PERIODIC PATTERN USING A SELF-AS...

ETCHING APPARATUS

METHOD OF ETCHING METAL LAYER

ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD OF ETCHING COPPER LAYER AND MASK

ETCHING METHOD AND ETCHING APPARATUS

SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM

SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM

PLASMA PROCESSING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR...

METHOD AND APPARATUS FOR RECOVERING PATTERN ON SILICON SUBSTRATE

SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS

SUBSTRATE PROCESSING METHOD