Fumio Echigo

Person

Osaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer printed wiring board and mounting body using the same
- Patent number 8,395,056
- Issue date Mar 12, 2013
- Panasonic Corporation
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid printed circuit board and method of manufacturing the same
- Patent number 8,134,082
- Issue date Mar 13, 2012
- Panasonic Corporation
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and its manufacturing method
- Patent number 8,076,589
- Issue date Dec 13, 2011
- Panasonic Corporation
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and manufacturing method thereof
- Patent number 7,956,293
- Issue date Jun 7, 2011
- Panasonic Corporation
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a double-sided circuit board
- Patent number 7,174,632
- Issue date Feb 13, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Kawakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 7,155,820
- Issue date Jan 2, 2007
- Matsushita Electric Industrial Co., Ltd.
- Daizo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 7,132,029
- Issue date Nov 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing a circuit board
- Patent number 7,103,971
- Issue date Sep 12, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask film, its manufacturing method, and manufacturing method of ci...
- Patent number 7,066,344
- Issue date Jun 27, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshiaki Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 7,047,629
- Issue date May 23, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shinobu Kokufu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg and circuit board and method for manufacturing the same
- Patent number 7,045,198
- Issue date May 16, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasushi Nakagiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 7,018,705
- Issue date Mar 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 6,996,902
- Issue date Feb 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor sheet, method for producing the same, board with built-in...
- Patent number 6,916,706
- Issue date Jul 12, 2005
- Matsushita Electric Industrial Co, Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin board, manufacturing process for resin board, connection medi...
- Patent number 6,866,892
- Issue date Mar 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing the same
- Patent number 6,799,369
- Issue date Oct 5, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor sheet with built in capacitors
- Patent number 6,756,628
- Issue date Jun 29, 2004
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 6,753,483
- Issue date Jun 22, 2004
- Matsushita Electric Industrial Co., Ltd.
- Daizo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable film, a substrate with film, a process for forming the re...
- Patent number 6,745,464
- Issue date Jun 8, 2004
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having an interstitial inner via hole structure
- Patent number 6,734,375
- Issue date May 11, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Kawakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and its manufacture method
- Patent number 6,713,688
- Issue date Mar 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shinobu Kokufu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask film having a non-parting portion
- Patent number 6,694,612
- Issue date Feb 24, 2004
- Matsushita Electric Industrial Co., Ltd.
- Toshiaki Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a circuit board
- Patent number 6,691,409
- Issue date Feb 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 6,686,029
- Issue date Feb 3, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin board, manufacturing process for resin board, connection medi...
- Patent number 6,596,381
- Issue date Jul 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 6,558,780
- Issue date May 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable film, a substrate with film, a process for forming the re...
- Patent number 6,546,624
- Issue date Apr 15, 2003
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production of the same
- Patent number 6,518,514
- Issue date Feb 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing the same
- Patent number 6,459,046
- Issue date Oct 1, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic recording medium
- Patent number 6,037,037
- Issue date Mar 14, 2000
- Matsushita Electric Industrial Co., Ltd.
- Kazunori Kubota
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20110030207
- Publication date Feb 10, 2011
- PANASONIC CORPORATION
- Fumio ECHIGO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MOUNTING BODY USING THE SAME
- Publication number 20100276187
- Publication date Nov 4, 2010
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20100230138
- Publication date Sep 16, 2010
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100170700
- Publication date Jul 8, 2010
- PANASONIC CORPORATION
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090229862
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20090139761
- Publication date Jun 4, 2009
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Wiring Board and Its Manufacturing Method
- Publication number 20080308304
- Publication date Dec 18, 2008
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Printed Wiring Board And Manufacturing Method For Same
- Publication number 20080121416
- Publication date May 29, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shogo Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin board, manufacturing process for resin board, connection medi...
- Publication number 20060283626
- Publication date Dec 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer circuit board and method for manufacturing the same
- Publication number 20060008628
- Publication date Jan 12, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin board, manufacturing process for resin board, connection medi...
- Publication number 20050139384
- Publication date Jun 30, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate for intermediate connection and multi-layered wiri...
- Publication number 20050016764
- Publication date Jan 27, 2005
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer circuit board and method for manufacturing the same
- Publication number 20040231151
- Publication date Nov 25, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Member for a circuit board, method of manufacturing the same, and m...
- Publication number 20040214006
- Publication date Oct 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kumiko Hirayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor sheet, method for producing the same, board with built-in...
- Publication number 20040201367
- Publication date Oct 14, 2004
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board electrically insulating material, circuit board and m...
- Publication number 20040142161
- Publication date Jul 22, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Kawakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20040089471
- Publication date May 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Daizo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and its manufacture method
- Publication number 20040080918
- Publication date Apr 29, 2004
- MUTSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Shinobu Kokufu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin board, manufacturing process for resin board, connection medi...
- Publication number 20040005443
- Publication date Jan 8, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Removable film, a substrate with film, a process for forming the re...
- Publication number 20030188428
- Publication date Oct 9, 2003
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same
- Publication number 20030170434
- Publication date Sep 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same
- Publication number 20030157307
- Publication date Aug 21, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mask film, its manufacturing method, and manufacturing method of ci...
- Publication number 20030153197
- Publication date Aug 14, 2003
- Matsushita Electric Industrial Co., Ltd.
- Toshiaki Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030137815
- Publication date Jul 24, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prepreg and circuit board and method for manufacturing the same
- Publication number 20030082363
- Publication date May 1, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yasushi Nakagiri
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit board and production of the same
- Publication number 20030066683
- Publication date Apr 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Non-woven fabric material and prepreg, and circuit board using the...
- Publication number 20030045164
- Publication date Mar 6, 2003
- Fumio Echigo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Printed circuit board and method for producing the same
- Publication number 20020192485
- Publication date Dec 19, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shozo Ochi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Capacitor sheet, method for producing the same, board with built-in...
- Publication number 20020182804
- Publication date Dec 5, 2002
- Matsushita Electric Industrial Co. Ltd.
- Fumio Echigo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board and its manufacture method
- Publication number 20020131248
- Publication date Sep 19, 2002
- Shinobu Kokufu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Fumio Echigo

Person

Patents Grantslast 30 patents

Multilayer printed wiring board and mounting body using the same

Solid printed circuit board and method of manufacturing the same

Multilayer wiring board and its manufacturing method

Multilayer printed wiring board and manufacturing method thereof

Method of manufacturing a double-sided circuit board

Method for manufacturing printed circuit board

Multilayer circuit board and method for manufacturing the same

Process for manufacturing a circuit board

Mask film, its manufacturing method, and manufacturing method of ci...

Method of manufacturing circuit board

Prepreg and circuit board and method for manufacturing the same

Multilayer circuit board and method for manufacturing the same

Method for manufacturing a circuit board

Capacitor sheet, method for producing the same, board with built-in...

Resin board, manufacturing process for resin board, connection medi...

Printed circuit board and method for producing the same

Capacitor sheet with built in capacitors

Printed circuit board and method of manufacturing the same

Removable film, a substrate with film, a process for forming the re...

Circuit board having an interstitial inner via hole structure

Circuit board and its manufacture method

Mask film having a non-parting portion

Method of producing a circuit board

Circuit board and method for manufacturing the same

Resin board, manufacturing process for resin board, connection medi...

Circuit board and method for manufacturing the same

Removable film, a substrate with film, a process for forming the re...

Circuit board and production of the same

Printed circuit board and method for producing the same

Magnetic recording medium

Patents Applicationslast 30 patents

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYER PRINTED WIRING BOARD AND MOUNTING BODY USING THE SAME

WIRING BOARD

SOLID PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

Multilayer Wiring Board and Its Manufacturing Method

Multilayer Printed Wiring Board And Manufacturing Method For Same

Resin board, manufacturing process for resin board, connection medi...

Multilayer circuit board and method for manufacturing the same

Resin board, manufacturing process for resin board, connection medi...

Wiring substrate for intermediate connection and multi-layered wiri...

Multilayer circuit board and method for manufacturing the same

Member for a circuit board, method of manufacturing the same, and m...

Capacitor sheet, method for producing the same, board with built-in...

Circuit board electrically insulating material, circuit board and m...

Printed circuit board and method of manufacturing the same

Circuit board and its manufacture method

Resin board, manufacturing process for resin board, connection medi...

Removable film, a substrate with film, a process for forming the re...

Circuit board and method for manufacturing the same

Circuit board and method for manufacturing the same

Mask film, its manufacturing method, and manufacturing method of ci...

Printed wiring board and method of manufacturing the same

Prepreg and circuit board and method for manufacturing the same

Circuit board and production of the same

Non-woven fabric material and prepreg, and circuit board using the...

Printed circuit board and method for producing the same

Capacitor sheet, method for producing the same, board with built-in...

Circuit board and its manufacture method