Claims
- 1. A method for producing a printed circuit board comprising:laminating release films on both surfaces of an electrical insulating base material, the electrical insulating base material comprising a core layer including a prepreg formed by impregnating a holder with a resin and resin layers that are formed on both sides of the core layer and have different thicknesses from each other; providing through holes in a thickness direction of the electrical insulating base material; filling the through holes with an electrically conductive paste; superposing a wiring base material, on which a wiring layer is formed into a predetermined pattern so as to correspond to a portion filled with the electrically conductive paste, on at least one surface of the electrical insulating base material; and embedding the wiring layer in at least one of the resin layers on the electrical insulating base material by heating and compressing the electrical insulating base material on which the wiring base material has been superposed.
- 2. The method for producing the printed circuit board according to claim 1, wherein a thinner layer out of the resin layers has a thickness substantially equal to or smaller than a mean particle diameter of the electrically conductive filler contained in the electrically conductive paste.
- 3. The method for producing the printed circuit board according to claim 1, wherein the resin layers formed on both sides of the core layer have a thickness equal to or smaller than that of the wiring layer embedded in the resin layers.
- 4. The method for producing the printed circuit board according to claim 1, wherein the through holes are formed by a laser beam irradiation.
- 5. The method for producing the printed circuit board according to claim 1, wherein one of the resin layers on the both sides is more than one and less than ten times as thick as the other.
- 6. The method for producing the printed circuit board according to claim 5, wherein one of the resin layers on the both sides is two to four times as thick as the other.
- 7. The method for producing the printed circuit board according to claim 1, wherein the holder is a glass cloth, and the resin is a thermosetting epoxy resin.
- 8. The method for producing the printed circuit board according to claim 1, wherein a plurality of the printed circuit boards are laminated.
- 9. The method for producing the printed circuit board according to claim 1, wherein the wiring base material comprises a glass-epoxy base material that has through holes filled with an electrically conductive paste and at least one surface on which the wiring layer is formed.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2000-257260 |
Aug 2000 |
JP |
|
Parent Case Info
This application is a divisional of application Ser. No. 09/919,319, filed Jul. 31, 2001 U.S. Pat. No. 6,459,046, which application(s) are incorporated herein by reference.
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