Fumio Yamamoto

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Sano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
High-frequency hermetically-sealed circuit package
- Patent number 7,838,990
- Issue date Nov 23, 2010
- Kabushiki Kaisha Toshiba
- Fumio Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency module
- Patent number 7,792,503
- Issue date Sep 7, 2010
- Kabushiki Kaisha Toshiba
- Fumio Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency package and the method for manufacturing the same
- Patent number 6,559,533
- Issue date May 6, 2003
- Kabushiki Kaisha Toshiba
- Fumio Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20090127675
- Publication date May 21, 2009
- Kabushiki Kaisha Toshiba
- Fumio Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE
- Publication number 20070232247
- Publication date Oct 4, 2007
- KABUSHIKI KAISHA TOSHIBA
- Fumio Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20070230145
- Publication date Oct 4, 2007
- KABUSHIKI KAISHA TOSHIBA
- Fumio Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR