BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded perspective view schematically showing a configuration of a high frequency module according to a first embodiment of the present invention;
FIG. 2 is a plan view showing a part of the high frequency module of FIG. 1;
FIG. 3 is a cross-sectional view taken along the line A-A of FIG. 2;
FIG. 4 is an illustrative view showing various design values of the high frequency module in a case of setting characteristic impedance at 50Ω;
FIG. 5 is an exploded perspective view schematically showing a configuration of a high frequency module according to a second embodiment of the present invention;
FIG. 6 is a cross-sectional view showing a part of the high frequency module of FIG. 5; and
FIG. 7 is a cross-sectional view showing a part of a high frequency module according to a third embodiment of the present invention.