Fumitaka Amano

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio via fill process employing selective metal deposi...
- Patent number 12,087,626
- Issue date Sep 10, 2024
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio via fill process employing selective metal deposi...
- Patent number 12,087,628
- Issue date Sep 10, 2024
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including aluminum alloy word lines...
- Patent number 11,990,413
- Issue date May 21, 2024
- SanDisk Technologies LLC
- Linghan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing self-aligned bit line co...
- Patent number 11,935,784
- Issue date Mar 19, 2024
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing self-aligned lateral con...
- Patent number 11,637,038
- Issue date Apr 25, 2023
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier three-dimensional memory device with nested contact via...
- Patent number 11,488,975
- Issue date Nov 1, 2022
- SanDisk Technologies LLC
- Yuji Totoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing word lines formed by sel...
- Patent number 11,437,270
- Issue date Sep 6, 2022
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device containing tubular liner spacer for lateral co...
- Patent number 11,309,402
- Issue date Apr 19, 2022
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier for CMOS under array type memory device and met...
- Patent number 11,296,112
- Issue date Apr 5, 2022
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal metal chemical vapor deposition process
- Patent number 10,662,522
- Issue date May 26, 2020
- SanDisk Technologies LLC
- Fumitaka Amano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Three-dimensional memory device containing word lines formed by sel...
- Patent number 10,529,620
- Issue date Jan 7, 2020
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten growth for word lines of a three-dimensional mem...
- Patent number 10,381,372
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device containing multilayer wordline barr...
- Patent number 10,361,213
- Issue date Jul 23, 2019
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing composite word lines inc...
- Patent number 10,276,583
- Issue date Apr 30, 2019
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device containing multilayer titanium nitride diffusi...
- Patent number 10,115,735
- Issue date Oct 30, 2018
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having non-uniform spacing among me...
- Patent number 9,929,174
- Issue date Mar 27, 2018
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having multi-layer diffusion barrie...
- Patent number 9,748,174
- Issue date Aug 29, 2017
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE CONTAINING DIVOT-FILL DIELECTRIC BARRIER FOR M...
- Publication number 20240282710
- Publication date Aug 22, 2024
- SANDISK TECHNOLOGIES LLC
- Linghan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE BACKSIDE METAL...
- Publication number 20230402387
- Publication date Dec 14, 2023
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE BACKSIDE METAL...
- Publication number 20230403850
- Publication date Dec 14, 2023
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING BONDING PADS WITH METAL OXIDE BARRIERS A...
- Publication number 20230361069
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...
- Publication number 20230361061
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Shingo TOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...
- Publication number 20230130849
- Publication date Apr 27, 2023
- SANDISK TECHNOLOGIES LLC
- Takashi YAMAHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...
- Publication number 20230129594
- Publication date Apr 27, 2023
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...
- Publication number 20230128326
- Publication date Apr 27, 2023
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING ALUMINUM ALLOY WORD LINES...
- Publication number 20230051815
- Publication date Feb 16, 2023
- SANDISK TECHNOLOGIES LLC
- Linghan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED BIT LINE CO...
- Publication number 20220399232
- Publication date Dec 15, 2022
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED LATERAL CON...
- Publication number 20220230917
- Publication date Jul 21, 2022
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICE WITH NESTED CONTACT VIA...
- Publication number 20220130852
- Publication date Apr 28, 2022
- SANDISK TECHNOLOGIES LLC
- Yuji TOTOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONTAINING TUBULAR LINER SPACER FOR LATERAL CO...
- Publication number 20210280686
- Publication date Sep 9, 2021
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER FOR CMOS UNDER ARRAY TYPE MEMORY DEVICE AND MET...
- Publication number 20200258909
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL METAL CHEMICAL VAPOR DEPOSITION PROCESS
- Publication number 20200149153
- Publication date May 14, 2020
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMAL METAL CHEMICAL VAPOR DEPOSITION APPARATUS AND PROCESS
- Publication number 20200149164
- Publication date May 14, 2020
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WORD LINES FORMED BY SEL...
- Publication number 20200105595
- Publication date Apr 2, 2020
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER FOR CMOS UNDER ARRAY TYPE MEMORY DEVICE AND MET...
- Publication number 20180331118
- Publication date Nov 15, 2018
- SanDisk Technologies LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONTAINING MULTILAYER TITANIUM NITRIDE DIFFUSI...
- Publication number 20180247954
- Publication date Aug 30, 2018
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WORD LINES FORMED BY SEL...
- Publication number 20180090373
- Publication date Mar 29, 2018
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE WORD LINES INC...
- Publication number 20180033646
- Publication date Feb 1, 2018
- SanDisk Technologies LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TUNGSTEN GROWTH FOR WORD LINES OF A THREE-DIMENSIONAL MEM...
- Publication number 20180019256
- Publication date Jan 18, 2018
- SanDisk Technologies LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE CONTAINING MULTILAYER WORDLINE BARR...
- Publication number 20170373079
- Publication date Dec 28, 2017
- SanDisk Technologies LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE CHAMBER MULTI-PARTITION DEPOSITION TOOL AND METHOD OF OPERAT...
- Publication number 20170247794
- Publication date Aug 31, 2017
- SanDisk Technologies LLC
- Yusuke MUKAE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Fumitaka Amano

Person

Patents Grantslast 30 patents

High aspect ratio via fill process employing selective metal deposi...

High aspect ratio via fill process employing selective metal deposi...

Three-dimensional memory device including aluminum alloy word lines...

Three-dimensional memory device containing self-aligned bit line co...

Three-dimensional memory device containing self-aligned lateral con...

Multi-tier three-dimensional memory device with nested contact via...

Three-dimensional memory device containing word lines formed by sel...

Semiconductor device containing tubular liner spacer for lateral co...

Multi-layer barrier for CMOS under array type memory device and met...

Thermal metal chemical vapor deposition process

Three-dimensional memory device containing word lines formed by sel...

Selective tungsten growth for word lines of a three-dimensional mem...

Three dimensional memory device containing multilayer wordline barr...

Three-dimensional memory device containing composite word lines inc...

Semiconductor device containing multilayer titanium nitride diffusi...

Three-dimensional memory device having non-uniform spacing among me...

Three-dimensional memory device having multi-layer diffusion barrie...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE CONTAINING DIVOT-FILL DIELECTRIC BARRIER FOR M...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE BACKSIDE METAL...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE BACKSIDE METAL...

BONDED ASSEMBLY CONTAINING BONDING PADS WITH METAL OXIDE BARRIERS A...

SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...

HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...

HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...

HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING ALUMINUM ALLOY WORD LINES...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED BIT LINE CO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED LATERAL CON...

MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICE WITH NESTED CONTACT VIA...

SEMICONDUCTOR DEVICE CONTAINING TUBULAR LINER SPACER FOR LATERAL CO...

MULTI-LAYER BARRIER FOR CMOS UNDER ARRAY TYPE MEMORY DEVICE AND MET...

THERMAL METAL CHEMICAL VAPOR DEPOSITION PROCESS

THERMAL METAL CHEMICAL VAPOR DEPOSITION APPARATUS AND PROCESS

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WORD LINES FORMED BY SEL...

MULTI-LAYER BARRIER FOR CMOS UNDER ARRAY TYPE MEMORY DEVICE AND MET...

SEMICONDUCTOR DEVICE CONTAINING MULTILAYER TITANIUM NITRIDE DIFFUSI...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WORD LINES FORMED BY SEL...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE WORD LINES INC...

SELECTIVE TUNGSTEN GROWTH FOR WORD LINES OF A THREE-DIMENSIONAL MEM...

THREE DIMENSIONAL MEMORY DEVICE CONTAINING MULTILAYER WORDLINE BARR...

SINGLE CHAMBER MULTI-PARTITION DEPOSITION TOOL AND METHOD OF OPERAT...