Fusen E. Chen

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 10,047,430
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a diffusion barrier layer and a metal conduct...
- Patent number 9,991,157
- Issue date Jun 5, 2018
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a diffusion barrier layer and a metal conduct...
- Patent number 9,390,970
- Issue date Jul 12, 2016
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,696,875
- Issue date Apr 15, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,668,816
- Issue date Mar 11, 2014
- Applied Materials Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a uniform barrier layer and metal seed layer w...
- Patent number 8,158,511
- Issue date Apr 17, 2012
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a uniform metal seed layer over a plurality of...
- Patent number 7,989,343
- Issue date Aug 2, 2011
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer over recessed feature surfa...
- Patent number 7,795,138
- Issue date Sep 14, 2010
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal / metal nitride barrier layer for semiconductor device applic...
- Patent number 7,687,909
- Issue date Mar 30, 2010
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a sculptured copper seed layer
- Patent number 7,589,016
- Issue date Sep 15, 2009
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for forming barrier layers in high aspect rat...
- Patent number 7,547,644
- Issue date Jun 16, 2009
- Applied Materials, Inc.
- Fusen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer on semiconductor substrates
- Patent number 7,381,639
- Issue date Jun 3, 2008
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering using an unbalanced magnetron
- Patent number 7,335,282
- Issue date Feb 26, 2008
- Jianming Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputter deposition and etching of metallization seed layer for over...
- Patent number 7,294,574
- Issue date Nov 13, 2007
- Applied Materials, Inc.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a tantalum nitride/tantalum diffusion barrier...
- Patent number 7,253,109
- Issue date Aug 7, 2007
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fully planarized dual damascene metallization using copper line int...
- Patent number 7,112,528
- Issue date Sep 26, 2006
- Applied Materials, Inc.
- Liang-Yuh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a metal seed layer on semiconductor substrates
- Patent number 7,074,714
- Issue date Jul 11, 2006
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reliability barrier integration for Cu application
- Patent number 7,026,238
- Issue date Apr 11, 2006
- Applied Materials, Inc.
- Ming Xi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step magnetron sputtering process
- Patent number 6,991,709
- Issue date Jan 31, 2006
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for forming barrier layers in high aspect rat...
- Patent number 6,974,771
- Issue date Dec 13, 2005
- Applied Materials, Inc.
- Fusen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of preventing diffusion of copper through a tantalum-compris...
- Patent number 6,919,275
- Issue date Jul 19, 2005
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of application of electrical biasing to enhance metal deposi...
- Patent number 6,913,680
- Issue date Jul 5, 2005
- Applied Materials, Inc.
- Bo Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially filling copper seed layer
- Patent number 6,899,796
- Issue date May 31, 2005
- Applied Materials, Inc.
- Wei D. Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion enhanced ion plating for copper fill
- Patent number 6,884,329
- Issue date Apr 26, 2005
- Applied Materials, Inc.
- Wei D. Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for improved electroplating fill of an aperture
- Patent number 6,797,620
- Issue date Sep 28, 2004
- Applied Materials, Inc.
- John S. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self ionized sputtering using a high density plasma source
- Patent number 6,790,323
- Issue date Sep 14, 2004
- Applied Materials, Inc.
- Jianming Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Operating a magnetron sputter reactor in two modes
- Patent number 6,787,006
- Issue date Sep 7, 2004
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for forming barrier layers in high aspect rat...
- Patent number 6,784,096
- Issue date Aug 31, 2004
- Applied Materials, Inc.
- Fusen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Damage-free sculptured coating deposition
- Patent number 6,758,947
- Issue date Jul 6, 2004
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature integrated metallization process and apparatus
- Patent number 6,743,714
- Issue date Jun 1, 2004
- Applied Materials, Inc.
- Roderick Craig Mosely
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCT...
- Publication number 20160322255
- Publication date Nov 3, 2016
- Applied Materials, Inc.
- Tony CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20140305802
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a uniform barrier layer and metal seed layer w...
- Publication number 20110256716
- Publication date Oct 20, 2011
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a uniform metal seed layer over a plurality of...
- Publication number 20100255678
- Publication date Oct 7, 2010
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer over recessed feature surfa...
- Publication number 20090269922
- Publication date Oct 29, 2009
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20090233438
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Peijun DING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a diffusion barrier layer which provides an im...
- Publication number 20090053888
- Publication date Feb 26, 2009
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a sculptured copper seed layer
- Publication number 20080166869
- Publication date Jul 10, 2008
- APPLIED MATERIALS, INC.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20080110747
- Publication date May 15, 2008
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal / metal nitride barrier layer for semiconductor device applic...
- Publication number 20070241458
- Publication date Oct 18, 2007
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Damage-free sculptured coating deposition
- Publication number 20070178682
- Publication date Aug 2, 2007
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RELIABILITY BARRIER INTEGRATION FOR CU APPLICATION
- Publication number 20070151861
- Publication date Jul 5, 2007
- Ming Xi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Controlled multi-step magnetron sputtering process
- Publication number 20070095654
- Publication date May 3, 2007
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer on semiconductor substrates
- Publication number 20070020922
- Publication date Jan 25, 2007
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and apparatus for forming barrier layers in high aspect rat...
- Publication number 20060057843
- Publication date Mar 16, 2006
- APPLIED MATERIALS, INC.
- Fusen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputter deposition and etching of metallization seed layer for over...
- Publication number 20060030151
- Publication date Feb 9, 2006
- APPLIED MATERIALS, INC.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing low resistivity barrier layers for copper inte...
- Publication number 20050272254
- Publication date Dec 8, 2005
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and apparatus for forming barrier layers in high aspect rat...
- Publication number 20050266682
- Publication date Dec 1, 2005
- APPLIED MATERIALS, INC.
- Fusen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Controlled multi-step magnetron sputtering process
- Publication number 20050255700
- Publication date Nov 17, 2005
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050255691
- Publication date Nov 17, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a tantalum nitride / tantalum diffusion barrie...
- Publication number 20050208767
- Publication date Sep 22, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer on semiconductor substrates
- Publication number 20050085068
- Publication date Apr 21, 2005
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-step magnetron sputtering process
- Publication number 20050056536
- Publication date Mar 17, 2005
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering using an unbalanced magnetron
- Publication number 20050051424
- Publication date Mar 10, 2005
- Jianming Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing a diffusion barrier layer and a metal conducti...
- Publication number 20050020080
- Publication date Jan 27, 2005
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050006222
- Publication date Jan 13, 2005
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and apparatus for forming barrier layers in high aspect rat...
- Publication number 20040266175
- Publication date Dec 30, 2004
- APPLIED MATERIALS, INC.
- Fusen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oblique ion milling of via metallization
- Publication number 20040222082
- Publication date Nov 11, 2004
- APPLIED MATERIALS, INC.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reliability barrier integration for Cu application
- Publication number 20040209460
- Publication date Oct 21, 2004
- Ming Xi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Fusen E. Chen

Person

Patents Grantslast 30 patents

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method for depositing a diffusion barrier layer and a metal conduct...

Method for depositing a diffusion barrier layer and a metal conduct...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method of depositing a uniform barrier layer and metal seed layer w...

Method of depositing a uniform metal seed layer over a plurality of...

Method of depositing a metal seed layer over recessed feature surfa...

Metal / metal nitride barrier layer for semiconductor device applic...

Method of depositing a sculptured copper seed layer

Methods and apparatus for forming barrier layers in high aspect rat...

Method of depositing a metal seed layer on semiconductor substrates

Sputtering using an unbalanced magnetron

Sputter deposition and etching of metallization seed layer for over...

Method of depositing a tantalum nitride/tantalum diffusion barrier...

Fully planarized dual damascene metallization using copper line int...

Method of depositing a metal seed layer on semiconductor substrates

Reliability barrier integration for Cu application

Multi-step magnetron sputtering process

Methods and apparatus for forming barrier layers in high aspect rat...

Method of preventing diffusion of copper through a tantalum-compris...

Method of application of electrical biasing to enhance metal deposi...

Partially filling copper seed layer

Diffusion enhanced ion plating for copper fill

Method and apparatus for improved electroplating fill of an aperture

Self ionized sputtering using a high density plasma source

Operating a magnetron sputter reactor in two modes

Methods and apparatus for forming barrier layers in high aspect rat...

Damage-free sculptured coating deposition

Low temperature integrated metallization process and apparatus

Patents Applicationslast 30 patents

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCT...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Method of depositing a uniform barrier layer and metal seed layer w...

Method of depositing a uniform metal seed layer over a plurality of...

Method of depositing a metal seed layer over recessed feature surfa...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Method of depositing a diffusion barrier layer which provides an im...

Method of depositing a sculptured copper seed layer

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Metal / metal nitride barrier layer for semiconductor device applic...

Damage-free sculptured coating deposition

RELIABILITY BARRIER INTEGRATION FOR CU APPLICATION

Controlled multi-step magnetron sputtering process

Method of depositing a metal seed layer on semiconductor substrates

Methods and apparatus for forming barrier layers in high aspect rat...

Sputter deposition and etching of metallization seed layer for over...

Method of depositing low resistivity barrier layers for copper inte...

Methods and apparatus for forming barrier layers in high aspect rat...

Controlled multi-step magnetron sputtering process

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method of depositing a tantalum nitride / tantalum diffusion barrie...

Method of depositing a metal seed layer on semiconductor substrates

Multi-step magnetron sputtering process

Sputtering using an unbalanced magnetron

Method of depositing a diffusion barrier layer and a metal conducti...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Methods and apparatus for forming barrier layers in high aspect rat...

Oblique ion milling of via metallization

Reliability barrier integration for Cu application