Futoshi Fukaya

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mold for resin molding, resin molding apparatus, and semiconductor...
- Patent number 7,682,140
- Issue date Mar 23, 2010
- Fujitsu Microelectronics Limited
- Futoshi Fukaya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package, method for manufacturing a semiconductor pac...
- Patent number 7,646,089
- Issue date Jan 12, 2010
- Fujitsu Limited
- Futoshi Fukaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
- Patent number 7,174,629
- Issue date Feb 13, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor for semiconductor devices, a testing apparatus using such...
- Patent number 6,781,395
- Issue date Aug 24, 2004
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor testing device
- Patent number 6,661,247
- Issue date Dec 9, 2003
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor for semiconductor devices, a testing apparatus using such...
- Patent number 6,603,325
- Issue date Aug 5, 2003
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
- Patent number 6,555,764
- Issue date Apr 29, 2003
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
IC socket, a test method using the same and an IC socket mounting m...
- Patent number 6,535,002
- Issue date Mar 18, 2003
- Fujitsu Limited
- Makoto Haseyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor for semiconductor devices, a testing apparatus using such...
- Patent number 6,466,046
- Issue date Oct 15, 2002
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for passive optical characterization of semico...
- Patent number 6,249,135
- Issue date Jun 19, 2001
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
IC socket, a test method using the same and an IC socket mounting m...
- Patent number 6,229,320
- Issue date May 8, 2001
- Fujitsu Limited
- Makoto Haseyama
- G01 - MEASURING TESTING
Information Patent Grant
Test board and a test method using the same providing improved elec...
- Patent number 6,046,598
- Issue date Apr 4, 2000
- Fujitsu Limited
- Naomi Miyaji
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device testing carrier and method of fixing semicondu...
- Patent number 5,986,459
- Issue date Nov 16, 1999
- Fujitsu Limited
- Futoshi Fukaya
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING A SEMICONDUCTOR PAC...
- Publication number 20090283897
- Publication date Nov 19, 2009
- Fujitsu Limited
- Futoshi FUKAYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mold for resin molding, resin molding apparatus, and semiconductor...
- Publication number 20070231956
- Publication date Oct 4, 2007
- FUJITSU LIMITED
- Futoshi Fukaya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor testing device
- Publication number 20050162180
- Publication date Jul 28, 2005
- FIJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor testing device
- Publication number 20040124866
- Publication date Jul 1, 2004
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor for semiconductor devices, a testing apparatus using such...
- Publication number 20030197501
- Publication date Oct 23, 2003
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Integrated circuit contactor, and method and apparatus for producti...
- Publication number 20030132027
- Publication date Jul 17, 2003
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor for semiconductor devices, a testing apparatus using such...
- Publication number 20020190741
- Publication date Dec 19, 2002
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
IC socket, a test method using the same and an IC socket mounting m...
- Publication number 20010011898
- Publication date Aug 9, 2001
- FUJITSU LIMITED
- Makoto Haseyama
- G01 - MEASURING TESTING

Futoshi Fukaya

Person

Patents Grantslast 30 patents

Mold for resin molding, resin molding apparatus, and semiconductor...

Semiconductor package, method for manufacturing a semiconductor pac...

Integrated circuit contactor, and method and apparatus for producti...

Contactor for semiconductor devices, a testing apparatus using such...

Semiconductor testing device

Contactor for semiconductor devices, a testing apparatus using such...

Integrated circuit contactor, and method and apparatus for producti...

IC socket, a test method using the same and an IC socket mounting m...

Contactor for semiconductor devices, a testing apparatus using such...

Method and apparatus for passive optical characterization of semico...

IC socket, a test method using the same and an IC socket mounting m...

Test board and a test method using the same providing improved elec...

Semiconductor device testing carrier and method of fixing semicondu...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING A SEMICONDUCTOR PAC...

Mold for resin molding, resin molding apparatus, and semiconductor...

Semiconductor testing device

Semiconductor testing device

Contactor for semiconductor devices, a testing apparatus using such...

Integrated circuit contactor, and method and apparatus for producti...

Contactor for semiconductor devices, a testing apparatus using such...

IC socket, a test method using the same and an IC socket mounting m...