Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method

Abstract

A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging further a partial inner surface of the runner. A runner magnet attracts and attaches a metallic foreign matter contained in fluid transported in the runner to the inner surface of the foreign matter retention pocket.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view of a resin molding apparatus according to a first embodiment.

FIG. 2A is a plan view of a lower mold and FIG. 2B is a bottom view of an upper mold of the resin molding apparatus according to the first embodiment.

FIG. 3A is a cross sectional view of a runner and a runner magnet disposed in the lower mold of the resin molding apparatus of the first embodiment, this view being perpendicular to the longitudinal direction of the runner, FIG. 3B is a cross sectional view showing an example of another structure, and FIG. 3C is a cross sectional view of the runner and runner magnet as viewed along the longitudinal direction.

FIG. 4A is a cross sectional plan view of a plunger of the resin molding apparatus of the first embodiment, and FIG. 4B is a cross sectional plan view showing an example of another structure.

FIGS. 5 to 8 are cross sectional views of the resin molding apparatus of the first embodiment illustrating a resin molding procedure.

FIG. 9 is a cross sectional view showing a characteristic portion of a resin molding apparatus according to a second embodiment.

FIG. 10 is a cross sectional view of a resin molding apparatus according to a third embodiment.

FIGS. 11A and 11B are cross sectional views showing characteristic portions of a resin molding apparatus according to a fourth embodiment.

FIGS. 12A and 12B are cross sectional views showing an example of another structure of characteristic portions of the resin molding apparatus according to the fourth embodiment.

FIG. 13A is a plan view of a lower mold and FIG. 13B is a bottom view of an upper mold of a resin molding apparatus according to a fifth embodiment.

FIG. 14A is a plan view of a lower mold and FIG. 14B is a bottom view of an upper mold of a resin molding apparatus according to a sixth embodiment.

FIG. 15 is a cross sectional view of a resin molding apparatus according to a seventh embodiment.

FIG. 16A is a plan view of a lower mold and FIG. 16B is a bottom view of an upper mold of the resin molding apparatus according to the seventh embodiment.

FIG. 17A is a plan view of a lower mold and FIG. 17B is a bottom view of an upper mold of a resin molding apparatus according to an eighth embodiment.

FIG. 18A is a plan view of a lower mold and FIG. 18B is a bottom view of an upper mold of a resin molding apparatus according to a ninth embodiment.

Claims

1. A mold for resin molding comprising: a pot for accommodating resin;a cavity for accommodating a resin molding target;a runner for transporting the resin accommodated in the pot to the cavity; anda foreign matter retention pocket disposed in the runner near the pot.

2. The mold for resin molding according to claim 1, wherein a magnet is disposed at the foreign matter retention pocket.

3. The mold for resin molding according to claim 2, wherein a meshed member disposed at the runner and magnetized by the magnet.

4. A resin molding apparatus comprising: a pot for accommodating resin;a mold formed with a cavity for accommodating a resin molding target and a runner for transporting the resin accommodated in the pot to the cavity;a platen for holding the mold;a plunger for applying a pressure to the resin accommodated in the pot of the mold to inject the resin into the cavity; anda magnet disposed in the plunger at a position corresponding to the resin.

5. The resin molding apparatus according to claim 4, wherein an ejector pin is disposed in the cavity, and at least a projection portion of the ejector pin into the cavity is magnetized.

6. A method of manufacturing a semiconductor device comprising steps of: (a) disposing a member mounting a semiconductor element in a cavity defined by a mold;(b) injecting resin accommodated in a pot into the cavity via a runner formed with a foreign matter retention pocket and capturing a metallic foreign matter mixed in the resin with a magnet disposed at the foreign matter retention pocket; and(c) curing the resin injected into the cavity.

7. The method of manufacturing the semiconductor device according to claim 6, further comprising a step of melting the resin accommodated in the pot on a plunger and attracting and attaching the metallic foreign matter mixed in the resin to a surface of the plunger.

8. The method of manufacturing the semiconductor device according to claim 6, wherein in the step (b), the metallic foreign matter is captured by a meshed member disposed in the runner and magnetized.

9. The method of manufacturing the semiconductor device according to claim 6, wherein in the step (b), the metallic foreign matter mixed in the resin injected into the cavity is captured by an ejector pin disposed in correspondence with the cavity.