Futoshi Ishikawa

Person

Nagoya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electroless copper plating solution and process for formation of co...
- Patent number 5,965,211
- Issue date Oct 12, 1999
- Nippondenso Co., Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solution for catalytic treatment, method of applying catalyst to su...
- Patent number 5,405,656
- Issue date Apr 11, 1995
- Nippondenso Co., Ltd.
- Futoshi Ishikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution and process for formation of co...
- Patent number 5,039,338
- Issue date Aug 13, 1991
- Nippondenso Co. Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution
- Patent number 4,956,014
- Issue date Sep 11, 1990
- Nippondenso Co., Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electrolessly plating copper and plating solution therefor
- Patent number 4,935,267
- Issue date Jun 19, 1990
- Nippondenso Co., Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution and process for electrolessly p...
- Patent number 4,834,796
- Issue date May 30, 1989
- Nippondenso Co., Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution
- Patent number 4,814,009
- Issue date Mar 21, 1989
- Nippondenso Co., Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical copper-blating bath
- Patent number 4,790,876
- Issue date Dec 13, 1988
- Nippondenso Co., Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Futoshi Ishikawa

Person

Patents Grantslast 30 patents

Electroless copper plating solution and process for formation of co...

Solution for catalytic treatment, method of applying catalyst to su...

Electroless copper plating solution and process for formation of co...

Electroless copper plating solution

Process for electrolessly plating copper and plating solution therefor

Electroless copper plating solution and process for electrolessly p...

Electroless copper plating solution

Chemical copper-blating bath