Membership
Tour
Register
Log in
Gaius Gillman Fountain, JR.
Follow
Person
Youngsville, NC, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
8,153,505
Issue date
Apr 10, 2012
Ziptronix, Inc.
Qin-Yi Tong
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
8,053,329
Issue date
Nov 8, 2011
Ziptronix, Inc.
Qin-Yi Tong
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Wafer scale die handling
Patent number
7,956,447
Issue date
Jun 7, 2011
Ziptronix, Inc.
Paul M. Enquist
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
7,871,898
Issue date
Jan 18, 2011
Ziptronix, Inc.
Qin-Yi Tong
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
7,807,549
Issue date
Oct 5, 2010
Ziptronix, Inc.
Qin-Yi Tong
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
7,781,307
Issue date
Aug 24, 2010
Ziptronix, Inc.
Qin-Yi Tong
Information
Patent Grant
Wafer bonding hermetic encapsulation
Patent number
7,622,324
Issue date
Nov 24, 2009
Ziptronix
Paul M. Enquist
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
7,553,744
Issue date
Jun 30, 2009
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D IC method and device
Patent number
7,485,968
Issue date
Feb 3, 2009
Ziptronix, Inc.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of detachable direct bonding at low temperatures
Patent number
7,462,552
Issue date
Dec 9, 2008
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
7,387,944
Issue date
Jun 17, 2008
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
7,335,572
Issue date
Feb 26, 2008
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
7,041,178
Issue date
May 9, 2006
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
6,902,987
Issue date
Jun 7, 2005
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method For Low Temperature Bonding And Bonded Structure
Publication number
20120097638
Publication date
Apr 26, 2012
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE
Publication number
20110067803
Publication date
Mar 24, 2011
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
Publication number
20100163169
Publication date
Jul 1, 2010
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
Publication number
20090263953
Publication date
Oct 22, 2009
Ziptronix, Inc.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D IC METHOD AND DEVICE
Publication number
20090068831
Publication date
Mar 12, 2009
Ziptronix
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS