Gamal Refai-Ahmed

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heterogeneous integration module comprising thermal management appa...
- Patent number 11,769,710
- Issue date Sep 26, 2023
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radome with integrated passive cooling
- Patent number 11,605,886
- Issue date Mar 14, 2023
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having vertical thermal management
- Patent number 11,488,936
- Issue date Nov 1, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enablement of dies with impurity gettering
- Patent number 11,488,887
- Issue date Nov 1, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote active cooling heat exchanger and antenna system with the same
- Patent number 11,476,556
- Issue date Oct 18, 2022
- Xilinx, Inc.
- Mohsen H. Mardi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 11,469,212
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal heat spreader plate for electronic device
- Patent number 11,373,929
- Issue date Jun 28, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having thermal management
- Patent number 11,355,412
- Issue date Jun 7, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional thermal management apparatuses for electronic dev...
- Patent number 11,328,976
- Issue date May 10, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Force balanced package mounting
- Patent number 11,330,738
- Issue date May 10, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device with through PCB cooling
- Patent number 11,246,211
- Issue date Feb 8, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked silicon package assembly having thermal management using ph...
- Patent number 11,195,780
- Issue date Dec 7, 2021
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having thermal management
- Patent number 11,145,566
- Issue date Oct 12, 2021
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package (CSP) including shim die
- Patent number 10,770,364
- Issue date Sep 8, 2020
- Xilinx, Inc.
- Hong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal-mechanical adjustment for laser system
- Patent number 10,741,998
- Issue date Aug 11, 2020
- General Electric Company
- Sandip Maity
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device apparatus with multiple thermally conductive path...
- Patent number 10,720,377
- Issue date Jul 21, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect devices for electronic packaging assemblies
- Patent number RE48015
- Issue date May 26, 2020
- General Electric Company
- Gamal Refai-Ahmed
Information Patent Grant
Integrated circuit die with in-chip heat sink
- Patent number 10,629,512
- Issue date Apr 21, 2020
- Xilinx, Inc.
- Hong-Tsz Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for thermal interface material (TIM) bond lin...
- Patent number 10,529,645
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing system for lid-less integrated circuit packages
- Patent number 10,527,670
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- G01 - MEASURING TESTING
Information Patent Grant
Stacked silicon package having a thermal capacitance element
- Patent number 10,262,920
- Issue date Apr 16, 2019
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic mounting thermal management for devices on board
- Patent number 10,147,664
- Issue date Dec 4, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for assembling and testing a multi-integrated...
- Patent number 10,096,502
- Issue date Oct 9, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated compact impingement on extended heat surface
- Patent number 10,085,363
- Issue date Sep 25, 2018
- General Electric Company
- Gamal Refai-Ahmed
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hydrogen detector and hydrogen detection method
- Patent number 10,054,575
- Issue date Aug 21, 2018
- General Electric Company
- Gamal Refai-Ahmed
- G01 - MEASURING TESTING
Information Patent Grant
Stacked silicon package assembly having an enhanced lid
- Patent number 10,043,730
- Issue date Aug 7, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrational fluid mover active controller
- Patent number 9,951,767
- Issue date Apr 24, 2018
- General Electric Company
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package, and methods and tools for fabricating t...
- Patent number 9,947,560
- Issue date Apr 17, 2018
- Xilinx, Inc.
- Mohsen H. Mardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrational fluid mover jet with active damping mechanism
- Patent number 9,879,661
- Issue date Jan 30, 2018
- General Electric Company
- Gamal Refai-Ahmed
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Grant
Thermal management device with textured surface for extended coolin...
- Patent number 9,812,374
- Issue date Nov 7, 2017
- Xilinix, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD OF PRINTING SOLDER ON PRINTED CIRCUIT BOARD FO...
- Publication number 20250142735
- Publication date May 1, 2025
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FAN NOISE REDUCTION
- Publication number 20250069579
- Publication date Feb 27, 2025
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
PROTECTION APPARATUS FOR A PHOTONIC DEVICE
- Publication number 20240329329
- Publication date Oct 3, 2024
- Xilinx, Inc.
- Gamal REFAI-AHMED
- G02 - OPTICS
Information Patent Application
FRAME FOR COUPLING OF A THERMAL MANAGEMENT DEVICE TO A PRINTED CIRC...
- Publication number 20240314934
- Publication date Sep 19, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT
- Publication number 20240314919
- Publication date Sep 19, 2024
- ADVANCED MICRO DEVICES, INC.
- Paul Theodore ARTMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
- Publication number 20240290686
- Publication date Aug 29, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING HEAT SPREADER WITH GUIDED MECHANISM
- Publication number 20240258190
- Publication date Aug 1, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER
- Publication number 20230420335
- Publication date Dec 28, 2023
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH DECOUPLED THERMAL MANAGEMENT
- Publication number 20230282547
- Publication date Sep 7, 2023
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR A SEMICONDUCTOR PACKAGE
- Publication number 20230207422
- Publication date Jun 29, 2023
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION MODULE COMPRISING THERMAL MANAGEMENT APPA...
- Publication number 20210305127
- Publication date Sep 30, 2021
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT
- Publication number 20210249328
- Publication date Aug 12, 2021
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING VERTICAL THERMAL MANAGEMENT
- Publication number 20210193620
- Publication date Jun 24, 2021
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...
- Publication number 20200152546
- Publication date May 14, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT
- Publication number 20200105642
- Publication date Apr 2, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE WITH IN-CHIP HEAT SINK
- Publication number 20200006186
- Publication date Jan 2, 2020
- Xilinx, Inc.
- Hong-Tsz Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE (CSP) INCLUDING SHIM DIE
- Publication number 20190318975
- Publication date Oct 17, 2019
- Xilinx, Inc.
- Hong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...
- Publication number 20180358280
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC MOUNTING THERMAL MANAGEMENT FOR DEVICES ON BOARD
- Publication number 20180308783
- Publication date Oct 25, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TESTING SYSTEM FOR LID-LESS INTEGRATED CIRCUIT PACKAGES
- Publication number 20180284187
- Publication date Oct 4, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING AND TESTING A MULTI-INTEGRATED...
- Publication number 20180144963
- Publication date May 24, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROGEN DETECTOR AND HYDROGEN DETECTION METHOD
- Publication number 20170089874
- Publication date Mar 30, 2017
- GENERAL ELECTRIC COMPANY
- Gamal Refai-Ahmed
- G01 - MEASURING TESTING
Information Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING AN ENHANCED LID
- Publication number 20170092619
- Publication date Mar 30, 2017
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER WITH FLEXIBLE TOLERANCE MECHANISM
- Publication number 20170053853
- Publication date Feb 23, 2017
- GENERAL ELECTRIC COMPANY
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20160365335
- Publication date Dec 15, 2016
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIBRATIONAL FLUID MOVER JET WITH ACTIVE DAMPING MECHANISM
- Publication number 20160061194
- Publication date Mar 3, 2016
- GENERAL ELECTRIC COMPANY
- Gamal Refai-Ahmed
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
INTERCONNECT DEVICES FOR ELECTRONIC PACKAGING ASSEMBLIES
- Publication number 20150348952
- Publication date Dec 3, 2015
- GENERAL ELECTRIC COMPANY
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COMPACT IMPINGEMENT ON EXTENDED HEAT SURFACE
- Publication number 20150342088
- Publication date Nov 26, 2015
- GENERAL ELECTRIC COMPANY
- Gamal Refai-Ahmed
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIBRATIONAL FLUID MOVER ACTIVE CONTROLLER
- Publication number 20150337828
- Publication date Nov 26, 2015
- GENERAL ELECTRIC COMPANY
- Gamal Refai-Ahmed
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
THERMAL CLAMP APPARATUS FOR ELECTRONIC SYSTEMS
- Publication number 20150342023
- Publication date Nov 26, 2015
- GENERAL ELECTRIC COMPANY
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Gamal Refai-Ahmed

Person

Patents Grantslast 30 patents

Heterogeneous integration module comprising thermal management appa...

Radome with integrated passive cooling

Stacked silicon package assembly having vertical thermal management

Thermal enablement of dies with impurity gettering

Remote active cooling heat exchanger and antenna system with the same

Semiconductor chip with redundant thru-silicon-vias

Thermal heat spreader plate for electronic device

Stacked silicon package assembly having thermal management

Three-dimensional thermal management apparatuses for electronic dev...

Force balanced package mounting

Micro device with through PCB cooling

Stacked silicon package assembly having thermal management using ph...

Stacked silicon package assembly having thermal management

Chip scale package (CSP) including shim die

Thermal-mechanical adjustment for laser system

Electronic device apparatus with multiple thermally conductive path...

Interconnect devices for electronic packaging assemblies

Integrated circuit die with in-chip heat sink

Methods and apparatus for thermal interface material (TIM) bond lin...

Testing system for lid-less integrated circuit packages

Stacked silicon package having a thermal capacitance element

Dynamic mounting thermal management for devices on board

Method and apparatus for assembling and testing a multi-integrated...

Integrated compact impingement on extended heat surface

Hydrogen detector and hydrogen detection method

Stacked silicon package assembly having an enhanced lid

Vibrational fluid mover active controller

Integrated circuit package, and methods and tools for fabricating t...

Vibrational fluid mover jet with active damping mechanism

Thermal management device with textured surface for extended coolin...

Patents Applicationslast 30 patents

APPARATUS AND METHOD OF PRINTING SOLDER ON PRINTED CIRCUIT BOARD FO...

FAN NOISE REDUCTION

PROTECTION APPARATUS FOR A PHOTONIC DEVICE

FRAME FOR COUPLING OF A THERMAL MANAGEMENT DEVICE TO A PRINTED CIRC...

ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT

THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE

FLOATING HEAT SPREADER WITH GUIDED MECHANISM

CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER

CHIP PACKAGE WITH DECOUPLED THERMAL MANAGEMENT

HEAT SPREADER FOR A SEMICONDUCTOR PACKAGE

HETEROGENEOUS INTEGRATION MODULE COMPRISING THERMAL MANAGEMENT APPA...

STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT

STACKED SILICON PACKAGE ASSEMBLY HAVING VERTICAL THERMAL MANAGEMENT

ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...

STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT

INTEGRATED CIRCUIT DIE WITH IN-CHIP HEAT SINK

CHIP SCALE PACKAGE (CSP) INCLUDING SHIM DIE

METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...

DYNAMIC MOUNTING THERMAL MANAGEMENT FOR DEVICES ON BOARD

TESTING SYSTEM FOR LID-LESS INTEGRATED CIRCUIT PACKAGES

METHOD AND APPARATUS FOR ASSEMBLING AND TESTING A MULTI-INTEGRATED...

HYDROGEN DETECTOR AND HYDROGEN DETECTION METHOD

STACKED SILICON PACKAGE ASSEMBLY HAVING AN ENHANCED LID

HEAT SPREADER WITH FLEXIBLE TOLERANCE MECHANISM

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

VIBRATIONAL FLUID MOVER JET WITH ACTIVE DAMPING MECHANISM

INTERCONNECT DEVICES FOR ELECTRONIC PACKAGING ASSEMBLIES

INTEGRATED COMPACT IMPINGEMENT ON EXTENDED HEAT SURFACE

VIBRATIONAL FLUID MOVER ACTIVE CONTROLLER

THERMAL CLAMP APPARATUS FOR ELECTRONIC SYSTEMS