Gamal Refai-Ahmed

Person

Markam, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with thermal interface tape
- Patent number 9,627,281
- Issue date Apr 18, 2017
- Advanced Micro Device, Inc.
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 9,437,561
- Issue date Sep 6, 2016
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips with thermal management
- Patent number 9,385,055
- Issue date Jul 5, 2016
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with support structure
- Patent number 9,263,364
- Issue date Feb 16, 2016
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with polymeric filler trench
- Patent number 8,866,276
- Issue date Oct 21, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computing center power and cooling control apparatus and method
- Patent number 8,868,944
- Issue date Oct 21, 2014
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable computing device with thermal management
- Patent number 8,804,331
- Issue date Aug 12, 2014
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor chip device with thermal management circuit b...
- Patent number 8,796,842
- Issue date Aug 5, 2014
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with underfill
- Patent number 8,691,626
- Issue date Apr 8, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient thermal modeling of multisource power devices
- Patent number 8,635,044
- Issue date Jan 21, 2014
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip device with polymeric filler trench
- Patent number 8,617,926
- Issue date Dec 31, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with liquid thermal interface material
- Patent number 8,574,965
- Issue date Nov 5, 2013
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chip device with thermal management
- Patent number 8,472,190
- Issue date Jun 25, 2013
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing and assembling semiconductor chips with off...
- Patent number 8,394,672
- Issue date Mar 12, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reinforcing through-silicon-vias
- Patent number 8,338,961
- Issue date Dec 25, 2012
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip thermal interface structures
- Patent number 8,304,291
- Issue date Nov 6, 2012
- Advanced Micro Devices, Inc.
- Maxat N. Touzelbaev
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with reinforcing through-silicon-vias
- Patent number 8,193,039
- Issue date Jun 5, 2012
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holistic thermal management system for a semiconductor chip
- Patent number 8,058,724
- Issue date Nov 15, 2011
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with support structure
- Patent number 8,034,662
- Issue date Oct 11, 2011
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional thermal spreading in an air-cooled thermal device
- Patent number 7,974,096
- Issue date Jul 5, 2011
- ATI Technologies ULC
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi-die semiconductor package with heat spreader
- Patent number 7,964,951
- Issue date Jun 21, 2011
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-flow thermal management device and method of manufacture thereof
- Patent number 7,965,511
- Issue date Jun 21, 2011
- ATI Technologies ULC
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink for a circuit device
- Patent number 7,911,791
- Issue date Mar 22, 2011
- ATI Technologies ULC
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management device for multiple heat producing devices
- Patent number 7,760,508
- Issue date Jul 20, 2010
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management apparatus and method for a circuit substrate
- Patent number 7,623,349
- Issue date Nov 24, 2009
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized refrigerator apparatus for a thermal management device
- Patent number 7,584,622
- Issue date Sep 8, 2009
- ATI Technologies
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Variable spring rate thermal management apparatus attachment mechanism
- Patent number 7,570,490
- Issue date Aug 4, 2009
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management device for multiple heat producing devices
- Patent number 7,362,583
- Issue date Apr 22, 2008
- ATI Technologies Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management apparatus
- Patent number 7,283,364
- Issue date Oct 16, 2007
- ATI Technologies Inc.
- Gamal Refai-Ahmed
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20230031099
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- BRYAN BLACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH
- Publication number 20140103506
- Publication date Apr 17, 2014
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH OFFSET PADS
- Publication number 20130161814
- Publication date Jun 27, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS
- Publication number 20130147028
- Publication date Jun 13, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PORTABLE COMPUTING DEVICE WITH THERMAL MANAGEMENT
- Publication number 20130141866
- Publication date Jun 6, 2013
- Gamal Refai-Ahmed
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Transient Thermal Modeling of Multisource Power Devices
- Publication number 20120278029
- Publication date Nov 1, 2012
- ATI Technologies ULC
- Maxat Touzelbaev
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS
- Publication number 20120205791
- Publication date Aug 16, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL
- Publication number 20120098119
- Publication date Apr 26, 2012
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT
- Publication number 20120075807
- Publication date Mar 29, 2012
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS
- Publication number 20120074579
- Publication date Mar 29, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH
- Publication number 20120061852
- Publication date Mar 15, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20120061821
- Publication date Mar 15, 2012
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH THERMAL INTERFACE TAPE
- Publication number 20120043539
- Publication date Feb 23, 2012
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT CIRCUIT B...
- Publication number 20120043669
- Publication date Feb 23, 2012
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT
- Publication number 20120043668
- Publication date Feb 23, 2012
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL WITH SUPPORT STRUCTURE
- Publication number 20110304051
- Publication date Dec 15, 2011
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING CENTER POWER AND COOLING CONTROL APPARATUS AND METHOD
- Publication number 20110245981
- Publication date Oct 6, 2011
- Gamal Refai-Ahmed
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip Thermal Interface Structures
- Publication number 20100327431
- Publication date Dec 30, 2010
- Maxat N. Touzelbaev
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Sink for a Circuit Device
- Publication number 20100328887
- Publication date Dec 30, 2010
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VARIABLE HEAT EXCHANGER
- Publication number 20100314093
- Publication date Dec 16, 2010
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermal Interface Material with Support Structure
- Publication number 20100237496
- Publication date Sep 23, 2010
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SEMICONDUCTOR PACKAGE WITH HEAT SPREADER
- Publication number 20100230805
- Publication date Sep 16, 2010
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interchangeable Heat Exchanger for a Circuit Board
- Publication number 20100103619
- Publication date Apr 29, 2010
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Regulation of Power Consumption for Application-Specific Integrated...
- Publication number 20100030500
- Publication date Feb 4, 2010
- Gamal REFAI-AHMED
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multidimensional Thermal Management Device for an Integrated Circui...
- Publication number 20100014251
- Publication date Jan 21, 2010
- Advanced Micro Devices, Inc.
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Holistic Thermal Management System for a Semiconductor Chip
- Publication number 20090140417
- Publication date Jun 4, 2009
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR AN ELECTRONIC DEVICE
- Publication number 20080253087
- Publication date Oct 16, 2008
- ATI Technologies ULC
- Gamal Refai-Ahmed
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL MANAGEMENT DEVICE FOR MULTIPLE HEAT PRODUCING DEVICES
- Publication number 20080192441
- Publication date Aug 14, 2008
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cross-Flow Thermal Management Device and Method of Manufacture Thereof
- Publication number 20080043438
- Publication date Feb 21, 2008
- ATI Technologies Inc.
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Three-Dimensional Thermal Spreading in an Air-Cooled Thermal Device
- Publication number 20080043437
- Publication date Feb 21, 2008
- ATI Technologies Inc.
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL

Gamal Refai-Ahmed

Person

Patents Grantslast 30 patents

Semiconductor chip with thermal interface tape

Semiconductor chip with redundant thru-silicon-vias

Stacked semiconductor chips with thermal management

Thermal interface material with support structure

Semiconductor chip device with polymeric filler trench

Computing center power and cooling control apparatus and method

Portable computing device with thermal management

Stacked semiconductor chip device with thermal management circuit b...

Semiconductor chip device with underfill

Transient thermal modeling of multisource power devices

Semiconductor chip device with polymeric filler trench

Semiconductor chip device with liquid thermal interface material

Stacked semiconductor chip device with thermal management

Method of manufacturing and assembling semiconductor chips with off...

Semiconductor chip with reinforcing through-silicon-vias

Semiconductor chip thermal interface structures

Semiconductor chip with reinforcing through-silicon-vias

Holistic thermal management system for a semiconductor chip

Thermal interface material with support structure

Three-dimensional thermal spreading in an air-cooled thermal device

Multi-die semiconductor package with heat spreader

Cross-flow thermal management device and method of manufacture thereof

Heat sink for a circuit device

Thermal management device for multiple heat producing devices

Thermal management apparatus and method for a circuit substrate

Localized refrigerator apparatus for a thermal management device

Variable spring rate thermal management apparatus attachment mechanism

Thermal management device for multiple heat producing devices

Thermal management apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH

SEMICONDUCTOR CHIP WITH OFFSET PADS

HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS

PORTABLE COMPUTING DEVICE WITH THERMAL MANAGEMENT

Transient Thermal Modeling of Multisource Power Devices

SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS

SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL

STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT

SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS

SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

SEMICONDUCTOR CHIP WITH THERMAL INTERFACE TAPE

STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT CIRCUIT B...

STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT

THERMAL INTERFACE MATERIAL WITH SUPPORT STRUCTURE

COMPUTING CENTER POWER AND COOLING CONTROL APPARATUS AND METHOD

Semiconductor Chip Thermal Interface Structures

Heat Sink for a Circuit Device

VARIABLE HEAT EXCHANGER

Thermal Interface Material with Support Structure

MULTI-DIE SEMICONDUCTOR PACKAGE WITH HEAT SPREADER

Interchangeable Heat Exchanger for a Circuit Board

Regulation of Power Consumption for Application-Specific Integrated...

Multidimensional Thermal Management Device for an Integrated Circui...

Holistic Thermal Management System for a Semiconductor Chip

THERMAL MANAGEMENT SYSTEM FOR AN ELECTRONIC DEVICE

THERMAL MANAGEMENT DEVICE FOR MULTIPLE HEAT PRODUCING DEVICES

Cross-Flow Thermal Management Device and Method of Manufacture Thereof

Three-Dimensional Thermal Spreading in an Air-Cooled Thermal Device