Gary B. Tepolt

Person

Andover, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for forming multi-layered vias in sequentially...
- Patent number 10,453,787
- Issue date Oct 22, 2019
- The Charles Stark Draper Laboratory, Inc.
- Maurice S. Karpman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module subassemblies
- Patent number 9,693,469
- Issue date Jun 27, 2017
- The Charles Stark Draper Laboratory, Inc.
- Gary B. Tepolt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic modules
- Patent number 9,425,069
- Issue date Aug 23, 2016
- Charles Stark Draper Laboratory, Inc.
- Livia M. Racz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic modules and methods for forming the same
- Patent number 8,535,984
- Issue date Sep 17, 2013
- The Charles Stark Draper Laboratory, Inc.
- Livia M. Racz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers, electronic modules, and methods for forming the same
- Patent number 8,273,603
- Issue date Sep 25, 2012
- The Charles Stark Draper Laboratory, Inc.
- Livia M. Racz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic modules and methods for forming the same
- Patent number 8,017,451
- Issue date Sep 13, 2011
- The Charles Stark Draper Laboratory, Inc.
- Livia M. Racz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of integrated circuits from packages
- Patent number 7,981,698
- Issue date Jul 19, 2011
- The Charles Stark Draper Laboratory, Inc.
- Dariusz R. Pryputniewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die thinning processes and structures
- Patent number 7,960,247
- Issue date Jun 14, 2011
- The Charles Stark Draper Laboratory, Inc.
- Jeffrey C. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robotic wafer handler
- Patent number 5,746,565
- Issue date May 5, 1998
- Integrated Solutions, Inc.
- Gary B. Tepolt
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Process chamber for semiconductor substrates
- Patent number 5,611,886
- Issue date Mar 18, 1997
- Integrated Solutions, Inc.
- Stephen A. Bachman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor wafer coating apparatus with angular oscillation means
- Patent number 4,850,299
- Issue date Jul 25, 1989
- John G. Merullo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR FORMING MULTI-LAYERED VIAS IN SEQUENTIALLY...
- Publication number 20160343652
- Publication date Nov 24, 2016
- The Charles Stark Draper Laboratory, Inc.
- Maurice S. Karpman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE SUBASSEMBLIES AND METHODS FOR FABRICATING THE SAME
- Publication number 20150181709
- Publication date Jun 25, 2015
- The Charles Stark Draper Laboratory, Inc.
- Gary B. Tepolt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULES
- Publication number 20130329376
- Publication date Dec 12, 2013
- The Charles Stark Draper Laboratory, Inc.
- Livia M. Racz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME
- Publication number 20120086135
- Publication date Apr 12, 2012
- Jeffrey C. Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Modules and Methods for Forming the Same
- Publication number 20110309528
- Publication date Dec 22, 2011
- Livia M. Racz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Modules and Methods for Forming the Same
- Publication number 20090250823
- Publication date Oct 8, 2009
- Livia M. Racz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME
- Publication number 20090250249
- Publication date Oct 8, 2009
- Livia M. Racz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE THINNING PROCESSES AND STRUCTURES
- Publication number 20090251879
- Publication date Oct 8, 2009
- Jeffrey C. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Removal of integrated circuits from packages
- Publication number 20080217773
- Publication date Sep 11, 2008
- Charles Stark Draper Laboratory, Inc.
- Dariusz R. Pryputniewicz
- H01 - BASIC ELECTRIC ELEMENTS

Gary B. Tepolt

Person

Patents Grantslast 30 patents

Method and apparatus for forming multi-layered vias in sequentially...

Electronic module subassemblies

Electronic modules

Electronic modules and methods for forming the same

Interposers, electronic modules, and methods for forming the same

Electronic modules and methods for forming the same

Removal of integrated circuits from packages

Die thinning processes and structures

Robotic wafer handler

Process chamber for semiconductor substrates

Semiconductor wafer coating apparatus with angular oscillation means

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR FORMING MULTI-LAYERED VIAS IN SEQUENTIALLY...

ELECTRONIC MODULE SUBASSEMBLIES AND METHODS FOR FABRICATING THE SAME

ELECTRONIC MODULES

INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME

Electronic Modules and Methods for Forming the Same

Electronic Modules and Methods for Forming the Same

INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME

DIE THINNING PROCESSES AND STRUCTURES

Removal of integrated circuits from packages