Gary Bernstein

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for spin wave-based spectrum analyzers
- Patent number 10,613,129
- Issue date Apr 7, 2020
- University of Notre Dame Du Lac
- Gyorgy Csaba
- G01 - MEASURING TESTING
Information Patent Grant
Inter-chip alignment
- Patent number 10,410,989
- Issue date Sep 10, 2019
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quilt packaging system with mated metal interconnect nodules and voids
- Patent number 10,050,027
- Issue date Aug 14, 2018
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for inter-chip communication
- Patent number 9,633,976
- Issue date Apr 25, 2017
- University of Notre Dame Du Lac
- Gary H. Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quilt packaging system with interdigitated interconnecting nodules...
- Patent number 9,620,473
- Issue date Apr 11, 2017
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mono-metallic thermocouples
- Patent number 9,577,173
- Issue date Feb 21, 2017
- University of Notre Dame du Lac
- Wolfgang Porod
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Inter-chip communication
- Patent number 8,623,700
- Issue date Jan 7, 2014
- University of Notre Dame du Lac
- Gary H. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-majority MQCA magnetic logic gates and arrays based on misalign...
- Patent number 8,058,906
- Issue date Nov 15, 2011
- The University of Notre Dame du Lac
- Michael T. Niemier
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Inter-chip communication
- Patent number 8,021,965
- Issue date Sep 20, 2011
- University of Norte Dame Du Lac
- Gary H. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inter-chip communication
- Patent number 7,612,443
- Issue date Nov 3, 2009
- University of Notre Dame du Lac
- Gary H. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect packaging systems
- Patent number 7,608,919
- Issue date Oct 27, 2009
- University of Notre Dame du Lac
- Gary H. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar-processing compatible metallic micro-extrusion process
- Patent number 6,594,894
- Issue date Jul 22, 2003
- The United States of America as represented by the Secretary of the Air Force
- Gary H. Bernstein
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
QUADFET-A novel field effect transistor
- Patent number 4,962,410
- Issue date Oct 9, 1990
- Arizona Board of Regents
- Alfred M. Kriman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of obtaining improved contrast in electron beam lithography
- Patent number 4,937,174
- Issue date Jun 26, 1990
- Arizona Board of Regents
- Gary Bernstein
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Developer solutions for PMMA electron resist
- Patent number 4,877,716
- Issue date Oct 31, 1989
- Arizona Board of Regents
- Gary Bernstein
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Lateral surface superlattice having negative differential conductiv...
- Patent number 4,872,038
- Issue date Oct 3, 1989
- Arizona Board of Regents
- Gary Bernstein
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INFRARED SHACK-HARTMANN WAVEFRONT SENSOR BASED ON CAVITY-COUPLED NA...
- Publication number 20250146877
- Publication date May 8, 2025
- UNIVERSITY OF NOTRE DAME DU LAC
- Edward KINZEL
- G01 - MEASURING TESTING
Information Patent Application
SHORT-WAVELENGTH SPIN WAVE TRANSDUCER
- Publication number 20230299451
- Publication date Sep 21, 2023
- UNIVERSITY OF NOTRE DAME DU LAC
- Hadrian Aquino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SPIN WAVE-BASED SPECTRUM ANALYZERS
- Publication number 20170248640
- Publication date Aug 31, 2017
- UNIVERSITY OF NOTRE DAME DU LAC
- Gyorgy Csaba
- G01 - MEASURING TESTING
Information Patent Application
Inter-Chip Alignment
- Publication number 20170229416
- Publication date Aug 10, 2017
- UNIVERSITY OF NOTRE DAME DU LAC
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inter-Chip Alignment
- Publication number 20170179093
- Publication date Jun 22, 2017
- Indiana Integrated Circuits, LLC
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONO-METALLIC THERMOCOUPLES
- Publication number 20140338712
- Publication date Nov 20, 2014
- UNIVERSITY OF NOTRE DAME DU LAC
- Wolfgang Porod
- B82 - NANO-TECHNOLOGY
Information Patent Application
NON-MAJORITY MQCA MAGNETIC LOGIC GATES AND ARRAYS BASED ON MISALIGN...
- Publication number 20100315123
- Publication date Dec 16, 2010
- Michael T. Niemier
- G11 - INFORMATION STORAGE

Gary Bernstein

Person

Patents Grantslast 30 patents

Methods and apparatus for spin wave-based spectrum analyzers

Inter-chip alignment

Quilt packaging system with mated metal interconnect nodules and voids

Systems and methods for inter-chip communication

Quilt packaging system with interdigitated interconnecting nodules...

Mono-metallic thermocouples

Inter-chip communication

Non-majority MQCA magnetic logic gates and arrays based on misalign...

Inter-chip communication

Inter-chip communication

Interconnect packaging systems

Planar-processing compatible metallic micro-extrusion process

QUADFET-A novel field effect transistor

Process of obtaining improved contrast in electron beam lithography

Developer solutions for PMMA electron resist

Lateral surface superlattice having negative differential conductiv...

Patents Applicationslast 30 patents

INFRARED SHACK-HARTMANN WAVEFRONT SENSOR BASED ON CAVITY-COUPLED NA...

SHORT-WAVELENGTH SPIN WAVE TRANSDUCER

METHODS AND APPARATUS FOR SPIN WAVE-BASED SPECTRUM ANALYZERS

Inter-Chip Alignment

Inter-Chip Alignment

MONO-METALLIC THERMOCOUPLES

NON-MAJORITY MQCA MAGNETIC LOGIC GATES AND ARRAYS BASED ON MISALIGN...