Gary E. Oberlin

Person

Windfall, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing an overmolded electronic module with a flexible...
- Patent number 7,739,791
- Issue date Jun 22, 2010
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fluid cooled electronic assembly
- Patent number 7,551,439
- Issue date Jun 23, 2009
- Delphi Technologies, Inc.
- Darrel E. Peugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic system with passive cooling
- Patent number 7,106,588
- Issue date Sep 12, 2006
- Delphi Technologies, Inc.
- Gary E. Oberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-path bar bond connector for an integrated circuit assembly
- Patent number 7,038,308
- Issue date May 2, 2006
- Delphi Technologies, Inc.
- Gary E. Oberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced electronic module with self-aligning heat sink
- Patent number 6,999,317
- Issue date Feb 14, 2006
- Delphi Technologies, Inc.
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with bar bond attachment
- Patent number 6,593,527
- Issue date Jul 15, 2003
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frontal impact characterization apparatus for a motor vehicle restr...
- Patent number 6,559,763
- Issue date May 6, 2003
- Delphi Technologies, Inc.
- Morgan D. Murphy
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Flip chip with backside electrical contact and assembly and method...
- Patent number 6,262,489
- Issue date Jul 17, 2001
- Delphi Technologies, Inc.
- Mark Anthony Koors
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fluid cooled electronic assembly
- Publication number 20070230127
- Publication date Oct 4, 2007
- Delphi Technologies, Inc.
- Darrel E. Peugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal conductor and use thereof
- Publication number 20060221571
- Publication date Oct 5, 2006
- Gary E. Oberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PATH BAR BOND CONNECTOR FOR AN INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20060038265
- Publication date Feb 23, 2006
- Gary E. Oberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly having variable thickness solder joint
- Publication number 20050252681
- Publication date Nov 17, 2005
- Ronnie Joe Runyon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Power electronic system with passive cooling
- Publication number 20050088822
- Publication date Apr 28, 2005
- Gary E. Oberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally enhanced electronic module with self-aligning heat sink
- Publication number 20050036292
- Publication date Feb 17, 2005
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Frontal impact characterization apparatus for a motor vehicle restr...
- Publication number 20020154006
- Publication date Oct 24, 2002
- Delphi Technologies, Inc.
- Morgan D. Murphy
- B60 - VEHICLES IN GENERAL

Gary E. Oberlin

Person

Patents Grantslast 30 patents

Method of producing an overmolded electronic module with a flexible...

Fluid cooled electronic assembly

Power electronic system with passive cooling

Multi-path bar bond connector for an integrated circuit assembly

Thermally enhanced electronic module with self-aligning heat sink

Integrated circuit assembly with bar bond attachment

Frontal impact characterization apparatus for a motor vehicle restr...

Flip chip with backside electrical contact and assembly and method...

Patents Applicationslast 30 patents

Fluid cooled electronic assembly

Thermal conductor and use thereof

MULTI-PATH BAR BOND CONNECTOR FOR AN INTEGRATED CIRCUIT ASSEMBLY

Microelectronic assembly having variable thickness solder joint

Power electronic system with passive cooling

Thermally enhanced electronic module with self-aligning heat sink

Frontal impact characterization apparatus for a motor vehicle restr...