Gary G. Li

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vibration robust x-axis ring gyro transducer
- Patent number 9,759,563
- Issue date Sep 12, 2017
- NXP USA, INC.
- Heinz Loreck
- G01 - MEASURING TESTING
Information Patent Grant
MEMS sensor with stress isolation and method of fabrication
- Patent number 8,925,384
- Issue date Jan 6, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Andrew C. McNeil
- G01 - MEASURING TESTING
Information Patent Grant
Inertial sensor with off-axis spring system
- Patent number 8,739,627
- Issue date Jun 3, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- G01 - MEASURING TESTING
Information Patent Grant
MEMS device with central anchor for stress isolation
- Patent number 8,610,222
- Issue date Dec 17, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor with folded torsion springs
- Patent number 8,555,719
- Issue date Oct 15, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Andrew C. McNeil
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with reduced sensitivity to package stress
- Patent number 8,056,415
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Andrew C. McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiple axis transducer with multiple sensing range capability
- Patent number 7,779,689
- Issue date Aug 24, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for a MEMS gyro sensor
- Patent number 7,434,464
- Issue date Oct 14, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- G01 - MEASURING TESTING
Information Patent Grant
Stress release mechanism in MEMS device and method of making same
- Patent number 7,268,463
- Issue date Sep 11, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lead frame with flag support structure
- Patent number 7,012,324
- Issue date Mar 14, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of adding mass to MEMS structures
- Patent number 7,005,193
- Issue date Feb 28, 2006
- Motorola, Inc.
- Andrew C. McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Single proof mass, 3 axis MEMS transducer
- Patent number 6,936,492
- Issue date Aug 30, 2005
- Freescale Semiconductor, Inc.
- Andrew C. McNeil
- G01 - MEASURING TESTING
Information Patent Grant
Single proof mass, 3 axis MEMS transducer
- Patent number 6,845,670
- Issue date Jan 25, 2005
- Freescale Semiconductor, Inc.
- Andrew C. McNeil
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SPRING SYSTEM FOR MEMS DEVICE
- Publication number 20140230549
- Publication date Aug 21, 2014
- Freescale Semiconductor, Inc.
- Andrew C. McNeil
- G01 - MEASURING TESTING
Information Patent Application
MEMS SENSOR WITH STRESS ISOLATION AND METHOD OF FABRICATION
- Publication number 20130319117
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Andrew C. McNeil
- G01 - MEASURING TESTING
Information Patent Application
Vibration Robust X-Axis Ring Gyro Transducer
- Publication number 20130192363
- Publication date Aug 1, 2013
- Heinz Loreck
- G01 - MEASURING TESTING
Information Patent Application
INERTIAL SENSOR WITH OFF-AXIS SPRING SYSTEM
- Publication number 20130104651
- Publication date May 2, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE WITH CENTRAL ANCHOR FOR STRESS ISOLATION
- Publication number 20120262026
- Publication date Oct 18, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR WITH FOLDED TORSION SPRINGS
- Publication number 20120186346
- Publication date Jul 26, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Andrew C. McNeil
- G01 - MEASURING TESTING
Information Patent Application
FRAMED TRANSDUCER DEVICE
- Publication number 20110174074
- Publication date Jul 21, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED SENSITIVITY TO PACKAGE STRESS
- Publication number 20090293617
- Publication date Dec 3, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Andrew C. McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIPLE AXIS TRANSDUCER WITH MULTIPLE SENSING RANGE CAPABILITY
- Publication number 20080196499
- Publication date Aug 21, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- G01 - MEASURING TESTING
Information Patent Application
Methods and apparatus for a MEMS gyro sensor
- Publication number 20080078246
- Publication date Apr 3, 2008
- Gary G. Li
- G01 - MEASURING TESTING
Information Patent Application
MEMS device and method of fabrication
- Publication number 20070090474
- Publication date Apr 26, 2007
- Gary G. Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stress release mechanism in MEMS device and method of making same
- Publication number 20070024156
- Publication date Feb 1, 2007
- Gary G. Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SINGLE PROOF MASS, 3 AXIS MEMS TRANSDUCER
- Publication number 20050097957
- Publication date May 12, 2005
- MOTOROLA INC.
- Andrew C. McNeil
- G01 - MEASURING TESTING
Information Patent Application
Lead frame with flag support structure
- Publication number 20050056920
- Publication date Mar 17, 2005
- Gary G. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE PROOF MASS, 3 AXIS MEMS TRANSDUCER
- Publication number 20050005698
- Publication date Jan 13, 2005
- MOTOROLA INC.
- Andrew C. McNeil
- G01 - MEASURING TESTING
Information Patent Application
Method of adding mass to MEMS structures
- Publication number 20040219340
- Publication date Nov 4, 2004
- MOTOROLA INC.
- Andrew C. McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

Vibration robust x-axis ring gyro transducer

MEMS sensor with stress isolation and method of fabrication

Inertial sensor with off-axis spring system

MEMS device with central anchor for stress isolation

MEMS sensor with folded torsion springs

Semiconductor device with reduced sensitivity to package stress

Multiple axis transducer with multiple sensing range capability

Methods and apparatus for a MEMS gyro sensor

Stress release mechanism in MEMS device and method of making same

Lead frame with flag support structure

Method of adding mass to MEMS structures

Single proof mass, 3 axis MEMS transducer

Single proof mass, 3 axis MEMS transducer

Patents Applicationslast 30 patents

SPRING SYSTEM FOR MEMS DEVICE

MEMS SENSOR WITH STRESS ISOLATION AND METHOD OF FABRICATION

Vibration Robust X-Axis Ring Gyro Transducer

INERTIAL SENSOR WITH OFF-AXIS SPRING SYSTEM

MEMS DEVICE WITH CENTRAL ANCHOR FOR STRESS ISOLATION

MEMS SENSOR WITH FOLDED TORSION SPRINGS

FRAMED TRANSDUCER DEVICE

SEMICONDUCTOR DEVICE WITH REDUCED SENSITIVITY TO PACKAGE STRESS

MULTIPLE AXIS TRANSDUCER WITH MULTIPLE SENSING RANGE CAPABILITY

Methods and apparatus for a MEMS gyro sensor

MEMS device and method of fabrication

Stress release mechanism in MEMS device and method of making same

SINGLE PROOF MASS, 3 AXIS MEMS TRANSDUCER

Lead frame with flag support structure

SINGLE PROOF MASS, 3 AXIS MEMS TRANSDUCER

Method of adding mass to MEMS structures