Gary P. Morrison

Person

Garland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 10,262,957
- Issue date Apr 16, 2019
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,941,228
- Issue date Apr 10, 2018
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,666,553
- Issue date May 30, 2017
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having low resistance TSV comprising ground connection
- Patent number 8,436,475
- Issue date May 7, 2013
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having low resistance TSV comprising ground connection
- Patent number 8,431,481
- Issue date Apr 30, 2013
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having low resistance TSV comprising ground connection
- Patent number 8,178,976
- Issue date May 15, 2012
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices with face-up die having TSV connection...
- Patent number 8,154,134
- Issue date Apr 10, 2012
- Texas Instruments Incorporated
- Thomas D. Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder cap application process on copper bump using solder powder film
- Patent number 7,790,597
- Issue date Sep 7, 2010
- Texas Instruments Incorporated
- Satyendra S. Chauhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having a grid array of pin-attached balls
- Patent number 7,462,783
- Issue date Dec 9, 2008
- Texas Instruments Incorporated
- Gregory E. Howard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array package for high speed devices
- Patent number 6,762,498
- Issue date Jul 13, 2004
- Texas Instruments Incorporated
- Gary P. Morrison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20170229408
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20150364816
- Publication date Dec 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WSP DIE WITH OFFSET REDISTRIBUTION LAYER CAPTURE PAD
- Publication number 20130299966
- Publication date Nov 14, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anil KV Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WSP DIE HAVING REDISTRIBUTION LAYER CAPTURE PAD WITH AT LEAST ONE VOID
- Publication number 20130299967
- Publication date Nov 14, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey David Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Device Having Low Resistance TSV Comprising Ground Connection
- Publication number 20120202321
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Device Having Low Resistance TSV Comprising Ground Connection
- Publication number 20120193814
- Publication date Aug 2, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES WITH FACE-UP DIE HAVING TSV CONNECTION...
- Publication number 20090278245
- Publication date Nov 12, 2009
- Texas Instruments Inc.
- THOMAS D. BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE HAVING LOW RESISTANCE TSV COMPRISING GROUND CONNECTION
- Publication number 20090278244
- Publication date Nov 12, 2009
- Texas Instruments Inc.
- RAJIV DUNNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS
- Publication number 20090061566
- Publication date Mar 5, 2009
- TEXAS INSTRUMENTS INCORPORATED
- GREGORY E. HOWARD
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER CAP APPLICATION PROCESS ON COPPER BUMP USING SOLDER POWDER FILM
- Publication number 20090014898
- Publication date Jan 15, 2009
- Satyendra S. Chauhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package having a grid array of pin-attached balls
- Publication number 20060021795
- Publication date Feb 2, 2006
- Gregory E. Howard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chip-scale packages stacked on folded interconnector for vertical a...
- Publication number 20020114143
- Publication date Aug 22, 2002
- Gary P. Morrison
- H01 - BASIC ELECTRIC ELEMENTS

Gary P. Morrison

Person

Patents Grantslast 30 patents

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

IC device having low resistance TSV comprising ground connection

IC device having low resistance TSV comprising ground connection

IC device having low resistance TSV comprising ground connection

Packaged electronic devices with face-up die having TSV connection...

Solder cap application process on copper bump using solder powder film

Semiconductor package having a grid array of pin-attached balls

Ball grid array package for high speed devices

Patents Applicationslast 30 patents

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

WSP DIE WITH OFFSET REDISTRIBUTION LAYER CAPTURE PAD

WSP DIE HAVING REDISTRIBUTION LAYER CAPTURE PAD WITH AT LEAST ONE VOID

IC Device Having Low Resistance TSV Comprising Ground Connection

IC Device Having Low Resistance TSV Comprising Ground Connection

PACKAGED ELECTRONIC DEVICES WITH FACE-UP DIE HAVING TSV CONNECTION...

IC DEVICE HAVING LOW RESISTANCE TSV COMPRISING GROUND CONNECTION

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

SOLDER CAP APPLICATION PROCESS ON COPPER BUMP USING SOLDER POWDER FILM

Semiconductor package having a grid array of pin-attached balls

Chip-scale packages stacked on folded interconnector for vertical a...