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Gary Paul Vlasak
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Owego, NY, US
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last 30 patents
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Patent Grant
Process for selective application of solder to circuit packages
Patent number
5,672,260
Issue date
Sep 30, 1997
International Business Machines Corporation
Charles Francis Carey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating apparatus
Patent number
5,656,139
Issue date
Aug 12, 1997
International Business Machines Corporation
Charles Francis Carey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Process for selective application of solder to circuit packages
Patent number
5,597,469
Issue date
Jan 28, 1997
International Business Machines Corporation
Charles F. Carey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Applying solder to high density substrates
Patent number
5,316,788
Issue date
May 31, 1994
International Business Machines Corporation
Eric P. Dibble
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Method for preparing substrate surfaces for electroless deposition
Patent number
4,066,809
Issue date
Jan 3, 1978
International Business Machines Corporation
Warren Alan Alpaugh
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...