Gary R. Hill

Person

Essex Junction, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Millimeter wave wafer level chip scale packaging (WLCSP) device
- Patent number 9,236,361
- Issue date Jan 12, 2016
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave wafer level chip scale packaging (WLCSP) device and...
- Patent number 9,159,692
- Issue date Oct 13, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave wafer level chip scale packaging (WLCSP) device and...
- Patent number 8,907,470
- Issue date Dec 9, 2014
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing a curved substrate and resulting structure
- Patent number 6,150,255
- Issue date Nov 21, 2000
- International Business Machines Corporation
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 6,137,299
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Robert R. Cadieux
- G01 - MEASURING TESTING
Information Patent Grant
Method of planarizing a curved substrate and resulting structure
- Patent number 5,940,729
- Issue date Aug 17, 1999
- International Business Machines Corp.
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,672,980
- Issue date Sep 30, 1997
- International Business Machines Corporation
- Richard Gordon Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,659,256
- Issue date Aug 19, 1997
- International Business Machines Corporation
- Richard Gordon Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,528,159
- Issue date Jun 18, 1996
- International Business Machine Corp.
- Richard G. Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,523,696
- Issue date Jun 4, 1996
- International Business Machines Corp.
- Richard G. Charlton
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE AND...
- Publication number 20150037913
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE
- Publication number 20150035145
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE AND...
- Publication number 20140231992
- Publication date Aug 21, 2014
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS

Gary R. Hill

Person

Patents Grantslast 30 patents

Millimeter wave wafer level chip scale packaging (WLCSP) device

Millimeter wave wafer level chip scale packaging (WLCSP) device and...

Millimeter wave wafer level chip scale packaging (WLCSP) device and...

Method of planarizing a curved substrate and resulting structure

Method and apparatus for testing integrated circuit chips

Method of planarizing a curved substrate and resulting structure

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing integrated circuit chips

Patents Applicationslast 30 patents

MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE AND...

MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE

MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE AND...