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Gary W. Williams

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  • Rowlett, TX, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    System and method of providing power
    • Patent number 7,851,945
    • Issue date Dec 14, 2010
    • Hewlett-Packard Development Company, L.P.
    • Gary Williams
    • G05 - CONTROLLING REGULATING
  • Information Patent Grant

    Redundant power beneath circuit board
    • Patent number 7,791,889
    • Issue date Sep 7, 2010
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method and apparatus for distributing electrical power
    • Patent number 7,719,809
    • Issue date May 18, 2010
    • Hewlett-Packard Development Company, L.P.
    • Paul A. Wirtzberger
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Independent thresholds for power supply control circuitry
    • Patent number 7,649,404
    • Issue date Jan 19, 2010
    • Hewlett-Packard Development Company, L.P.
    • John Sikora
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Multi-chip module with power system
    • Patent number 7,499,281
    • Issue date Mar 3, 2009
    • Hewlett-Packard Development Company, L.P.
    • Shaun L. Harris
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Multi-processor module
    • Patent number 7,475,175
    • Issue date Jan 6, 2009
    • Hewlett-Packard Development Company, L.P.
    • David A. Klein
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Redundant voltage distribution system and method for a memory modul...
    • Patent number 7,360,104
    • Issue date Apr 15, 2008
    • Hewlett-Packard Development Company, L.P.
    • Shaun L. Harris
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Heat spreader with multiple stacked printed circuit boards
    • Patent number 7,345,885
    • Issue date Mar 18, 2008
    • Hewlett-Packard Development Company, L.P.
    • Brent A. Boudreaux
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Multi-chip module with power system
    • Patent number 7,336,490
    • Issue date Feb 26, 2008
    • Hewlett-Packard Development Company, L.P.
    • Shaun L. Harris
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Processor module with thermal dissipation device
    • Patent number 7,327,569
    • Issue date Feb 5, 2008
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    System and method for managing power consumption for a plurality of...
    • Patent number 7,313,706
    • Issue date Dec 25, 2007
    • Hewlett-Packard Development Company, L.P.
    • Gary Wayne Williams
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Multi-chip module with power system and pass-thru holes
    • Patent number 7,289,328
    • Issue date Oct 30, 2007
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Apparatus and method for multiprocessor circuit board
    • Patent number 7,280,364
    • Issue date Oct 9, 2007
    • Hewlett-Packard Development Company, L.P.
    • Shaun L. Harris
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Multi-processor module with redundant power
    • Patent number 7,280,365
    • Issue date Oct 9, 2007
    • Hewlett-Packard Development Company, L.P.
    • Steven A. Belson
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Processor module for system board
    • Patent number 7,254,027
    • Issue date Aug 7, 2007
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Modular voltage regulator
    • Patent number 7,154,754
    • Issue date Dec 26, 2006
    • Hewlett-Packard Development Company, L.P.
    • Stephan Karl Barsun
    • G05 - CONTROLLING REGULATING
  • Information Patent Grant

    System and method for power distribution
    • Patent number 7,082,042
    • Issue date Jul 25, 2006
    • Hewlett-Packard Development Company, L.P.
    • Shaun L. Harris
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    System and method for electrically interconnecting boards
    • Patent number 7,074,051
    • Issue date Jul 11, 2006
    • Hewlett-Packard Development Company, L.P.
    • Gary Williams
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic module for system board with pass-thru holes
    • Patent number 7,072,185
    • Issue date Jul 4, 2006
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Multi-chip module with stacked redundant power
    • Patent number 7,068,515
    • Issue date Jun 27, 2006
    • Hewlett-Packard Development Company, L.P.
    • Shaun L. Harris
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Redundant power for processor circuit board
    • Patent number 7,064,955
    • Issue date Jun 20, 2006
    • Hewlett-Packard Development Company, L.P.
    • Shaun L. Harris
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Routing system
    • Patent number 7,018,215
    • Issue date Mar 28, 2006
    • Hewlett-Packard Development Company, L.P.
    • Gary W. Williams
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electrical connector
    • Patent number 6,969,261
    • Issue date Nov 29, 2005
    • Hewlett-Packard Development Company, L.P.
    • Shaun L. Harris
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,947,286
    • Issue date Sep 20, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,922,340
    • Issue date Jul 26, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,900,987
    • Issue date May 31, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,873,530
    • Issue date Mar 29, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,862,186
    • Issue date Mar 1, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,816,378
    • Issue date Nov 9, 2004
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Power module for multi-chip printed circuit boards
    • Patent number 6,771,507
    • Issue date Aug 3, 2004
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents