George Chang

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Backside ohmic contacts for semiconductor devices
- Patent number 12,211,920
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation and corrosion prevention in semiconductor devices and sem...
- Patent number 12,051,661
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,417,598
- Issue date Aug 16, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 11,043,420
- Issue date Jun 22, 2021
- Semiconductor Components Industries, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,651,124
- Issue date May 12, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding systems and related methods
- Patent number 10,535,623
- Issue date Jan 14, 2020
- Semiconductor Components Industries, LLC
- Wentao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,396,028
- Issue date Aug 27, 2019
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding systems and related methods
- Patent number 10,109,610
- Issue date Oct 23, 2018
- Semiconductor Components Industries, LLC
- Wentao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 9,984,968
- Issue date May 29, 2018
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming low capacitance ESD device and structure therefor
- Patent number 8,039,359
- Issue date Oct 18, 2011
- Semiconductor Components Industries, LLC
- Thomas Keena
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor component
- Patent number 8,035,161
- Issue date Oct 11, 2011
- Semiconductor Components Industries, LLC
- Prasad Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage sensor device and method therefor
- Patent number 7,955,943
- Issue date Jun 7, 2011
- Semiconductor Components Industries, LLC
- Jefferson W. Hall
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 7,767,529
- Issue date Aug 3, 2010
- Semiconductor Componenets Industries, LLC
- Prasad Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming low capacitance ESD device and structure therefor
- Patent number 7,538,395
- Issue date May 26, 2009
- Semiconductor Components Industries, LLC
- Thomas Keena
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...
- Publication number 20240387425
- Publication date Nov 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...
- Publication number 20220328434
- Publication date Oct 13, 2022
- Semiconductor Components Industries, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE OHMIC CONTACTS FOR SEMICONDUCTOR DEVICES
- Publication number 20220328643
- Publication date Oct 13, 2022
- Semiconductor Components Industries, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20210305096
- Publication date Sep 30, 2021
- Semiconductor Components Industries, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ELECTRONIC DIE SINGULATION USING ALIGNMENT...
- Publication number 20210296176
- Publication date Sep 23, 2021
- Semiconductor Components Industries, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200251413
- Publication date Aug 6, 2020
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20200105700
- Publication date Apr 2, 2020
- Semiconductor Components Industries, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190229052
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20180254243
- Publication date Sep 6, 2018
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20180005936
- Publication date Jan 4, 2018
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20160307865
- Publication date Oct 20, 2016
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT
- Publication number 20100237409
- Publication date Sep 23, 2010
- Prasad Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SENSOR DEVICE AND METHOD THEREFOR
- Publication number 20100022064
- Publication date Jan 28, 2010
- Jefferson W. Hall
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF FORMING LOW CAPACITANCE ESD DEVICE AND STRUCTURE THEREFOR
- Publication number 20090162988
- Publication date Jun 25, 2009
- Thomas Keena
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING LOW CAPACITANCE ESD DEVICE AND STRUCTURE THEREFOR
- Publication number 20090079022
- Publication date Mar 26, 2009
- Thomas Keena
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20080258210
- Publication date Oct 23, 2008
- Prasad Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS

George Chang

Person

Patents Grantslast 30 patents

Backside ohmic contacts for semiconductor devices

Oxidation and corrosion prevention in semiconductor devices and sem...

Semiconductor package and related methods

Fan-out wafer level packaging of semiconductor devices

Semiconductor package and related methods

Wire bonding systems and related methods

Semiconductor package and related methods

Wire bonding systems and related methods

Semiconductor package and related methods

Method of forming low capacitance ESD device and structure therefor

Semiconductor component

High voltage sensor device and method therefor

Semiconductor component and method of manufacture

Method of forming low capacitance ESD device and structure therefor

Patents Applicationslast 30 patents

OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...

OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...

BACKSIDE OHMIC CONTACTS FOR SEMICONDUCTOR DEVICES

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

STRUCTURE AND METHOD FOR ELECTRONIC DIE SINGULATION USING ALIGNMENT...

SEMICONDUCTOR PACKAGE AND RELATED METHODS

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND RELATED METHODS

WIRE BONDING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND RELATED METHODS

WIRE BONDING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR COMPONENT

HIGH VOLTAGE SENSOR DEVICE AND METHOD THEREFOR

METHOD OF FORMING LOW CAPACITANCE ESD DEVICE AND STRUCTURE THEREFOR

METHOD OF FORMING LOW CAPACITANCE ESD DEVICE AND STRUCTURE THEREFOR

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE