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George Hsieh
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Portland, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic device heat transfer system and related methods
Patent number
10,098,220
Issue date
Oct 9, 2018
Intel Corporation
Zuyang Liang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Using the wave soldering process to attach motherboard chipset heat...
Patent number
7,595,991
Issue date
Sep 29, 2009
Intel Corporation
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Using the wave soldering process to attach motherboard chipset heat...
Patent number
7,333,335
Issue date
Feb 19, 2008
Intel Corporation
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structural reinforcement for electronic substrate
Patent number
7,161,238
Issue date
Jan 9, 2007
Intel Corporation
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat sink and retaining clip assembly
Patent number
7,142,429
Issue date
Nov 28, 2006
Intel Corporation
George Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective PCB stiffening with preferentially oriented fibers
Patent number
7,041,357
Issue date
May 9, 2006
Intel Corporation
George Hsieh
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Heat sink and retaining clip assembly
Patent number
6,947,283
Issue date
Sep 20, 2005
Intel Corporation
George Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Attaching components to a printed circuit card
Patent number
6,878,305
Issue date
Apr 12, 2005
Intel Corporation
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Attaching components to a printed circuit card
Patent number
6,875,367
Issue date
Apr 5, 2005
Intel Corporation
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic assembly with solderable heat sink and methods of manufa...
Patent number
6,822,867
Issue date
Nov 23, 2004
Intel Corporation
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Attaching components to a printed circuit card
Patent number
6,818,155
Issue date
Nov 16, 2004
Intel Corporation
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Selective PCB stiffening with preferentially oriented fibers
Patent number
6,682,802
Issue date
Jan 27, 2004
Intel Corporation
George Hsieh
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Frame support for a printed board assembly
Patent number
6,594,151
Issue date
Jul 15, 2003
Intel Corporation
Scott Dixon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat sink assembly and method
Patent number
6,590,771
Issue date
Jul 8, 2003
Intel Corporation
Jeffrey J. Sopko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anti-tombstoning structures and methods of manufacture
Patent number
6,566,611
Issue date
May 20, 2003
Intel Corporation
Michael Kochanowski
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Clamshell heatsink
Patent number
6,535,383
Issue date
Mar 18, 2003
Intel Corporation
Mandy G. Terhaar
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE WARPAGE REDUCTION TECHNIQUES WITH LAMINATE GLASS CLOTH W...
Publication number
20230209702
Publication date
Jun 29, 2023
Intel Corporation
Satyajit WALWADKAR
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE HEAT TRANSFER SYSTEM AND RELATED METHODS
Publication number
20190045666
Publication date
Feb 7, 2019
Intel Corporation
Zuyang Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic device heat transfer system and related methods
Publication number
20170188448
Publication date
Jun 29, 2017
Intel Corporation
Zuyang Liang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
USING THE WAVE SOLDERING PROCESS TO ATTACH MOTHERBOARD CHIPSET HEAT...
Publication number
20080130242
Publication date
Jun 5, 2008
Intel Corporation
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Using the wave soldering process to attach motherboard chipset heat...
Publication number
20060050484
Publication date
Mar 9, 2006
Intel Corporation
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Heat sink and retaining clip assembly
Publication number
20060012960
Publication date
Jan 19, 2006
Intel Corporation
George Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective PCB stiffening with preferentially oriented fibers
Publication number
20040131824
Publication date
Jul 8, 2004
Intel Corporation
George Hsieh
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Structural reinforcement for electronic substrate
Publication number
20040124517
Publication date
Jul 1, 2004
George Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Attaching components to a printed circuit card
Publication number
20040109974
Publication date
Jun 10, 2004
George Hsieh
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Attaching components to a printed circuit card
Publication number
20040087173
Publication date
May 6, 2004
George Hsieh
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Heat sink and retaining clip assembly
Publication number
20040062007
Publication date
Apr 1, 2004
George Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Attaching components to a printed circuit card
Publication number
20030121602
Publication date
Jul 3, 2003
George Hsieh
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
HEAT SINK ASSEMBLY AND METHOD
Publication number
20030103332
Publication date
Jun 5, 2003
Intel Corporation
Jeffrey J. Sopko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRAME SUPPORT FOR A PRINTED BOARD ASSEMBLY
Publication number
20030103337
Publication date
Jun 5, 2003
Intel Corporation
Scott Dixon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ANTI-TOMBSTONING STRUCTURES AND METHODS OF MANUFACTURE
Publication number
20030056975
Publication date
Mar 27, 2003
Intel Corporation
Michael Kochanowski
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
ELECTRONIC ASSEMBLY WITH SOLDERABLE HEAT SINK AND METHODS OF MANUFA...
Publication number
20030011997
Publication date
Jan 16, 2003
Intel Corporation
George Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLAMSHELL HEATSINK
Publication number
20030007326
Publication date
Jan 9, 2003
Intel Corporation
Mandy G. Terhaar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective PCB stiffening with preferentially oriented fibers
Publication number
20020076522
Publication date
Jun 20, 2002
Intel Corporation
George Hsieh
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL