Claims
- 1. A substrate comprising a plurality of opposing sets of pads, each pad in a set to receive a respective terminal of an electronic component in a bonding region thereof, and at least one pad of each set having an irregular region.
- 2. The substrate of claim 1, wherein each set of pads has an inter-pad region, and wherein the irregular region is disposed further from the inter-pad region than the bonding region.
- 3. The substrate of claim 1, wherein each set comprises two pads, each having an irregular region.
- 4. The substrate of claim 1, wherein the irregular region has a geometry from the group comprising one or more indentations, notches, grooves, fingers, digits, cut-outs, cut-aways, crenellations, and zig-zags.
- 5. A substrate comprising a plurality of pairs of pads, each pad to receive a respective terminal of an electronic component, and each pad comprising at least one notch.
- 6. The substrate recited in claim 5, wherein each pair of pads has an inter-pad region, and wherein the at least one notch of each pad of a pair of pads is disposed in a direction away from the inter-pad region.
- 7. The substrate recited in claim 5, wherein each pad comprises a plurality of notches.
- 8. The substrate recited in claim 5, wherein each pad is to receive the respective terminal of the electronic component in a bonding region, and wherein the bonding region does not overlap the at least one notch.
- 9. An electronic assembly comprising:
a substrate having a plurality of sets of pads, each pad having a perimeter with at least one indentation therein; and a component mounted on each set of pads, each pad in a set being coupled to a respective terminal of the component.
- 10. The electronic assembly recited in claim 9, wherein each set comprises two pads.
- 11. The electronic assembly recited in claim 9, wherein each pad comprises a plurality of indentations.
- 12. The electronic assembly recited in claim 9, wherein each pad is coupled to its respective terminal in a bonding region, and wherein the bonding region does not overlap the at least one indentation.
- 13. The electronic assembly recited in claim 9, wherein the component is from the group comprising a capacitor, inductor, resistor, fuse, transistor, and integrated circuit.
- 14. An electronic system comprising an electronic assembly having:
a substrate having a plurality of sets of pads, each pad having a perimeter with at least one indentation therein; and an electric component mounted on each set of pads, each pad in a set being coupled to a respective terminal of the electric component.
- 15. The electronic system recited in claim 14, wherein each set comprises two pads.
- 16. The electronic system recited in claim 14, wherein each pad comprises a plurality of indentations.
- 17. The electronic system recited in claim 14, wherein each pad is coupled to its respective terminal in a bonding region, and wherein the bonding region does not overlap the at least one indentation.
- 18. The electronic system recited in claim 14, wherein the component is from the group comprising a capacitor, inductor, resistor, fuse, transistor, and integrated circuit.
- 19. A method comprising:
fabricating a plurality of sets of pads on a surface of a substrate, each pad having a perimeter, each pad in a set to receive a respective terminal of an electronic component; and forming at least one indentation in the perimeter of each pad.
- 20. The method recited in claim 19, wherein each set comprises two pads.
- 21. The method recited in claim 19, wherein forming comprises forming a plurality of indentations in the perimeter of each pad.
- 22. The method recited in claim 19, wherein each set of pads comprises an inter-pad region, and wherein forming comprises forming the at least one indentation in a portion of the perimeter that does not adjoin an inter-pad region.
- 23. The method recited in claim 19, wherein each set of pads comprises an inter-pad region, and wherein forming comprises forming the at least one indentation out-board of the inter-pad region.
- 24. The method recited in claim 19, wherein the perimeter has a geometric pattern from the group comprising a rectangle, a circle, an oval, a free-form pattern, or a combination of the foregoing.
- 25. A method comprising:
fabricating a plurality of sets of pads on a surface of a substrate, each pad having perimeter; forming at least one notch in the perimeter of each pad; and mounting a component on each set of pads, each pad in a set being coupled to a respective terminal of the component in a bonding region of the pad.
- 26. The method recited in claim 25, wherein each set comprises two pads.
- 27. The method recited in claim 25, wherein forming comprises forming a plurality of notches in the perimeter of each pad.
- 28. The method recited in claim 25, wherein forming comprises forming the at least one notch in a portion of the perimeter that does not adjoin the bonding region.
- 29. The method recited in claim 25, wherein forming comprises forming the at least one notch out-board of the bonding region.
- 30. The method recited in claim 25, wherein the perimeter has a geometric pattern from the group comprising a rectangle, a circle, an oval, a free-form pattern, or a combination of the foregoing.
- 31. The method recited in claim 25, wherein, in mounting, the component is from the group comprising a capacitor, inductor, resistor, fuse, transistor, and integrated circuit.
RELATED INVENTION
[0001] The present invention is related to the following invention which is assigned to the same assignee as the present invention:
[0002] Ser. No. 09/887597, entitled “Via Intersect Pad for Electronic Components and Methods of Manufacture”.