George M. Scott

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacturing electronic devices
- Patent number 12,107,037
- Issue date Oct 1, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- George Scott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a lead flank and method of manufacturin...
- Patent number 11,646,248
- Issue date May 9, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial solder bump support structure
- Patent number 9,431,359
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling and monitoring the potential
- Patent number 9,347,147
- Issue date May 24, 2016
- International Business Machines Corporation
- Charles L. Arvin
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for controlling and monitoring the potential
- Patent number 9,062,388
- Issue date Jun 23, 2015
- International Business Machines Corporation
- Charles L. Arvin
- G01 - MEASURING TESTING
Information Patent Grant
Mapping assurance method and apparatus for integrating systems
- Patent number 9,052,879
- Issue date Jun 9, 2015
- International Business Machines Corporation
- George M. Scott
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder bump connections
- Patent number 8,778,792
- Issue date Jul 15, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) with variable offset bumps
- Patent number 8,710,656
- Issue date Apr 29, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application network communication
- Patent number 8,661,157
- Issue date Feb 25, 2014
- International Business Machines Corporation
- George M. Scott
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Coaxial solder bump support structure
- Patent number 8,563,416
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Brian Michael Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump connections
- Patent number 8,492,892
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application network communication
- Patent number 8,468,264
- Issue date Jun 18, 2013
- International Businsess Machines Corporation
- George M. Scott
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application network communication
- Patent number 8,321,590
- Issue date Nov 27, 2012
- International Business Machines Corporation
- George M. Scott
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Offset solder vias, methods of manufacturing and design structures
- Patent number 8,298,929
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Virtualization method and apparatus for integrating enterprise appl...
- Patent number 8,296,433
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Luis F. Stevens
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Application network communication
- Patent number 8,285,873
- Issue date Oct 9, 2012
- International Business Machines Corporation
- George M. Scott
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Application network communication method and apparatus
- Patent number 7,610,404
- Issue date Oct 27, 2009
- Cast Iron Systems, Inc.
- George M. Scott
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240113090
- Publication date Apr 4, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Myoung KI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20230352370
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20230137998
- Publication date May 4, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- George Scott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LEAD FLANK AND METHOD OF MANUFACTURIN...
- Publication number 20220216132
- Publication date Jul 7, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20200395272
- Publication date Dec 17, 2020
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) WITH VARIABLE OFFSET BUMPS
- Publication number 20140021600
- Publication date Jan 23, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL SOLDER BUMP SUPPORT STRUCTURE
- Publication number 20130320528
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP CONNECTIONS
- Publication number 20130140695
- Publication date Jun 6, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION NETWORK COMMUNICATION
- Publication number 20130073740
- Publication date Mar 21, 2013
- International Business Machines Corporation
- George M. Scott
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COAXIAL SOLDER BUMP SUPPORT STRUCTURE
- Publication number 20130026624
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Brian Michael Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CONTROLLING AND MONITORING THE POTENTIAL
- Publication number 20130001198
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STEPWISE TEMPLATE INTEGRATION METHOD AND SYSTEM
- Publication number 20120291001
- Publication date Nov 15, 2012
- Vasile Patrascu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER BUMP CONNECTIONS
- Publication number 20120146212
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES
- Publication number 20120139123
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR CONTROLLING AND MONITORING THE POTENTIAL
- Publication number 20120043301
- Publication date Feb 23, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20110147922
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stepwise template integration method and system
- Publication number 20110131545
- Publication date Jun 2, 2011
- Vasile Patrascu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPLICATION NETWORK COMMUNICATION METHOD AND APPARATUS
- Publication number 20110047127
- Publication date Feb 24, 2011
- George M. Scott
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPLICATION NETWORK COMMUNICATION METHOD AND APPARATUS
- Publication number 20110047591
- Publication date Feb 24, 2011
- George M. Scott
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPLICATION NETWORK COMMUNICATION METHOD AND APPARATUS
- Publication number 20110047293
- Publication date Feb 24, 2011
- GEORGE SCOTT
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VIRTUALIZATION METHOD AND APPARATUS FOR INTEGRATING ENTERPRISE APPL...
- Publication number 20090094364
- Publication date Apr 9, 2009
- Luis F. Stevens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Mapping assurance method and apparatus for integrating systems
- Publication number 20060190931
- Publication date Aug 24, 2006
- George M. Scott
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Application network communication method and apparatus
- Publication number 20040019696
- Publication date Jan 29, 2004
- George M. Scott
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method and apparatus for handling the registration of multiple and...
- Publication number 20030023577
- Publication date Jan 30, 2003
- Borland Software Corporation
- Ioana Sundius
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

George M. Scott

Person

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacturing electronic devices

Semiconductor device having a lead flank and method of manufacturin...

Coaxial solder bump support structure

Method and apparatus for controlling and monitoring the potential

Method and apparatus for controlling and monitoring the potential

Mapping assurance method and apparatus for integrating systems

Solder bump connections

Redistribution layer (RDL) with variable offset bumps

Structures and methods to reduce maximum current density in a solde...

Application network communication

Coaxial solder bump support structure

Solder bump connections

Application network communication

Structures and methods to reduce maximum current density in a solde...

Application network communication

Offset solder vias, methods of manufacturing and design structures

Virtualization method and apparatus for integrating enterprise appl...

Application network communication

Application network communication method and apparatus

Patents Applicationslast 30 patents

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE HAVING A LEAD FLANK AND METHOD OF MANUFACTURIN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

REDISTRIBUTION LAYER (RDL) WITH VARIABLE OFFSET BUMPS

COAXIAL SOLDER BUMP SUPPORT STRUCTURE

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

SOLDER BUMP CONNECTIONS

APPLICATION NETWORK COMMUNICATION

COAXIAL SOLDER BUMP SUPPORT STRUCTURE

METHOD AND APPARATUS FOR CONTROLLING AND MONITORING THE POTENTIAL

STEPWISE TEMPLATE INTEGRATION METHOD AND SYSTEM

SOLDER BUMP CONNECTIONS

OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES

METHOD AND APPARATUS FOR CONTROLLING AND MONITORING THE POTENTIAL

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

Stepwise template integration method and system

APPLICATION NETWORK COMMUNICATION METHOD AND APPARATUS

APPLICATION NETWORK COMMUNICATION METHOD AND APPARATUS

APPLICATION NETWORK COMMUNICATION METHOD AND APPARATUS

VIRTUALIZATION METHOD AND APPARATUS FOR INTEGRATING ENTERPRISE APPL...

Mapping assurance method and apparatus for integrating systems

Application network communication method and apparatus

Method and apparatus for handling the registration of multiple and...