George W. Pearson

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Crawley Down, GB

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Patents Grantslast 30 patents

Information Patent Grant
Chip-scale package
- Patent number 8,466,546
- Issue date Jun 18, 2013
- International Rectifier Corporation
- Andy Farlow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder flow stops for semiconductor die substrates
- Patent number 7,615,873
- Issue date Nov 10, 2009
- International Rectifier Corporation
- Mark Steers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 7,573,107
- Issue date Aug 11, 2009
- International Rectifier Corporation
- Alberto Guerra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plural semiconductor die housed in common package with split heat sink
- Patent number 5,977,630
- Issue date Nov 2, 1999
- International Rectifier Corp.
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip-scale package
- Publication number 20060249836
- Publication date Nov 9, 2006
- Andy Farlow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module
- Publication number 20060071238
- Publication date Apr 6, 2006
- Alberto Guerra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder flow stops for semiconductor die substrates
- Publication number 20050253258
- Publication date Nov 17, 2005
- International Rectifier Corporation
- Mark Steers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Intelligent motor drive module with injection molded package
- Publication number 20030107120
- Publication date Jun 12, 2003
- International Rectifier Corporation
- Glyn Connah
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...