Gerald Cois Byrd

Person

Shadow Hills, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electro-optical package and method of fabrication
- Patent number 12,165,944
- Issue date Dec 10, 2024
- Rockley Photonics Limited
- Shuhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical isolator
- Patent number 11,886,058
- Issue date Jan 30, 2024
- Rockley Photonics Limited
- Adam Scofield
- G02 - OPTICS
Information Patent Grant
Optoelectronic device
- Patent number 11,815,748
- Issue date Nov 14, 2023
- Rockley Photonics Limited
- James Dongyoon Oh
- G02 - OPTICS
Information Patent Grant
Module with transmit optical subassembly and receive optical subass...
- Patent number 11,262,498
- Issue date Mar 1, 2022
- Rockley Photonics Limited
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic module package
- Patent number 11,239,377
- Issue date Feb 1, 2022
- Rockley Photonics Limited
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device
- Patent number 11,209,678
- Issue date Dec 28, 2021
- Rockley Photonics Limited
- Dong Yoon Oh
- G02 - OPTICS
Information Patent Grant
Mode converter and method of fabricating thereof
- Patent number 11,133,225
- Issue date Sep 28, 2021
- Rockley Photonics Limited
- John Drake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copackaging of asic and silicon photonics
- Patent number 10,877,217
- Issue date Dec 29, 2020
- Rockley Photonics Limited
- Gerald Cois Byrd
- G02 - OPTICS
Information Patent Grant
Module with transmit and receive optical subassemblies with specifi...
- Patent number 10,761,262
- Issue date Sep 1, 2020
- Rockley Photonics Limited
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copackaging of ASIC and silicon photonics
- Patent number 10,365,436
- Issue date Jul 30, 2019
- Rockley Photonics Limited
- Gerald Cois Byrd
- G02 - OPTICS
Information Patent Grant
Interposer beam expander chip
- Patent number 10,317,620
- Issue date Jun 11, 2019
- Rockley Photonics Limited
- Andrew George Rickman
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC MODULE PACKAGE
- Publication number 20220262962
- Publication date Aug 18, 2022
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois BYRD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ISOLATOR
- Publication number 20220244584
- Publication date Aug 4, 2022
- ROCKLEY PHOTONICS LIMITED
- Adam SCOFIELD
- G02 - OPTICS
Information Patent Application
ELECTRO-OPTICAL PACKAGE AND METHOD OF FABRICATION
- Publication number 20220189841
- Publication date Jun 16, 2022
- ROCKLEY PHOTONICS LIMITED
- Shuhe LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE
- Publication number 20220163824
- Publication date May 26, 2022
- ROCKLEY PHOTONICS LIMITED
- James Dongyoon OH
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC MODULE PACKAGE
- Publication number 20220109075
- Publication date Apr 7, 2022
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois BYRD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH TRANSMIT OPTICAL SUBASSEMBLY AND RECEIVE OPTICAL SUBASS...
- Publication number 20200363585
- Publication date Nov 19, 2020
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODE CONVERTER AND METHOD OF FABRICATING THEREOF
- Publication number 20200258791
- Publication date Aug 13, 2020
- ROCKLEY PHOTONICS LIMITED
- John Drake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPACKAGING OF ASIC AND SILICON PHOTONICS
- Publication number 20200073050
- Publication date Mar 5, 2020
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois Byrd
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC DEVICE
- Publication number 20190258094
- Publication date Aug 22, 2019
- ROCKLEY PHOTONICS LIMITED
- Dong Yoon Oh
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC MODULE PACKAGE
- Publication number 20190044002
- Publication date Feb 7, 2019
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH TRANSMIT OPTICAL SUBASSEMBLY AND RECEIVE OPTICAL SUBASS...
- Publication number 20190041576
- Publication date Feb 7, 2019
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois Byrd
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COPACKAGING OF ASIC AND SILICON PHOTONICS
- Publication number 20180196196
- Publication date Jul 12, 2018
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois Byrd
- G02 - OPTICS
Information Patent Application
INTERPOSER BEAM EXPANDER CHIP
- Publication number 20170003450
- Publication date Jan 5, 2017
- ROCKLEY PHOTONICS LIMITED
- Andrew George Rickman
- G02 - OPTICS

Gerald Cois Byrd

Person

Patents Grantslast 30 patents

Electro-optical package and method of fabrication

Optical isolator

Optoelectronic device

Module with transmit optical subassembly and receive optical subass...

Optoelectronic module package

Optoelectronic device

Mode converter and method of fabricating thereof

Copackaging of asic and silicon photonics

Module with transmit and receive optical subassemblies with specifi...

Copackaging of ASIC and silicon photonics

Interposer beam expander chip

Patents Applicationslast 30 patents

OPTOELECTRONIC MODULE PACKAGE

OPTICAL ISOLATOR

ELECTRO-OPTICAL PACKAGE AND METHOD OF FABRICATION

OPTOELECTRONIC DEVICE

OPTOELECTRONIC MODULE PACKAGE

MODULE WITH TRANSMIT OPTICAL SUBASSEMBLY AND RECEIVE OPTICAL SUBASS...

MODE CONVERTER AND METHOD OF FABRICATING THEREOF

COPACKAGING OF ASIC AND SILICON PHOTONICS

OPTOELECTRONIC DEVICE

OPTOELECTRONIC MODULE PACKAGE

MODULE WITH TRANSMIT OPTICAL SUBASSEMBLY AND RECEIVE OPTICAL SUBASS...

COPACKAGING OF ASIC AND SILICON PHOTONICS

INTERPOSER BEAM EXPANDER CHIP