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Gerald K. Fehr
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Cupertino, CA, US
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last 30 patents
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Patent Grant
IC packages with diamond substrate thermal conductor
Patent number
6,498,394
Issue date
Dec 24, 2002
OSE USA
Gerald K. Fehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for encapsulating IC packages with diamond substrate
Patent number
6,058,602
Issue date
May 9, 2000
Integrated Packaging Assembly Corporation
Gerald K. Fehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for encapsulating IC packages with diamond substrate ther...
Patent number
5,859,477
Issue date
Jan 12, 1999
International Packaging and Assembly Corporation
Gerald K. Fehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming encapsulated IC packages
Patent number
5,682,673
Issue date
Nov 4, 1997
IPAC, Inc.
Gerald K. Fehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal semiconductor package with an external plastic seal
Patent number
5,491,110
Issue date
Feb 13, 1996
Integrated Packaging Assembly Corporation
Gerald K. Fehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal semiconductor package with an external plastic seal
Patent number
5,436,407
Issue date
Jul 25, 1995
Integrated Packaging Assembly Corporation
Gerald K. Fehr
H01 - BASIC ELECTRIC ELEMENTS