Claims
- 1. A combination heat slug for a plastic encapsulated integrated circuit (IC) package comprising:a diamond substrate; and a metal heat slug having appendages for supporting and positioning the combination heat slug in a lower cavity of an encapsulation mold; wherein the diamond substrate is bonded to the metal heat slug.
CROSS-REFERENCE TO RELATED DOCUMENTS
The present patent application is a divisional patent application of patent application Ser. No. 09/157,750 filed on Sep. 21, 1998, issued May 9, 2000 as Pat. No. 6,058,602 which is a divisional patent application of patent application Ser. No. 08/918,784 filed on Aug. 25, 1997, issued Jan. 12, 1999 as Pat. No. 5,859,477 which is a continuation of Ser. No. 08/500,353 filed Jul. 10, 1995 abandoned. Priority is claimed to prior applications and the prior applications are incorporated herein in their entirety by reference.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5874775 |
Shiomi et al. |
Feb 1999 |
A |
Continuations (1)
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Number |
Date |
Country |
Parent |
08/500353 |
Jul 1995 |
US |
Child |
08/918784 |
|
US |