Gerald Ofner

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 11,302,668
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 10,903,166
- Issue date Jan 26, 2021
- Intel IP Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 10,566,309
- Issue date Feb 18, 2020
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having a passive microelectronic device dis...
- Patent number 10,522,454
- Issue date Dec 31, 2019
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical system (MEMS) on application specific integr...
- Patent number 10,301,176
- Issue date May 28, 2019
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flexible band wearable electronic device
- Patent number 10,228,725
- Issue date Mar 12, 2019
- Intel IP Corporation
- Sven Albers
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Package-on-package stacked microelectronic structures
- Patent number 10,211,182
- Issue date Feb 19, 2019
- Intel IP Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 10,157,869
- Issue date Dec 18, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical system (MEMS) on application specific integr...
- Patent number 10,150,668
- Issue date Dec 11, 2018
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic package having a passive microelectronic device dis...
- Patent number 9,997,444
- Issue date Jun 12, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive electrical devices with a polymer carrier
- Patent number 9,888,577
- Issue date Feb 6, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and method for manufacturing a chip arrangement
- Patent number 9,856,136
- Issue date Jan 2, 2018
- INTEL DEUTSCHLAND GMBH
- Thorsten Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) on application specific integr...
- Patent number 9,663,353
- Issue date May 30, 2017
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress buffer layer for integrated microelectromechanical systems (...
- Patent number 9,550,670
- Issue date Jan 24, 2017
- Intel IP Corporation
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid exposure for semiconductor devices
- Patent number 9,543,224
- Issue date Jan 10, 2017
- Intel IP Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 9,472,515
- Issue date Oct 18, 2016
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 9,385,105
- Issue date Jul 5, 2016
- INTEL DEUTSCHLAND GMBH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interposer, semiconductor device, and method for manufacturing...
- Patent number 9,263,376
- Issue date Feb 16, 2016
- INTEL DEUTSCHLAND GMBH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer for integrated microelectromechanical systems (...
- Patent number 9,056,763
- Issue date Jun 16, 2015
- Intel Corporation
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enhanced flip chip package
- Patent number 9,059,304
- Issue date Jun 16, 2015
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked fan-out semiconductor chip
- Patent number 8,878,360
- Issue date Nov 4, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairable semiconductor device and method
- Patent number 8,754,522
- Issue date Jun 17, 2014
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with encapsulant embedding semiconduc...
- Patent number 8,741,690
- Issue date Jun 3, 2014
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced flip chip package
- Patent number 8,716,859
- Issue date May 6, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with encapsulant embedding semiconduc...
- Patent number 8,183,696
- Issue date May 22, 2012
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairable semiconductor device and method
- Patent number 8,076,180
- Issue date Dec 13, 2011
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically alignable integrated circuit device
- Patent number 7,994,608
- Issue date Aug 9, 2011
- Infineon Technologies AG
- Ai Min Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a universal semiconductor housing with precross...
- Patent number 7,517,722
- Issue date Apr 14, 2009
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE
- Publication number 20230411254
- Publication date Dec 21, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat Lead Package Formation Method
- Publication number 20210043603
- Publication date Feb 11, 2021
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
- Publication number 20200203310
- Publication date Jun 25, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20190363052
- Publication date Nov 28, 2019
- Intel IP Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DIS...
- Publication number 20180286799
- Publication date Oct 4, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...
- Publication number 20180186627
- Publication date Jul 5, 2018
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE
- Publication number 20180092443
- Publication date Apr 5, 2018
- Sven Albers
- G01 - MEASURING TESTING
Information Patent Application
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
- Publication number 20180096966
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE
- Publication number 20180095426
- Publication date Apr 5, 2018
- Sven Albers
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Package with vertical interconnect between carrier and clip
- Publication number 20170317016
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...
- Publication number 20170217766
- Publication date Aug 3, 2017
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic component and methods of manufacturing the same
- Publication number 20170178993
- Publication date Jun 22, 2017
- Infineon Technologies AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20170103956
- Publication date Apr 13, 2017
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DIS...
- Publication number 20160358848
- Publication date Dec 8, 2016
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES
- Publication number 20160260689
- Publication date Sep 8, 2016
- Intel IP Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...
- Publication number 20160200566
- Publication date Jul 14, 2016
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PASSIVE ELECTRICAL DEVICES WITH A POLYMER CARRIER
- Publication number 20150282308
- Publication date Oct 1, 2015
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...
- Publication number 20150266728
- Publication date Sep 24, 2015
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20150262866
- Publication date Sep 17, 2015
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...
- Publication number 20150091167
- Publication date Apr 2, 2015
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20150028478
- Publication date Jan 29, 2015
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140361387
- Publication date Dec 11, 2014
- Thorsten Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...
- Publication number 20140306355
- Publication date Oct 16, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED FLIP CHIP PACKAGE
- Publication number 20140138827
- Publication date May 22, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FAN-OUT SEMICONDUCTOR CHIP
- Publication number 20140015131
- Publication date Jan 16, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CTE ADAPTION IN A SEMICONDUCTOR PACKAGE
- Publication number 20130328191
- Publication date Dec 12, 2013
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Flip Chip Package
- Publication number 20130175686
- Publication date Jul 11, 2013
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device with Encapsulant Embedding Semiconduc...
- Publication number 20120208319
- Publication date Aug 16, 2012
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIRABLE SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20120038063
- Publication date Feb 16, 2012
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20110291274
- Publication date Dec 1, 2011
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS

Gerald Ofner

Person

Patents Grantslast 30 patents

Flat lead package formation method

Multi-purpose non-linear semiconductor package assembly line

Integrated circuit packages

Package with vertical interconnect between carrier and clip

Multi-purpose non-linear semiconductor package assembly line

Microelectronic package having a passive microelectronic device dis...

Microelectromechanical system (MEMS) on application specific integr...

Flexible band wearable electronic device

Package-on-package stacked microelectronic structures

Integrated circuit package

Microelectromechanical system (MEMS) on application specific integr...

Microelectronic package having a passive microelectronic device dis...

Passive electrical devices with a polymer carrier

Chip arrangement and method for manufacturing a chip arrangement

Microelectromechanical system (MEMS) on application specific integr...

Stress buffer layer for integrated microelectromechanical systems (...

Hybrid exposure for semiconductor devices

Integrated circuit package

Semiconductor devices

Chip interposer, semiconductor device, and method for manufacturing...

Stress buffer layer for integrated microelectromechanical systems (...

Enhanced flip chip package

Stacked fan-out semiconductor chip

Repairable semiconductor device and method

Packaged semiconductor device with encapsulant embedding semiconduc...

Enhanced flip chip package

Packaged semiconductor device with encapsulant embedding semiconduc...

Repairable semiconductor device and method

Magnetically alignable integrated circuit device

Method of producing a universal semiconductor housing with precross...

Patents Applicationslast 30 patents

MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE

Flat Lead Package Formation Method

Multi-Purpose Non-Linear Semiconductor Package Assembly Line

INTEGRATED CIRCUIT PACKAGES

MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DIS...

MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...

FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE

Multi-Purpose Non-Linear Semiconductor Package Assembly Line

FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE

Package with vertical interconnect between carrier and clip

MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...

Electronic component and methods of manufacturing the same

INTEGRATED CIRCUIT PACKAGE

MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DIS...

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...

PASSIVE ELECTRICAL DEVICES WITH A POLYMER CARRIER

STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...

INTEGRATED CIRCUIT PACKAGE

STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...

SEMICONDUCTOR DEVICES

CHIP ARRANGEMENT AND METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...

ENHANCED FLIP CHIP PACKAGE

STACKED FAN-OUT SEMICONDUCTOR CHIP

CTE ADAPTION IN A SEMICONDUCTOR PACKAGE

Enhanced Flip Chip Package

Packaged Semiconductor Device with Encapsulant Embedding Semiconduc...

REPAIRABLE SEMICONDUCTOR DEVICE AND METHOD

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE