Gerald Walter Jones

Person

Johnson City, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure
- Patent number 6,887,779
- Issue date May 3, 2005
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a multi-layered interconnect structure
- Patent number 6,829,823
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Francis J. Downes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of fabricating a circuitized structure
- Patent number 6,739,048
- Issue date May 25, 2004
- International Business Machines Corporation
- Gerald Walter Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit structure
- Patent number 6,720,502
- Issue date Apr 13, 2004
- International Business Machine Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized structures produced by the methods of electroless plating
- Patent number 6,680,440
- Issue date Jan 20, 2004
- International Business Machines Corporation
- David John Russell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board structure with z-axis interconnections
- Patent number 6,593,534
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Gerald W. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of uniformly depositing seed and a conductor and the resulta...
- Patent number 6,447,914
- Issue date Sep 10, 2002
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preventing adhesive bleed onto surfaces
- Patent number 6,420,253
- Issue date Jul 16, 2002
- International Business Machines Corporation
- Bernd K. Appelt
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods for selectively filling apertures
- Patent number 6,376,158
- Issue date Apr 23, 2002
- International Business Machines Corporation
- Gerald Walter Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with high density interconnect layer
- Patent number 6,373,717
- Issue date Apr 16, 2002
- International Business Machines Corporation
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for preventing adhesive bleed onto surfaces
- Patent number 6,252,307
- Issue date Jun 26, 2001
- International Business Machines Corporation
- Bernd K. Appelt
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of uniformly depositing seed and a conductor and the resulta...
- Patent number 6,136,513
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated manufacturing packaging process
- Patent number 6,131,279
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Gerald Walter Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist develop and strip solvent compositions and method for t...
- Patent number 6,127,097
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Nageshwer Rao Bantu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods of selectively filling apertures
- Patent number 6,066,889
- Issue date May 23, 2000
- International Business Machines Corporation
- Gerald Walter Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for tenting PTH's with PID dry film
- Patent number 6,027,858
- Issue date Feb 22, 2000
- International Business Machines Corporation
- Gerald Walter Jones
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Organic electronic package and method of applying palladium-tin see...
- Patent number 6,025,057
- Issue date Feb 15, 2000
- International Business Machines Corporation
- Anastasios Peter Angelopoulos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing seed deposition in electroless plating
- Patent number 5,997,997
- Issue date Dec 7, 1999
- International Business Machines Corp.
- Anastasios Peter Angelopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing seed deposition in electroless plating
- Patent number 5,935,652
- Issue date Aug 10, 1999
- International Business Machines Corp.
- Anastasios Peter Angelopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of preparing a substrate surface for conformal plating
- Patent number 5,922,517
- Issue date Jul 13, 1999
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of preparing a substrate surface for conformal plating
- Patent number 5,905,018
- Issue date May 18, 1999
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Organic electronic package and method of applying palladium-tin see...
- Patent number 5,866,237
- Issue date Feb 2, 1999
- International Business Machines Corporation
- Anastasios Peter Angelopoulos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density template: materials and processes for the application...
- Patent number 5,789,121
- Issue date Aug 4, 1998
- International Business Machines Corporation
- Douglas Adam Cywar
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of making circuitized substrate
- Patent number 5,599,747
- Issue date Feb 4, 1997
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pattern template: materials and processes for the appl...
- Patent number 5,460,921
- Issue date Oct 24, 1995
- International Business Machines Corporation
- Douglas A. Cywar
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photoresist develop and strip solvent compositions and method for t...
- Patent number 5,268,260
- Issue date Dec 7, 1993
- International Business Machines Corporation
- Nageshwer R. Bantu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Plasma conditioning of a substrate for electroless plating
- Patent number 4,956,197
- Issue date Sep 11, 1990
- International Business Machines Corporation
- Suryadevara V. Babu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for visual inspection of multilayer printed circuit boards
- Patent number 4,697,923
- Issue date Oct 6, 1987
- IBM Corporation
- Gerald W. Jones
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit structure
- Publication number 20040099939
- Publication date May 27, 2004
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board structure with z-axis interconnections
- Publication number 20020131229
- Publication date Sep 19, 2002
- International Business Machines Corporation
- Gerald W. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package with high density interconnect layer
- Publication number 20020085364
- Publication date Jul 4, 2002
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FABRICATING A CIRCUITZED STRUCTURE
- Publication number 20020078562
- Publication date Jun 27, 2002
- Gerald Walter Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for preventing adhesive bleed onto surfaces
- Publication number 20010028117
- Publication date Oct 11, 2001
- International Business Machines Corporation
- Bernd K. Appelt
- B82 - NANO-TECHNOLOGY

Gerald Walter Jones

Person

Patents Grantslast 30 patents

Integrated circuit structure

Method of making a multi-layered interconnect structure

Process of fabricating a circuitized structure

Integrated circuit structure

Circuitized structures produced by the methods of electroless plating

Printed wiring board structure with z-axis interconnections

Method of uniformly depositing seed and a conductor and the resulta...

Method for preventing adhesive bleed onto surfaces

Methods for selectively filling apertures

Electronic package with high density interconnect layer

Structure for preventing adhesive bleed onto surfaces

Method of uniformly depositing seed and a conductor and the resulta...

Integrated manufacturing packaging process

Photoresist develop and strip solvent compositions and method for t...

Methods of selectively filling apertures

Process for tenting PTH's with PID dry film

Organic electronic package and method of applying palladium-tin see...

Method for reducing seed deposition in electroless plating

Method for reducing seed deposition in electroless plating

Method of preparing a substrate surface for conformal plating

Method of preparing a substrate surface for conformal plating

Organic electronic package and method of applying palladium-tin see...

High density template: materials and processes for the application...

Method of making circuitized substrate

High density pattern template: materials and processes for the appl...

Photoresist develop and strip solvent compositions and method for t...

Plasma conditioning of a substrate for electroless plating

Method for visual inspection of multilayer printed circuit boards

Patents Applicationslast 30 patents

Integrated circuit structure

Printed wiring board structure with z-axis interconnections

Electronic package with high density interconnect layer

PROCESS OF FABRICATING A CIRCUITZED STRUCTURE

Method and structure for preventing adhesive bleed onto surfaces