Gerald Weis

Person

St. Marein im Murztal, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Component carrier with cavity accommodating at least part of driven...
- Patent number 12,112,888
- Issue date Oct 8, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising embedded magnet stack
- Patent number 11,889,629
- Issue date Jan 30, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with connected component carrier and fluid coolin...
- Patent number 11,889,622
- Issue date Jan 30, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat removal mechanism for stack-based electronic device with proce...
- Patent number 11,450,587
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising embedded inductor with an inlay
- Patent number 11,398,334
- Issue date Jul 26, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact laminated component carrier with front end chip and impedan...
- Patent number 11,394,105
- Issue date Jul 19, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier connected with a separate tilted component carrie...
- Patent number 11,178,772
- Issue date Nov 16, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier structures connected by cooperating magnet struct...
- Patent number 10,998,672
- Issue date May 4, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and electronic system with impedance matched in...
- Patent number 10,991,674
- Issue date Apr 27, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with transistor components arranged side by side
- Patent number 10,973,113
- Issue date Apr 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformed layer for short electric connection between structures of...
- Patent number 10,410,963
- Issue date Sep 10, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient heat removal from component carrier with embedded diode
- Patent number 10,332,818
- Issue date Jun 25, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Connection system for electronic components
- Patent number 9,698,130
- Issue date Jul 4, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN
- Publication number 20250038117
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald WEIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package having component carrier with cavity and electronic compone...
- Publication number 20240113037
- Publication date Apr 4, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device With Connected Component Carrier and Fluid Coolin...
- Publication number 20240114656
- Publication date Apr 4, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inductor Inlay for a Component Carrier and a Method of Manufacturin...
- Publication number 20230298808
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Cavity Accommodating at Least Part of Driven...
- Publication number 20220254554
- Publication date Aug 11, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Connected Component Carrier and Fluid Coolin...
- Publication number 20220256692
- Publication date Aug 11, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Removal Mechanism for Stack-based Electronic Device With Proce...
- Publication number 20210280490
- Publication date Sep 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substantially Annular Magnetic Member With Magnetic Particles in No...
- Publication number 20210241952
- Publication date Aug 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compact Laminated Component Carrier With Front End Chip and Impedan...
- Publication number 20210194111
- Publication date Jun 24, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Component Carrier Structures Connected by Cooperating Magnet Struct...
- Publication number 20200119490
- Publication date Apr 16, 2020
- AT&S Austria Technologie & Systemechnik Aktiengeschaft
- Gerald Weis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Comprising Embedded Inductor with an Inlay
- Publication number 20200035396
- Publication date Jan 30, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assembly and Electronic System With Impedance Matched In...
- Publication number 20190304952
- Publication date Oct 3, 2019
- AT&S Austria Technologie & Systemtecknik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Connected With a Separate Tilted Component Carrie...
- Publication number 20190306988
- Publication date Oct 3, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Transistor Components Arranged Side By Side
- Publication number 20190132983
- Publication date May 2, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Heat Removal From Component Carrier With Embedded Diode
- Publication number 20180211899
- Publication date Jul 26, 2018
- Mike MORIANZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION SYSTEM FOR ELECTRONIC COMPONENTS
- Publication number 20170092630
- Publication date Mar 30, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS

Gerald Weis

Person

Patents Grantslast 30 patents

Component carrier with cavity accommodating at least part of driven...

Component carrier comprising embedded magnet stack

Electronic device with connected component carrier and fluid coolin...

Heat removal mechanism for stack-based electronic device with proce...

Component carrier comprising embedded inductor with an inlay

Compact laminated component carrier with front end chip and impedan...

Component carrier connected with a separate tilted component carrie...

Component carrier structures connected by cooperating magnet struct...

Electronic assembly and electronic system with impedance matched in...

Component carrier with transistor components arranged side by side

Deformed layer for short electric connection between structures of...

Efficient heat removal from component carrier with embedded diode

Connection system for electronic components

Patents Applicationslast 30 patents

IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN

Package having component carrier with cavity and electronic compone...

Electronic Device With Connected Component Carrier and Fluid Coolin...

Inductor Inlay for a Component Carrier and a Method of Manufacturin...

Component Carrier With Cavity Accommodating at Least Part of Driven...

Electronic Device with Connected Component Carrier and Fluid Coolin...

Heat Removal Mechanism for Stack-based Electronic Device With Proce...

Substantially Annular Magnetic Member With Magnetic Particles in No...

Compact Laminated Component Carrier With Front End Chip and Impedan...

Component Carrier Structures Connected by Cooperating Magnet Struct...

Component Carrier Comprising Embedded Inductor with an Inlay

Electronic Assembly and Electronic System With Impedance Matched In...

Component Carrier Connected With a Separate Tilted Component Carrie...

Component Carrier With Transistor Components Arranged Side By Side

Efficient Heat Removal From Component Carrier With Embedded Diode

CONNECTION SYSTEM FOR ELECTRONIC COMPONENTS