Inductor Inlay for a Component Carrier and a Method of Manufacturing the Same

Abstract

An inductor inlay, a component carrier, and methods for manufacturing the inductor inlay and the component carrier. The inductor inlay has a magnetic layer stack of interconnected magnetic layers and an electrically conductive structure embedded in the magnetic stack. The electrically conductive structure is configured as an inductor element with a coil-like shape. A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure and the inductor inlay with the magnetic layer stack with interconnected magnetic layers and the electrically conductive structure embedded in the magnetic layer stack. Methods for manufacturing the inductor inlay and component carrier are further described.

Description

Claims

1. An inductor inlay, comprising: a magnetic layer stack, comprising a plurality of interconnected magnetic layers; andan electrically conductive structure embedded in the magnetic layer stack, wherein the electrically conductive structure is configured as an inductor element that comprises a coil-like shape.

2. The inductor inlay according to claim 1, wherein the magnetic layer stack comprises exactly two magnetic layers or exactly three magnetic layers.

3. The inductor inlay according to claim 1, wherein the inductor element is embedded horizontally in the magnetic layer stack, orwherein the inductor element is embedded vertically in the magnetic layer stack.

4. The inductor inlay according to claim 1, wherein at least one of the magnetic layers is partially or entirely dielectric; and/orwherein at least one of the magnetic layers comprises a magnetic matrix; and/orwherein the magnetic matrix comprises a dielectric material, in which magnetic particles are embedded, in particular wherein the metallic particles comprise at least one of the group consisting of ferrite, a 3d material, and a 4f material; and/orwherein the magnetic matrix continuously fills a volume around the inductor element; and/orwherein the magnetic matrix comprises a rigid solid and/or a paste; and/orwherein the magnetic matrix is electrically insulating; and/orwherein the relative magnetic permeability µr of the magnetic matrix is in a range from 1.1 to 500, in particular 2 to 150, more in particular 4 to 80; and/orwherein the magnetic matrix comprises at least one material of the group consisting of a ferromagnetic material, a ferrimagnetic material, a permanent magnetic material, a soft magnetic material, a ferrite, a metal oxide, a dielectric matrix, in particular a prepreg, with magnetic particles therein, and an alloy, in particular an iron alloy or alloyed silicon.

5. The inductor inlay according to claim 1, wherein the inductor element is meander-shaped and/or spiral-shaped.

6. The inductor inlay according to claim 1, wherein the inductor element comprises at least two terminal sections exposed with respect to the magnetic layers, in particular with respect to the magnetic layer stack.

7. The inductor inlay according to claim 6, wherein the at least two terminal sections have a larger vertical and/or larger horizontal extension than a central section of the inductor element that is located between said terminal sections.

8. The inductor inlay according to claim 1, wherein the inductor inlay further comprises: at least one electrically conductive via, being a blind via or a through-hole via, that extends at least partially through the magnetic layer stack, and that connects the inductor element to an exterior surface of the inductor inlay,wherein the at least one electrically conductive via is filled at least partially with electrically conductive material, orwherein the at least one electrically conductive via is a hollow lining which is filled at least partially with an electrically insulating material, in particular a resin.

9. A method of manufacturing an inductor inlay, the method comprising: stacking a plurality of magnetic layers to provide a magnetic layer stack, thereby: interconnecting the plurality of magnetic layers; andembedding an electrically conductive structure in the magnetic layer stack, wherein the electrically conductive structure is configured as an inductor element that comprises a coil-like shape.

10. The method according to claim 9, further comprising: forming a dielectric layer, in particular a photo-imageable layer;patterning the dielectric layer to form a patterned dielectric layer; andarranging, in particular plating, a metal in the patterned dielectric layer, thereby forming the inductor element.

11. The method according to claim 10, further comprising: forming a further dielectric layer on the patterned dielectric layer, thereby embedding the inductor element;patterning the further dielectric layer to expose a part of the embedded inductor element; andarranging, in particular plating, a further metal on the exposed part of the inductor element surface, thereby forming terminal sections for the inductor element.

12. The method according to claim 10, further comprising: arranging, in particular laminating, a first magnetic layer onto the inductor element surface, in particular removing the dielectric layer before arranging the first magnetic layer, and/orarranging, in particular laminating, a second magnetic layer onto a back-side surface of the inductor element, wherein the back-side surface is opposed to the inductor element surface.

13. The method according to claim 9, further comprising: providing a temporary carrier with a surface layer, in particular metal layer,arranging the dielectric layer on the surface layer, and wherein patterning the dielectric layer comprises: exposing the surface layer below the patterned dielectric layer; and/orfurther comprising: removing the temporary carrier with the surface layer before arranging the second magnetic layer on the back-side surface of the inductor element; and/orremoving the temporary carrier with the surface layer after arranging the first magnetic layer on the inductor element surface;in particular wherein the removing comprises or consists of at least one of the group which consists of grinding, releasing by UV treatment or laser treatment, etching, in particular dry etching.

14. A component carrier, wherein the component carrier comprises: a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; andan inductor inlay, wherein the inductor inlay is embedded in the stack, wherein the inductor inlay includes: a magnetic layer stack, comprising a plurality of interconnected magnetic layers; andan electrically conductive structure embedded in the magnetic layer stack, wherein the electrically conductive structure is configured as an inductor element that comprises a coil-like shape.

15. The component carrier according to claim 14, wherein the component carrier is configured as an integrated circuit, IC, substrate, wherein an IC substrate resembles an IC-sized high density PCB; and/orwherein at least one electrically conductive structure of the stack is electrically connected to the inductor element of the inductor inlay, in particular via the terminal sections; and/orwherein the inductor inlay is embedded in the stack, so that the directions of main extension of the inductor inlay are essentially parallel or essentially perpendicular to the directions of main extension of the component carrier.