Geraldine Tsui Yee Lin

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Tung Tau Est, HK

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package having a plurality of spaced apart pad p...
- Patent number 8,330,270
- Issue date Dec 11, 2012
- UTAC Hong Kong Limited
- Geraldine Tsui Yee Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity-type integrated circuit package
- Patent number 7,732,914
- Issue date Jun 8, 2010
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with partially exposed contact pads and...
- Patent number 7,411,289
- Issue date Aug 12, 2008
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and process for fabricating the same
- Patent number 7,091,581
- Issue date Aug 15, 2006
- ASAT Limited
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for dressing molded array package saw blade
- Patent number 6,903,304
- Issue date Jun 7, 2005
- Asat LTD
- Neil McLellan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR