Gerhard D. Wolf

Person

Dormagen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Moulded part and flexible film with a protected printed conductor,...
- Patent number 6,426,143
- Issue date Jul 30, 2002
- Bayer Aktiengesellschaft
- Jochen Voss
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for producing rigid and flexible circuits
- Patent number 5,935,405
- Issue date Aug 10, 1999
- Bayer Aktiengesellschaft
- Gerhard-Dieter Wolf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for producing metal-coated films in web form
- Patent number 5,888,372
- Issue date Mar 30, 1999
- Bayer Aktiengesellschaft
- Louis Bollens
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for through-hole plating of two-layer printed circuit board...
- Patent number 5,575,898
- Issue date Nov 19, 1996
- Bayer AG
- Gerhard-Dieter Wolf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for improving the adhesiveness of electrolessly deposited m...
- Patent number 5,436,034
- Issue date Jul 25, 1995
- Bayer Aktiengesellschaft
- Henning Giesecke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for through-hole plating of two-layer circuit boards and mu...
- Patent number 5,403,467
- Issue date Apr 4, 1995
- Bayer AG
- Friedrich Jonas
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Primer for the metallization of substrate surfaces
- Patent number 5,378,268
- Issue date Jan 3, 1995
- Bayer Aktiengesellschaft
- Gerhard D. Wolf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hydroprimer for metallising substrate surfaces
- Patent number 5,300,140
- Issue date Apr 5, 1994
- Bayer Aktiengesellschaft
- Gerhard-Dieter Wolf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formulation for the activation of substrate surfaces for currentles...
- Patent number 5,296,020
- Issue date Mar 22, 1994
- Bayer Aktiengesellschaft
- Gunther Reichert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making injection-moulded printed circuit boards
- Patent number 5,233,753
- Issue date Aug 10, 1993
- Bayer Aktiengesellschaft
- Gerhard D. Wolf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for metallizing substrate surfaces
- Patent number 5,200,272
- Issue date Apr 6, 1993
- Miles Inc.
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for improving the adherency of metallic coatings deposited...
- Patent number 5,182,135
- Issue date Jan 26, 1993
- Bayer Aktiengesellschaft
- Henning Giesecke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formulation of activating substrate surfaces for their electroless...
- Patent number 5,176,743
- Issue date Jan 5, 1993
- Bayer Aktiengesellschaft
- Gunther Reichert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing electrical conductor boards
- Patent number 4,913,768
- Issue date Apr 3, 1990
- Bayer Aktiengesellschaft
- Gerhard D. Wolf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for improving the adhesive strength of electrolessly deposi...
- Patent number 4,910,045
- Issue date Mar 20, 1990
- Bayer Aktiengesellschaft
- Henning Giesecke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible circuits
- Patent number 4,847,139
- Issue date Jul 11, 1989
- Bayer Aktiengesellschaft
- Gerhard D. Wolf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of improving the bond strength of electrolessly deposited me...
- Patent number 4,832,989
- Issue date May 23, 1989
- Bayer Aktiengesellschaft
- Henning Giesecke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for the production of printed circuit boards
- Patent number 4,830,714
- Issue date May 16, 1989
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallized membrane systems
- Patent number 4,804,475
- Issue date Feb 14, 1989
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for activating substrate surfaces for electroless metalliza...
- Patent number 4,764,401
- Issue date Aug 16, 1988
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for the partial metallization of substrate surfaces
- Patent number 4,753,821
- Issue date Jun 28, 1988
- Bayer Aktiengesellschaft
- Henning Giesecke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical printed circuit boards
- Patent number 4,728,560
- Issue date Mar 1, 1988
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for activating substrate surfaces for electroless metalliza...
- Patent number 4,661,384
- Issue date Apr 28, 1987
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semi-finished products for the manufacture of printed circuit boards
- Patent number 4,636,441
- Issue date Jan 13, 1987
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Organopalladium-II-complex compounds
- Patent number 4,622,411
- Issue date Nov 11, 1986
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reinforced composite comprising resin impregnated metallized polyar...
- Patent number 4,614,684
- Issue date Sep 30, 1986
- Bayer Aktiengesellschaft
- Harold Ebneth
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for activating substrates for electroless metallization
- Patent number 4,575,467
- Issue date Mar 11, 1986
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of metallized knitted net fabrics for protection against microw...
- Patent number 4,572,960
- Issue date Feb 25, 1986
- Bayer Aktiengesellschaft
- Harold Ebneth
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
Process for the adhesion-activation of polyamide substrates for ele...
- Patent number 4,568,571
- Issue date Feb 4, 1986
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for pretreating polyamide substrates for electroless metall...
- Patent number 4,554,183
- Issue date Nov 19, 1985
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Gerhard D. Wolf

Person

Patents Grantslast 30 patents

Moulded part and flexible film with a protected printed conductor,...

Process for producing rigid and flexible circuits

Process for producing metal-coated films in web form

Process for through-hole plating of two-layer printed circuit board...

Process for improving the adhesiveness of electrolessly deposited m...

Process for through-hole plating of two-layer circuit boards and mu...

Primer for the metallization of substrate surfaces

Hydroprimer for metallising substrate surfaces

Formulation for the activation of substrate surfaces for currentles...

Method of making injection-moulded printed circuit boards

Process for metallizing substrate surfaces

Process for improving the adherency of metallic coatings deposited...

Formulation of activating substrate surfaces for their electroless...

Process for producing electrical conductor boards

Process for improving the adhesive strength of electrolessly deposi...

Flexible circuits

Method of improving the bond strength of electrolessly deposited me...

Process for the production of printed circuit boards

Metallized membrane systems

Process for activating substrate surfaces for electroless metalliza...

Process for the partial metallization of substrate surfaces

Electrical printed circuit boards

Process for activating substrate surfaces for electroless metalliza...

Semi-finished products for the manufacture of printed circuit boards

Organopalladium-II-complex compounds

Reinforced composite comprising resin impregnated metallized polyar...

Process for activating substrates for electroless metallization

Use of metallized knitted net fabrics for protection against microw...

Process for the adhesion-activation of polyamide substrates for ele...

Process for pretreating polyamide substrates for electroless metall...