Gerhard Freydl

Person

Leoben-Hinterberg, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer-type component carrier and method of manufacturing the same
- Patent number 11,784,132
- Issue date Oct 10, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer-type component carrier and method of manufacturing the same
- Patent number 11,069,622
- Issue date Jul 20, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and composite assembly for processing or treating a pluralit...
- Patent number 9,288,911
- Issue date Mar 15, 2016
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerhard Freydl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting a plurality of elements of a circuit board
- Patent number 8,863,375
- Issue date Oct 21, 2014
- AT & S Austria Technologie & Sytemtechnik Aktiengesellschaft
- Christoph Thumser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for integrating an electronic component into a printed circu...
- Patent number 8,789,271
- Issue date Jul 29, 2014
- AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier with Surface Mounted Components Connected By High...
- Publication number 20230298987
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer-Type Component Carrier and Method of Manufacturing the Same
- Publication number 20210320068
- Publication date Oct 14, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer-Type Component Carrier and Method of Manufacturing the Same
- Publication number 20200303313
- Publication date Sep 24, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20150014021
- Publication date Jan 15, 2015
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Christoph Thumser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...
- Publication number 20140307403
- Publication date Oct 16, 2014
- Günther Weichslberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING MORE PARTICULARLY PROCESSING OR POPULATING, A...
- Publication number 20140008012
- Publication date Jan 9, 2014
- Gerhard Freydl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND COMPOSITE ASSEMBLY FOR PROCESSING OR TREATING A PLURALIT...
- Publication number 20130003325
- Publication date Jan 3, 2013
- Gerhard Freydl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRI...
- Publication number 20110069448
- Publication date Mar 24, 2011
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Gerhard Freydl

Person

Patents Grantslast 30 patents

Interposer-type component carrier and method of manufacturing the same

Interposer-type component carrier and method of manufacturing the same

Method and composite assembly for processing or treating a pluralit...

Method for connecting a plurality of elements of a circuit board

Method for integrating an electronic component into a printed circu...

Patents Applicationslast 30 patents

Component Carrier with Surface Mounted Components Connected By High...

Interposer-Type Component Carrier and Method of Manufacturing the Same

Interposer-Type Component Carrier and Method of Manufacturing the Same

PRINTED CIRCUIT BOARD

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...

METHOD FOR PRODUCING MORE PARTICULARLY PROCESSING OR POPULATING, A...

METHOD AND COMPOSITE ASSEMBLY FOR PROCESSING OR TREATING A PLURALIT...

METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRI...