Gerhard HAUBNER

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device including redistribution layer pad having a void
- Patent number 10,916,484
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier laminate with high frequency dielectric and thermomech...
- Patent number 10,607,911
- Issue date Mar 31, 2020
- Infineon Technologies AG
- Martin Richard Niessner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...
- Publication number 20250016918
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Martin Richard NIEßNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID
- Publication number 20180374769
- Publication date Dec 27, 2018
- INFINEON TECHNOLOGIES AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip carrier laminate with high frequency dielectric and thermomech...
- Publication number 20160211189
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Martin Richard NIESSNER
- H01 - BASIC ELECTRIC ELEMENTS