Gershon Akerling

Person

Culver City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a low mass foam electrical structure
- Patent number 11,056,760
- Issue date Jul 6, 2021
- Northrop Grumman Systems Corporation
- Steven J. Mass
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of making a low mass foam electrical structure
- Patent number 10,122,063
- Issue date Nov 6, 2018
- Northrop Grumman Systems Corporation
- Steven J. Mass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,960,204
- Issue date May 1, 2018
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,478,458
- Issue date Oct 25, 2016
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF transmission line disposed within a conductively plated cavity l...
- Patent number 9,293,800
- Issue date Mar 22, 2016
- Northrop Grumman Systems Corporation
- Steven J. Mass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging integrated circuit chips
- Patent number 7,135,779
- Issue date Nov 14, 2006
- Northrop Grumman Corporation
- James Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance vias for vertical IC packaging
- Patent number 6,936,913
- Issue date Aug 30, 2005
- Northrop Grumman Corporation
- Gershon Akerling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power chip scale package
- Patent number 6,768,189
- Issue date Jul 27, 2004
- Northrop Grumman Corporation
- James Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-to-board connection assembly and method therefor
- Patent number 6,219,254
- Issue date Apr 17, 2001
- TRW Inc.
- Gershon Akerling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming high frequency connections to high temperature s...
- Patent number 6,216,941
- Issue date Apr 17, 2001
- TRW Inc.
- Karen E. Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for parallel alignment of a chip to substrate
- Patent number 6,146,912
- Issue date Nov 14, 2000
- TRW Inc.
- Thomas S. Tighe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripline flexible cable to printed circuit board attachment system
- Patent number 6,055,722
- Issue date May 2, 2000
- TRW Inc.
- Thomas S. Tighe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of fabricating high frequency connections to high temperatu...
- Patent number 6,055,723
- Issue date May 2, 2000
- TRW Inc.
- Gershon Akerling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworkable microelectronic multi-chip module
- Patent number 6,050,476
- Issue date Apr 18, 2000
- TRW Inc.
- Karen E. Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworkable microelectronic multi-chip module
- Patent number 6,032,852
- Issue date Mar 7, 2000
- TRW Inc.
- Karen E. Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic flex cable connector
- Patent number 5,970,608
- Issue date Oct 26, 1999
- TRW Inc.
- Thomas S. Tighe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic flex cable connector
- Patent number 5,924,875
- Issue date Jul 20, 1999
- TRW Inc.
- Thomas S. Tighe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworkable microelectronic multi-chip module
- Patent number 5,920,464
- Issue date Jul 6, 1999
- TRW Inc.
- Karen E. Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A LOW MASS FOAM ELECTRICAL STRUCTURE
- Publication number 20190081381
- Publication date Mar 14, 2019
- Northrop Grumman Systems Corporation
- Steven J. Mass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE AND SEMICONDUCTOR PACKAGING
- Publication number 20170018597
- Publication date Jan 19, 2017
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A LOW MASS FOAM ELECTRICAL STRUCTURE
- Publication number 20160149286
- Publication date May 26, 2016
- Northrop Grumman Systems Corporation
- Steven J. Mass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE AND SEMICONDUCTOR PACKAGING
- Publication number 20140254979
- Publication date Sep 11, 2014
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW MASS FOAM ELECTRICAL STRUCTURE
- Publication number 20120152454
- Publication date Jun 21, 2012
- Steven J. Mass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for packaging integrated circuit chips
- Publication number 20040248342
- Publication date Dec 9, 2004
- Northrop Grumman Corporation
- James Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low thermal expansion adhesives and encapsulants for cryogenic and...
- Publication number 20040214377
- Publication date Oct 28, 2004
- John A. Starkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance vias for vertical IC packaging
- Publication number 20040113264
- Publication date Jun 17, 2004
- Gershon Akerling
- H01 - BASIC ELECTRIC ELEMENTS

Gershon Akerling

Person

Patents Grantslast 30 patents

Method of making a low mass foam electrical structure

Method of making a low mass foam electrical structure

Waveguide and semiconductor packaging

Waveguide and semiconductor packaging

RF transmission line disposed within a conductively plated cavity l...

Method for packaging integrated circuit chips

High performance vias for vertical IC packaging

High power chip scale package

Chip-to-board connection assembly and method therefor

Method for forming high frequency connections to high temperature s...

Method for parallel alignment of a chip to substrate

Stripline flexible cable to printed circuit board attachment system

Process of fabricating high frequency connections to high temperatu...

Reworkable microelectronic multi-chip module

Reworkable microelectronic multi-chip module

Cryogenic flex cable connector

Cryogenic flex cable connector

Reworkable microelectronic multi-chip module

Patents Applicationslast 30 patents

METHOD OF MAKING A LOW MASS FOAM ELECTRICAL STRUCTURE

WAVEGUIDE AND SEMICONDUCTOR PACKAGING

METHOD OF MAKING A LOW MASS FOAM ELECTRICAL STRUCTURE

WAVEGUIDE AND SEMICONDUCTOR PACKAGING

LOW MASS FOAM ELECTRICAL STRUCTURE

Method for packaging integrated circuit chips

Low thermal expansion adhesives and encapsulants for cryogenic and...

High performance vias for vertical IC packaging