Gil Provent

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Coublevie, FR

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating electrical bonding pads on a wafer
- Patent number 8,227,332
- Issue date Jul 24, 2012
- STMicroelectronics (Grenoble) SAS
- Romain Coffy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating electrical bonding pads on a wafer
- Patent number 8,148,258
- Issue date Apr 3, 2012
- STMicroelectronics (Grenoble) SAS
- Romain Coffy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT CHIP PROVIDED WI...
- Publication number 20150022987
- Publication date Jan 22, 2015
- STMicroelectronics (Crolles 2) SAS
- Sebastien Gallois-Garreignot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING ELECTRICAL BONDING PADS ON A WAFER
- Publication number 20110151657
- Publication date Jun 23, 2011
- STMicroelectronics (Grenoble) SAS
- Romain Coffy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING ELECTRICAL BONDING PADS ON A WAFER
- Publication number 20090134514
- Publication date May 28, 2009
- STMicroelectronics (Grenoble) SAS
- Romain Coffy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR